12results about How to "Improve package stability" patented technology

The application provides an ETSSOP20-10L lead frame and a power module. The middle part of the packaging unit of the lead frame has a base island. One side has a first pin, a second pin, a third pin, a fourth pin, a fifth pin and a sixth pin. The other side has a seventh pin, an eighth pin, a ninth pin and a tenth pin. The seventh pin, the eighth pin and the ninth pin are connected to the base island, and the remaining pins are arranged at intervals from the base island. The width of the seventh pin, the eighth pin and the ninth pin is greater than the width of the remaining pins. The distance between the first pin and the second pin, the distance between the fifth pin and the sixth pin and the distance between the tenth pin and the ninth pin are all greater than the distance between the remaining adjacent pins. The power module is packaged by the ETSSOP20-10L lead frame. The scheme of the application omits and widens some pins, meets the application requirements and ensures the heat dissipation effect, and reasonably arranges the position relationship between the base island and the specific pins to meet the dielectric requirements.

The invention discloses a microcapsule for encapsulating a core material, and relates to the technical field of daily chemical products. The microcapsule for encapsulating the core material comprises the core material, a wall material for encapsulating the core material, a pH adjusting aid and water, the components of the wall material comprise a polymer A, a polymer B and a cationic polymer, the polymer A is selected from one or a mixture of two of 1a) and 1b), and the polymer B is selected from one or a mixture of two of compounds shown as a formula I and a formula IV. The wall material of the microcapsule is not easy to have residual isocyanate groups, and when the microcapsule encapsulating the core material is used in a detergent, the wrapping stability of the microcapsule in a matrix can be improved, and the inner core material can be released through friction.

The invention discloses a display panel and a display device. The display panel comprises a substrate, a first electrode and an isolation structure, the first electrode is arranged on one side of the substrate; the isolation structure is arranged on the side, away from the substrate, of the first electrode, an isolation opening is defined by the isolation structure, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the first electrode on the substrate are at least partially overlapped, and the isolation structure comprises a first sub-layer and a second sub-layer located on the side, away from the substrate, of the first sub-layer; the orthographic projection of the first sub-layer on the substrate is located in the orthographic projection of the second sub-layer on the substrate; wherein the second sub-layer comprises a main body part and a lap joint part which are connected with each other, the main body part is arranged on one side, deviating from the substrate, of the first sub-layer, the lap joint part protrudes out of the first sub-layer relative to the main body part in the direction deviating from the isolation opening, and at least part of the boundary of the first orthographic projection of the first electrode on the substrate is located in the orthographic projection of the lap joint part on the substrate. The reliability and the use effect of the display panel can be improved.

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.

The invention discloses automatic packaging equipment for optical protective film production, and relates to the technical field of optical protective film packaging, and the automatic packaging equipment comprises an optical protective film limiting conveying module, a packaging module and an auxiliary overturning module; the optical protective film limiting conveying module comprises a base, a linear motion module is installed at the upper end of the base, a main drive turnover mechanism is installed above the output end of the linear motion module, and limiting assemblies are symmetrically installed on the left side and the right side of the main drive turnover mechanism. The auxiliary turnover module comprises a mounting frame, an auxiliary turnover mechanism and a control assembly are mounted on the mounting frame, and the control assembly is used for driving a turnover roller set on the auxiliary turnover mechanism to be attached to the side portion of the optical protective film roll. According to the automatic packaging equipment for optical protective film production, through limiting, main and auxiliary cooperative overturning and automatic winding packaging, high-precision, lossless, efficient and full-automatic packaging of optical film rolls of different specifications is achieved, slipping, eccentricity and wrinkles are effectively prevented, and the clean and flat packaging requirements of high-end optical materials are met.

The invention relates to the technical field of compound fertilizers, and particularly discloses a production method of a biological organic-inorganic compound fertilizer based on humic acid. According to the invention, 10-20 parts of humic acid, 10-15 parts of urea, 10-16 parts of potassium dihydrogen phosphate, 5-10 parts of potassium sulfate, 1-2 parts of trace elements, 10-15 parts of decomposed cow dung, 10-15 parts of decomposed peanut shell, 1-5 parts of a composite microbial agent, 1-2 parts of an auxiliary agent and 20-25 parts of a filler are blended and granulated and then are wrapped by a coating liquid, and synergistic interaction of fertilizer efficiency is realized through advantage complementation of different types of fertilizers. The defects that humic acid is prone to oxidation, caking and loss are overcome, the wrapping stability is enhanced through chemical combination, and the protection effect is more thorough and more durable.

This invention relates to a copper-doped anhydrous guanine crystal sheet, its preparation method, and its application, belonging to the field of spectral camouflage and stealth materials. Specifically, it relates to a method for synthesizing copper-doped guanine crystals. In this invention, copper-doped chlorophyll is used as the functional molecule, and organic small molecule uric acid and high molecular weight polymer (P(VP-co-VA)) are used as additives to regulate the synthesis of green guanine microsheets that preferentially expose the (100) crystal facet with the optimal refractive index. The guanine crystal microsheets prepared by this invention have high reflectivity and specific visible light absorption in the 200-2500 nm range, while also having the effect of weakening polarized light. Embedding the pigment molecules into the crystal lattice achieves a good stabilizing effect on copper-doped chlorophyll, making it a novel camouflage material with high reflectivity and excellent stability.

