Housing, electronic device and fingerprint identification method for fingerprint identification

A technology for fingerprint identification and electronic equipment, which is applied in the directions of acquiring/arranging fingerprints/palmprints, character and pattern recognition, matching and classification, etc. It can solve problems such as unfavorable internal structure design of electronic equipment, decreased waterproof and dustproof performance, and increased processes , to achieve the effect of facilitating internal structure design, improving waterproof and dustproof performance, and reducing production costs

Inactive Publication Date: 2019-02-15
HUIZHOU TCL MOBILE COMM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the long-term research and development process, the inventors of the present application found that in the above-mentioned technologies, when opening through holes in the cover plate, middle frame or rear shell, the process will be increased, resulting in an increase in cost and a decrease in product yield.
At the same time, due to the existence of through holes, the overall strength of electronic equipment will also decrease, and its waterproof and dustproof performance will decrease.
At the same time, due to the limitation of the position of the through hole, the fingerprint module can only be placed in a specific position, which is not conducive to the internal structure design of the electronic device

Method used

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  • Housing, electronic device and fingerprint identification method for fingerprint identification
  • Housing, electronic device and fingerprint identification method for fingerprint identification
  • Housing, electronic device and fingerprint identification method for fingerprint identification

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illu...

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Abstract

The present application discloses a housing for fingerprint identification, an electronic device and a fingerprint identification method. An electrode region disposed on the cover plate, the electroderegion including a plurality of first electrodes and a plurality of second electrodes, the first electrodes intersecting the second electrodes perpendicularly to form a plurality of capacitive nodes,wherein the capacitive nodes generate a capacitive value when a finger performs a touch operation on the electrode region. In the above manner, the invention can avoid opening holes in the shell of the electronic equipment, the process is simple and easy to realize, the waterproof and dust-proof performance can be improved, and the shell is more beautiful in appearance.

Description

technical field [0001] The present application relates to the technical field of fingerprint identification, in particular to a casing for fingerprint identification, electronic equipment and a fingerprint identification method. Background technique [0002] At present, the fingerprint identification module of electronic equipment is usually installed on the cover, side or rear. Among them, when the fingerprint identification module is front-mounted, a through hole needs to be opened at the cover of the electronic equipment, while side or rear installation requires Open holes in the middle frame or rear case. [0003] In the long-term research and development process, the inventors of the present application found that in the above-mentioned technologies, opening through holes in the cover plate, middle frame or rear case will increase the process, increase the cost, and easily lead to a decrease in product yield. At the same time, due to the existence of through holes, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1365G06V40/1306
Inventor 陈平罗亮
Owner HUIZHOU TCL MOBILE COMM CO LTD
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