Sensor packaging structure capable of implanting clothes, packaging method of sensor packaging structure and intelligent clothing

A packaging structure and sensor technology, applied in clothing, clothing, instruments, etc., can solve the problems of shedding, no waterproof performance, and low signal acquisition accuracy, and achieve the effects of not easily shedding, improving waterproof performance, and reducing signal interference.

Active Publication Date: 2019-06-14
青岛中物云传智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention proposes a sensor packaging structure and packaging method that can be implanted into clothing. The problem of peeling off clothing and no waterproof performance

Method used

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  • Sensor packaging structure capable of implanting clothes, packaging method of sensor packaging structure and intelligent clothing
  • Sensor packaging structure capable of implanting clothes, packaging method of sensor packaging structure and intelligent clothing
  • Sensor packaging structure capable of implanting clothes, packaging method of sensor packaging structure and intelligent clothing

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] figure 1 An alternative embodiment of a sensor package structure for an implantable garment is shown.

[0041] In this embodiment, the sensor packaging structure includes: a sensor packaging unit, a molded hot melt adhesive structure 5 that wraps the sensor packaging unit and bonds it to one side of the clothing fabric, and mechanically fixes the sensor packaging unit and the clothing fabric. Connected first conductive buckle 4 and signal lead-out wire...

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Abstract

The invention provides a sensor packaging structure capable of implanting clothes, a packaging method of the sensor packaging structure and intelligent clothing, and belongs to the technical field ofsensor packaging. The sensor packaging structure comprises a sensor packaging unit, a forming hot melt adhesive structure, a first conductive buckle an a signal outgoing line, wherein the forming thermal hot melt adhesive structure is used for covering the sensor packaging unit and sticking the sensor packaging unit to one side of a clothes cloth, and the first conductive snap joint is used for fixedly connecting the sensor packaging unit and the clothes cloth in a mechanical mode; the sensor packaging unit comprises a sensor, and a doubly-layer shielding outer shell arranged in the mode of totally covering the sensor; and one end of the signal outgoing line is connected with the a wiring pin of the sensor, the other end of the signal outgoing line is connected with the first conductive snap joint, and the first conductive snap joint is non-electrically connected with the double-layer shielding outer shell. According to the sensor packaging structure, the connecting stability between the sensor packaging structure and the clothes is great, the packaging effect is great, the signal shielding effect and signal collecting accuracy are improved, the waterproof performance is further improved, the service life is long, and the sensor packaging structure is not prone to falling off.

Description

technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a sensor packaging structure implantable in clothing, a packaging method and smart clothing. Background technique [0002] The publication number is CN2874423Y, and the patent name is "PVDF piezoelectric film rubber-based packaging strain gauge shielded by metal shielding layer". By setting a metal shielding net outside the substrate to shield electromagnetic interference, the anti-interference performance of the sensor is improved. Although this technology has a certain degree of shielding setting, its disadvantage is that the shielding layer does not cover the sensor wiring rivets, and the signal lead-out line is not shielded. Because there is still a certain degree of electromagnetic signal interference at these two positions, which leads to this patent. The accuracy of the collected signal is not high. Moreover, the above-mentioned utility model products are not eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D11/24G01D11/00H05K9/00A41D1/00
Inventor 赵兵门小宏刘玉龙李威
Owner 青岛中物云传智能科技有限公司
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