The invention discloses a
wafer level packaging method of a
light emitting diode with an adjustable lens focus. The method comprises the following steps: in a first step,
etching a
light emitting diode lens mould microchannel array and a spacing control mould microchannel array surrounding a
light emitting diode lens mould groove on a
silicon wafer, and disposing proper amount of thermal
outgassing agents in a light emitting
diode lens mould microchannel; in a second step, carrying out
anode bonding of the
silicon wafer and a
borosilicate glass water in vacuum to form a sealed cavity; in a third step, carrying out heating and heat preservation on a bonding wafer in the air, forming a spherical glass micro-cavity and a spacing control projection ring, carrying out cooling and annealing, and removing
silicon to obtain a light emitting
diode packaging
lens array; in a fourth step, pasting a light emitting
diode chip on a substrate; in a fifth step, bonding a wafer level glass micro-cavity and the substrate; in a sixth step, filling up glue into a gap between a light emitting diode
chip and the wafer level glass micro-cavity through a spacing control ring gap, and carrying out solidification. The method can be carried out on a wafer level, and the method has the advantages of simplicity and low cost.