Frit composition, frit paste composition and sealing method and electric device

A technology for electrical devices and compositions, which is applied in the field of glass frit compositions, glass frit paste compositions, and electrical devices, and can solve the problems of unsealable air bubbles, easy cracking, and reduced packaging yield, so as to improve packaging Stability, avoid cracking, reduce the effect of porosity

Active Publication Date: 2014-09-17
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the packaging process, the glass frit is also prefabricated, and the required glass frit is obtained by vacuum degassing treatment, such as figure 2 As shown, through the observation of SEM microscope, it is found that although the degassing process has been carried out, there are still a large number of microscopic bubbles in the glass frit. figure 2 Note 1 in is the thickness of the glass frit paste composition, and 2, 3, 4, 5, and 6 are the diameters of the air bubbles in the glass frit paste composition respectively. During the laser bonding process, since the air bubbles occupy the position, resulting in the inability to seal the air bubbles, prone to cracking, and forming such as image 3 The gap shown in the middle circle reduces the package yield

Method used

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  • Frit composition, frit paste composition and sealing method and electric device
  • Frit composition, frit paste composition and sealing method and electric device
  • Frit composition, frit paste composition and sealing method and electric device

Examples

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Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1 of the present invention provides a glass frit composition, including a glass frit substrate and a filler, and the filler includes a quasicrystalline material.

[0047] The quasicrystalline materials are Al-transition metals, including Al x Cu y Fe z , Al x Cu y co z ,, Al x Cu y mn z, Al x mn y Si z , Al x mn y Fe z , Al x mn y Zr z , Al x' mn y' sn z' mn w' , where the relationship between x, y, z satisfies:

[0048] x+y+z=100, and

[0049] 60

[0050] 5

[0051] 5

[0052] Among them, the relationship between x', y', z' and w':

[0053] x'+y'+z'+w'=100, and

[0054] 60

[0055] 5

[0056] 5

[0057] 5

[0058] Further preferably, the quasicrystalline material is Al 65 Cu 20 Fe 15 , Al 65 Cu 15 co 20 , Al 65 Cu 20 mn 15 at least one of the materials.

[0059] The crystal structure of the quasicrystal particles of the quasicrystal material is: 5th, 8th, 10th, 12th, etc. r...

Embodiment 2

[0063] Embodiment 2 of the present invention also provides a glass frit paste composition, including any one of the glass frit compositions described above. The frit paste composition also includes an organic binder and a solvent.

[0064] In the present invention, the above glass frit paste composition can be used to hermetically seal electrical components such as organic light-emitting display panels, light-emitting diode (LED) lighting fixtures, or dye-sensitized solar cells (DSSC). In the glass frit paste composition, the glass frit substrate is a supporting substance, and the filler is a substance used to improve the physical and chemical properties of the glass frit composition, just as the quasicrystalline material in the present invention can improve the glass frit composition The thermal expansion coefficient of the material, and because the glass frit base material is powdery, and the filler is granular, the glass frit base material and the filler are mixed, and the ...

Embodiment 3

[0068] Based on the glass frit paste composition provided in the above embodiment, Embodiment 3 of the present invention also provides a sealing method using a glass frit paste composition, such as Figure 4 shown, including the following steps:

[0069] Step 1, providing a first substrate, wherein the first substrate is provided with a glass frit paste composition.

[0070] Wherein, the glass frit paste composition described on the first substrate is the glass frit paste composition provided in the above examples. Specific as Figure 5 The top view of the first substrate provided by the illustrated embodiment of the present invention includes a first substrate 10 on which an encapsulation area 11 and electrical components 13 are arranged, and the frit paste composition is deposited on the first substrate 10 of the encapsulation area 11 . Specifically, the glass frit paste composition may be deposited on the packaging area 11 of the first substrate 10 by dispensing or scree...

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Abstract

The invention discloses a frit composition which comprises a frit base material and filler, wherein the filler comprises a quasi-crystal material which accounts for 5-45wt% of the total weight of the filler. The frit composition, and the frit paste composition have negative thermal expansion coefficients, the thermal expansion coefficient of the frit can be reduced very well, so that the expansion coefficients of the frit and the base plate are further matched. Furthermore, a channel for discharging gross blow holes is provided and the compactness and adhesive strength of the frit composition are improved, so that the packaging yield is further improved and the OLED (Organic Light Emitting Diode) packaging stability is improved.

Description

technical field [0001] The present invention relates to the field of glass frit technology, in particular to a glass frit composition, a glass frit paste composition comprising the glass frit composition, a sealing method using the glass frit paste composition, and a sealing method using the frit paste composition Sealed electrical installations. Background technique [0002] OLED (Organic Light-Emitting Diode), as a new type of flat panel display, has the advantages of active light emission, high resolution, fast response, low energy consumption and flexibility, and has received more and more attention. . Due to the existence of organic layer materials that are extremely sensitive to water vapor and oxygen in current OLED devices, the lifetime of OLED display devices is greatly reduced. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside world. Among them, the main sealing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C03B23/24H01L51/52
CPCY02P40/57
Inventor 李丹丹
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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