SMD laser packaging structure and packaging method in optoelectronic circuit
A packaging structure and laser technology, applied in lasers, laser parts, semiconductor lasers, etc., to achieve the effects of reducing packaging costs, avoiding damage rates, and excellent insulation performance
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Embodiment 1
[0035] A chip-type laser packaging structure, including a semiconductor laser tube core 6 and an L-shaped heat sink; the L-shaped heat sink includes an L-shaped negative electrode layer 1, an L-shaped insulating layer 2, and an L-shaped positive electrode layer 3, An L-shaped groove is provided on the inner surface of the L-shaped negative electrode layer 1, and the L-shaped positive electrode layer 3 is embedded in the L-shaped groove, and the L-shaped negative electrode layer 1 and An L-shaped insulating layer 2 is arranged between the L-shaped anode layers 3 ; the semiconductor laser die 6 is mounted on the inner surface of the L-shaped anode layer 1 without L-shaped grooves.
[0036] The material of the L-shaped negative electrode layer is copper.
[0037] The material of the L-shaped positive electrode layer is copper.
[0038] The material of the L-shaped insulating layer is glass fiber.
Embodiment 2
[0040] A chip-type laser packaging structure as described in Embodiment 1, the difference is that the material of the L-shaped negative electrode layer 1 is single crystal silicon. The material of the L-shaped anode layer 3 is single crystal silicon.
[0041] The material of the L-shaped insulating layer 2 is silicone grease. The silicone grease described is DX-9041 thermal conductive silicone grease, commonly known as heat dissipation paste, which has good thermal conductivity, temperature resistance, and insulation properties. It is an ideal dielectric material for heat-resistant devices, and its performance is stable, and it will not produce Corrosive gases that do not affect the metals they come in contact with.
Embodiment 3
[0043] A patch laser package structure as described in Example 1, the difference is that the material of the L-shaped insulating layer is an insulating heat-conducting adhesive, and the insulating heat-conducting adhesive is a type of one-component room temperature vulcanized silicone Adhesive has the characteristics of convenient use, high bonding strength, elastic body after curing, impact resistance, vibration and so on. At the same time, the cured product also has good heat conduction, heat dissipation function, excellent high and low temperature resistance and electrical performance.
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