Glass frit composition, glass frit paste composition, sealing method, and electric device

A technology for electrical devices and compositions, which is applied in the fields of glass frit compositions, electrical devices, and glass frit paste compositions, and can solve problems such as lower packaging yield, easy cracking, and inability to seal air bubbles, so as to reduce porosity efficiency, avoid cracking, and improve package stability

Active Publication Date: 2016-09-21
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the packaging process, the glass frit is also prefabricated, and the required glass frit is obtained by vacuum degassing treatment, such as figure 2 As shown, through the observation of SEM microscope, it is found that although the degassing process has been carried out, there are still a large number of microscopic bubbles in the glass frit. figure 2 Note 1 in is the thickness of the glass frit paste composition, and 2, 3, 4, 5, and 6 are the diameters of the air bubbles in the glass frit paste composition respectively. During the laser bonding process, since the air bubbles occupy the position, resulting in the inability to seal the air bubbles, prone to cracking, and forming such as image 3 The gap shown in the middle circle reduces the package yield

Method used

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  • Glass frit composition, glass frit paste composition, sealing method, and electric device
  • Glass frit composition, glass frit paste composition, sealing method, and electric device
  • Glass frit composition, glass frit paste composition, sealing method, and electric device

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Embodiment 1

[0046] The first embodiment of the present invention provides a glass frit composition including a glass frit substrate and a filler, and the filler includes a quasicrystalline material.

[0047] The quasicrystalline material is Al-transition metal, including Al x Cu y Fe z , Al x Cu y Co z ,, Al x Cu y Mn z , Al x Mn y Si z , Al x Mn y Fe z , Al x Mn y Zr z , Al x' Mn y' Sn z' Mn w' , Where the relationship between x, y and z satisfies:

[0048] x+y+z=100, and

[0049] 60

[0050] 5

[0051] 5

[0052] The relationship between x', y', z'and w':

[0053] x'+y'+z'+w'=100, and

[0054] 60

[0055] 5

[0056] 5

[0057] 5

[0058] Further preferably, the quasicrystalline material is Al 65 Cu 20 Fe 15 , Al 65 Cu 15 Co 20 , Al 65 Cu 20 Mn 15 At least one material in.

[0059] The crystal structure of the quasicrystalline particles of the quasicrystalline material is: 5 times, 8 times, 10 times, 12 times and other rotational symmetry, with s...

Embodiment 2

[0063] The second embodiment of the present invention also provides a glass frit paste composition, including any one of the above-mentioned glass frit compositions. The glass frit paste composition further includes an organic binder and a solvent.

[0064] In the present invention, the above-mentioned glass frit paste composition can be used to airtightly seal electrical components such as organic light-emitting display panels, light-emitting diode (LED) lighting fixtures or dye-sensitized solar cells (DSSC). In the glass frit paste composition, the glass frit substrate is a supporting material, and the filler is a material used to improve the physical and chemical properties of the glass frit composition, just like the quasicrystalline material of the present invention can improve the glass frit composition Because the glass frit substrate is in powder form and the filler is granular, the glass frit substrate and the filler are mixed, the two cannot be bonded together, and the ...

Embodiment 3

[0068] Based on the glass frit paste composition provided in the above embodiments, the third embodiment of the present invention also provides a method for sealing using the glass frit paste composition, such as Figure 4 As shown, including the following steps:

[0069] Step 1. Provide a first substrate, wherein the first substrate is provided with a glass frit paste composition.

[0070] Wherein, the glass frit paste composition on the first substrate is the glass frit paste composition provided in the above embodiments. Specific as Figure 5 The illustrated top view of the first substrate provided by the embodiment of the present invention includes a first substrate 10 on which an encapsulation area 11 and electrical components 13 are provided, and the frit paste composition is deposited on the first substrate 10's package area 11. Specifically, the glass frit paste composition can be deposited on the packaging area 11 of the first substrate 10 by dispensing or screen printing...

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Abstract

The invention discloses a glass frit composition, which comprises a glass frit base material and a filler. The filler includes a quasicrystal material, and the quasicrystal material accounts for 5%-45% of the total mass of the filler. The glass frit composition, the glass frit paste composition and the sealing method and device using the glass frit paste composition provided by the present invention have a negative thermal expansion coefficient, which can well reduce the thermal expansion coefficient of the glass frit, so that the glass frit It is more matched with the expansion coefficient of the substrate, and provides a channel for venting large pores, improves the density and bonding strength of the glass frit composition, thereby improving the packaging yield and improving the stability of OLED packaging.

Description

Technical field [0001] The present invention relates to the technical field of glass frit, in particular to a glass frit composition, and a glass frit paste composition including the glass frit composition, and a method for sealing using the glass frit composition and the sealing method Electrical device for sealing. Background technique [0002] Organic Light-Emitting Diode (Organic Light-Emitting Diode), as a new type of flat panel display, has the advantages of active light emission, high resolution, fast response speed, low energy consumption and flexibility, and has attracted more and more attention. . Since there are organic layer materials that are extremely sensitive to water vapor and oxygen in current OLED devices, the life span of the OLED display device is greatly reduced. In order to solve this problem, the prior art mainly uses various materials to isolate the organic layer material of the OLED from the outside. Among them, the main sealing method is to fill glas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/24C03B23/24H01L51/52
CPCY02P40/57
Inventor 李丹丹
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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