Packaging mechanism for wireless communication module

A wireless communication module and recycling mechanism technology, applied in cleaning methods and utensils, cleaning methods using gas flow, electrical components, etc., can solve problems affecting module failure, affecting quality, etc., to avoid failure, improve packaging stability, Effects for quick placement

Pending Publication Date: 2022-03-25
深圳百昱达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The chip in the wireless module needs to be packaged after production. However, the existing packaging equipment does not vacuum and clean the chip frame before sending it into the packaging warehouse for packaging, which may affect the failure of the later module. affect the quality, therefore, a packaging mechanism for wireless communication modules is proposed

Method used

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  • Packaging mechanism for wireless communication module
  • Packaging mechanism for wireless communication module
  • Packaging mechanism for wireless communication module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1, with reference to Figure 1-7 , a packaging mechanism for a wireless communication module, including a bottom box 1, a packaging warehouse 2 is fixed on one side of the upper part of the bottom box 1, and a packaging mechanism is provided in the packaging warehouse 2, and a sliding device is installed on the upper side of the bottom box 1 away from the packaging warehouse 2 Skateboard 3, bottom box 1 is provided with a driving sliding assembly, the upper part of the slideboard 3 is provided with a rectangular slot, and a storage slot 11 is opened at the middle position of the bottom wall of the rectangular slot, and a sliding post is inserted slidingly at the middle position of the bottom wall of the storage slot 11 12. The top plate 13 is horizontally and fixedly connected to the upper end of the sliding column 12, the top plate 13 is placed with a placement plate 4, and the upper part of the placement plate 4 is provided with a plurality of frame placemen...

Embodiment 2

[0037] Embodiment 2, with reference to Figure 1-2 and 4-8, compared with Embodiment 1, the only difference is that the elastic member includes two magnetic rings 35 slidingly sleeved at the lower end of the spool 12, and one of the magnetic rings 35 is fixed on one side of the limit disc 15, and the other The magnetic ring 35 is fixed on the lower part of the slider 14 , and the two magnetic rings 35 repel each other magnetically.

[0038] The above-mentioned embodiment 2 of the present invention has achieved the following technical effects: during packaging operations, only the module chip frame needs to be placed in the frame placement opening on the placement plate 4, and then the drive motor 10 drives the screw rod 17 to rotate, driving the slide plate 3 along the chute 9 Sliding, when the horizontal column 21 in the bottom box 1 is smoothed by the rising part of the guide rod 22, it will drive the sliding column 12 to move down, release the two magnetic rings 35 so that ...

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PUM

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Abstract

The packaging mechanism for the wireless communication module comprises a bottom box, a packaging bin is fixedly arranged on one side of the upper portion of the bottom box, a packaging mechanism is arranged in the packaging bin, a sliding plate is slidably arranged at the end, away from the packaging bin, of the upper portion of the bottom box, a driving sliding assembly is arranged on the bottom box, and a rectangular groove is formed in the upper portion of the sliding plate; a storage groove is formed in the middle of the bottom wall of the rectangular groove, a sliding column is slidably inserted in the middle of the bottom wall of the storage groove, a top plate is horizontally and fixedly connected to the upper end of the sliding column, a placement plate is placed on the top plate, a plurality of frame placement openings are formed in the upper portion of the placement plate, and a sliding recycling mechanism is arranged in the bottom box. According to the invention, the placing plate can be automatically lifted, so that people can quickly place and automatically retract after sliding, the stability during packaging operation is facilitated, the placing plate is fixed, the packaging stability is further improved, the air suction groove starts to suck air, dust collection and cleaning of a chip frame are realized, faults of a finished product module caused by smudginess of the chip frame are avoided, and the design is reasonable.

Description

technical field [0001] The invention relates to the technical field of packaging equipment, in particular to a packaging mechanism for a wireless communication module. Background technique [0002] Wireless communication modules are widely used in vehicle monitoring, remote control, telemetry, small wireless networks, wireless meter reading, access control systems, community paging, industrial data acquisition systems, wireless tags, identification, non-contact RF smart cards, small wireless data terminals, security Fire protection system, wireless remote control system, biological signal acquisition, hydrometeorological monitoring, robot control, wireless 232 data communication, wireless 485 / 422 data communication, digital audio, digital image transmission and other fields. [0003] The chip in the wireless module needs to be packaged after production. However, the existing packaging equipment does not vacuum and clean the chip frame before sending it into the packaging war...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B5/04
CPCH01L21/67121B08B5/04
Inventor 沈三贵陈亮中
Owner 深圳百昱达科技有限公司
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