Sensor packaging structure convenient to detach, and packaging method

Abstract

The invention provides a sensor packaging structure convenient to detach, a packaging method and smart clothing. The sensor packaging structure comprises: a sensor packaging unit, a molding fabric layer for covering the sensor packaging unit, a first conductive buckle made of a metal material and used for fixedly connecting the sensor packaging unit with the molding fabric layer, and a signal outgoing line; the sensor packaging unit comprises a sensor and a double-layer shielding shell arranged to completely cover the sensor; one end of the signal outgoing line is connected to a wiring pin ofthe sensor, the other end of the signal outgoing line is connected to the first conductive buckle, a first positioning hole for enabling the first conductive buckle structure to pass through is formedin the double-layer shielding shell, and the first conductive buckle is non-electrically connected with the double-layer shielding shell by adhesion. The above-mentioned sensor packaging structure has a good packaging effect, not only improves the signal shielding effect and the signal acquisition accuracy, but also facilitates quick disassembly and installation, and the sensor packaging structure is recycled and reused, thereby having a high utilization rate and a wide application range.

Description

technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a sensor packaging structure and packaging method that are easy to disassemble. Background technique [0002] At present, there are various types of sensors, which are widely used in various fields. The key to the authenticity and accuracy of the sensor's collected signals lies in its anti-interference ability to external interference signals. Various sensor shielding structures have appeared at present, such as the publication number is CN2874423Y, and the patent name is "PVDF piezoelectric film rubber-based packaging strain gauge shielded by metal shielding layer". The electromagnetic interference is shielded by setting a metal shielding net outside the substrate. Improve the anti-interference performance of the sensor. Although this technology has a certain degree of shielding setting, its disadvantage is that the shielding layer does not cover the sensor wiring riv...

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Problems solved by technology

[0003] The present invention proposes an easy-to-disassemble sensor packaging structure and its packaging method. The sensor packaging structure has a simple structure, is easy to quickly disassemble and has a good shielding effect, and solves the problem that the existing sensor packaging structure cannot be disassembled, the utilization rate is low, and the shielding effect is low. bad question

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