7results about How to "Improve package stability" patented technology

The application provides an ETSSOP20-10L lead frame and a power module. The middle part of the packaging unit of the lead frame has a base island. One side has a first pin, a second pin, a third pin, a fourth pin, a fifth pin and a sixth pin. The other side has a seventh pin, an eighth pin, a ninth pin and a tenth pin. The seventh pin, the eighth pin and the ninth pin are connected to the base island, and the remaining pins are arranged at intervals from the base island. The width of the seventh pin, the eighth pin and the ninth pin is greater than the width of the remaining pins. The distance between the first pin and the second pin, the distance between the fifth pin and the sixth pin and the distance between the tenth pin and the ninth pin are all greater than the distance between the remaining adjacent pins. The power module is packaged by the ETSSOP20-10L lead frame. The scheme of the application omits and widens some pins, meets the application requirements and ensures the heat dissipation effect, and reasonably arranges the position relationship between the base island and the specific pins to meet the dielectric requirements.

The invention discloses a display panel and a display device. The display panel comprises a substrate, a first electrode and an isolation structure, the first electrode is arranged on one side of the substrate; the isolation structure is arranged on the side, away from the substrate, of the first electrode, an isolation opening is defined by the isolation structure, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the first electrode on the substrate are at least partially overlapped, and the isolation structure comprises a first sub-layer and a second sub-layer located on the side, away from the substrate, of the first sub-layer; the orthographic projection of the first sub-layer on the substrate is located in the orthographic projection of the second sub-layer on the substrate; wherein the second sub-layer comprises a main body part and a lap joint part which are connected with each other, the main body part is arranged on one side, deviating from the substrate, of the first sub-layer, the lap joint part protrudes out of the first sub-layer relative to the main body part in the direction deviating from the isolation opening, and at least part of the boundary of the first orthographic projection of the first electrode on the substrate is located in the orthographic projection of the lap joint part on the substrate. The reliability and the use effect of the display panel can be improved.

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.

The invention discloses automatic packaging equipment for optical protective film production, and relates to the technical field of optical protective film packaging, and the automatic packaging equipment comprises an optical protective film limiting conveying module, a packaging module and an auxiliary overturning module; the optical protective film limiting conveying module comprises a base, a linear motion module is installed at the upper end of the base, a main drive turnover mechanism is installed above the output end of the linear motion module, and limiting assemblies are symmetrically installed on the left side and the right side of the main drive turnover mechanism. The auxiliary turnover module comprises a mounting frame, an auxiliary turnover mechanism and a control assembly are mounted on the mounting frame, and the control assembly is used for driving a turnover roller set on the auxiliary turnover mechanism to be attached to the side portion of the optical protective film roll. According to the automatic packaging equipment for optical protective film production, through limiting, main and auxiliary cooperative overturning and automatic winding packaging, high-precision, lossless, efficient and full-automatic packaging of optical film rolls of different specifications is achieved, slipping, eccentricity and wrinkles are effectively prevented, and the clean and flat packaging requirements of high-end optical materials are met.

The invention relates to the technical field of compound fertilizers, and particularly discloses a production method of a biological organic-inorganic compound fertilizer based on humic acid. According to the invention, 10-20 parts of humic acid, 10-15 parts of urea, 10-16 parts of potassium dihydrogen phosphate, 5-10 parts of potassium sulfate, 1-2 parts of trace elements, 10-15 parts of decomposed cow dung, 10-15 parts of decomposed peanut shell, 1-5 parts of a composite microbial agent, 1-2 parts of an auxiliary agent and 20-25 parts of a filler are blended and granulated and then are wrapped by a coating liquid, and synergistic interaction of fertilizer efficiency is realized through advantage complementation of different types of fertilizers. The defects that humic acid is prone to oxidation, caking and loss are overcome, the wrapping stability is enhanced through chemical combination, and the protection effect is more thorough and more durable.

This invention relates to a copper-doped anhydrous guanine crystal sheet, its preparation method, and its application, belonging to the field of spectral camouflage and stealth materials. Specifically, it relates to a method for synthesizing copper-doped guanine crystals. In this invention, copper-doped chlorophyll is used as the functional molecule, and organic small molecule uric acid and high molecular weight polymer (P(VP-co-VA)) are used as additives to regulate the synthesis of green guanine microsheets that preferentially expose the (100) crystal facet with the optimal refractive index. The guanine crystal microsheets prepared by this invention have high reflectivity and specific visible light absorption in the 200-2500 nm range, while also having the effect of weakening polarized light. Embedding the pigment molecules into the crystal lattice achieves a good stabilizing effect on copper-doped chlorophyll, making it a novel camouflage material with high reflectivity and excellent stability.

The composite substrate packaging structure comprises a composite substrate body, an LED patch lamp bead assembly and a pressing assembly, a plurality of placing grooves are formed in the upper end of the composite substrate body, and positioning grooves are formed in the upper sides of the opposite inner walls of the placing grooves; the LED patch lamp bead assembly comprises a chip board arranged in the containing groove, a lamp bead body arranged in the middle of the upper end of the chip board and a positioning board fixed to the upper side of the opposite outer wall of the chip board, and the positioning board is connected with the positioning groove in a clamped mode. The pressing assembly comprises a rotating shaft vertically arranged at the upper end of the composite substrate body and located on the outer side of the positioning groove, and a rotating plate vertically arranged at the upper end of the rotating shaft. According to the composite substrate packaging structure of the LED SMD lamp bead, the chip board is positioned and placed through the positioning groove and the positioning plate, and the chip board is pressed and fixed through the pressing assembly, so that the packaging stability of the chip board is enhanced, and the phenomenon of pseudo soldering of the chip board caused by unstable welding of a welding spot after the chip board is packaged is prevented.