The application provides a semiconductor package structure, which comprises: a redistribution layer; a dielectric layer arranged above the redistribution layer, and a plurality of terminals arranged on the dielectric layer; a cavity arranged above the dielectric layer and exposing a plurality of first terminals, the plurality of first terminals being part of the plurality of terminals; and an embedded element arranged between the redistribution layer and the dielectric layer and overlapping with a projection of the plurality of first terminals in a vertical direction. By embedding the embedded element between the redistribution layer and the dielectric layer, the embedded element can support the cavity and the redistribution layer below the cavity, so that the redistribution layer below the cavity can be prevented from warping or deforming, thereby improving product yield. In addition, the embedded element can also provide a bridging line function to improve product electrical performance.

The composite substrate packaging structure comprises a composite substrate body, an LED patch lamp bead assembly and a pressing assembly, a plurality of placing grooves are formed in the upper end of the composite substrate body, and positioning grooves are formed in the upper sides of the opposite inner walls of the placing grooves; the LED patch lamp bead assembly comprises a chip board arranged in the containing groove, a lamp bead body arranged in the middle of the upper end of the chip board and a positioning board fixed to the upper side of the opposite outer wall of the chip board, and the positioning board is connected with the positioning groove in a clamped mode. The pressing assembly comprises a rotating shaft vertically arranged at the upper end of the composite substrate body and located on the outer side of the positioning groove, and a rotating plate vertically arranged at the upper end of the rotating shaft. According to the composite substrate packaging structure of the LED SMD lamp bead, the chip board is positioned and placed through the positioning groove and the positioning plate, and the chip board is pressed and fixed through the pressing assembly, so that the packaging stability of the chip board is enhanced, and the phenomenon of pseudo soldering of the chip board caused by unstable welding of a welding spot after the chip board is packaged is prevented.

The utility model relates to a packaging structure for an optical module, which comprises a lower packaging shell, an upper packaging shell is arranged on the lower packaging shell, an optical module body is arranged between the lower packaging shell and the upper packaging shell, a positioning mechanism is arranged on the upper packaging shell, the positioning mechanism comprises a plurality of springs, and the springs are arranged on the lower packaging shell. The top of the lower packaging shell and the bottom of the upper packaging shell are each provided with four positioning grooves, the multiple springs are symmetrically and fixedly connected to the opposite sides of the inner side walls of the positioning grooves, the sides, away from the inner side walls of the positioning grooves, of the multiple springs are jointly and fixedly provided with positioning blocks, and the tops of the two positioning blocks are fixedly provided with moving blocks. A positioning plate is arranged between the two moving blocks, a worker uses the positioning mechanism to position the lower packaging shell and the upper packaging shell, the positioning mechanism is not prone to loosening when touched by mistake, the situation that when the lower packaging shell moves downwards under the action of gravity, the lower packaging shell is separated from the upper packaging shell, and consequently an optical module body falls off is reduced, and packaging stability is improved.

The invention provides a glass fiber composite packaging adhesive film as well as a preparation method and application thereof. The glass fiber composite packaging adhesive film comprises a first bonding layer, a middle layer and a second bonding layer which are sequentially stacked, the first bonding layer and the second bonding layer are graft modified polymer layers; and the middle layer is a glass fiber cloth layer. The composite packaging adhesive film provided by the invention is low in shrinkage rate and uniform in fluidity when the adhesive film is laminated, adhesive shortage caused by too slow flowing is avoided, and a perovskite battery is prevented from being extruded and damaged due to too fast flowing, so that water and oxygen are prevented from entering a battery piece to damage the battery piece in a use process caused by lamination defects; compared with a traditional thermoplastic polyolefin elastomer (POE) packaging adhesive film, the packaging adhesive film has the advantages that the thermal expansion coefficient is lower, the stretching or compression effect of out-of-plane strain caused by the adhesion effect in the thickness direction can be effectively reduced, and therefore the high and low temperature alternating resistance of the perovskite battery is improved.

The invention provides a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor substrate, the semiconductor substrate comprises a printed circuit board and a molding packaging body, the printed circuit board is located on part of the surface of the molding packaging body, a first containing groove is formed in the molding packaging body, and the printed circuit board covers the first containing groove; the semiconductor laser chip is located on one side of the exposed surface of the printed circuit board or on one side of the exposed surface of the molding packaging body, and the semiconductor laser chip is electrically connected with the printed circuit board; the driving chip is located in the first containing groove and electrically connected with the printed circuit board, and the first containing groove is completely filled with the driving chip. According to the semiconductor packaging structure, the driving chip is located in the first containing groove of the molding packaging body, so that the driving chip and the molding packaging body share the same occupied area in the semiconductor packaging structure, and the purpose of reducing the size of the semiconductor packaging structure is achieved.