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Glass frit composition, glass frit paste composition, and electrical component

A technology for electrical components and glass frit, applied in the field of electrical components and glass frit composition, can solve the problems of energy waste, lower product yield, incomplete crystallization, etc., achieve a wide range of applications, improve stability, and avoid cracking. Effect

Active Publication Date: 2016-02-24
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although in order to avoid stress-induced cracking, anisotropic thermal expansion fillers with low content are usually added when making glass frit, so in the process of making glass frit, in order to reduce the CTE of glass frit, it is necessary to extend the heat treatment time of glass frit On the one hand, it leads to energy waste, on the other hand, due to the prolongation of heat treatment time, it will lead to incomplete crystallization or insufficient filler content caused by sintering, which will eventually lead to cracks after thermal shock, which will cause glass substrates to be unsealed and reduce the product quality. yield

Method used

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  • Glass frit composition, glass frit paste composition, and electrical component
  • Glass frit composition, glass frit paste composition, and electrical component
  • Glass frit composition, glass frit paste composition, and electrical component

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Embodiment Construction

[0028] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content.

[0029] The invention provides a glass frit composition, comprising a glass frit base material and a filler, wherein the filler is an isotropic negative thermal expansion material, and the isotropic negative thermal expansion material accounts for 1% of the total mass of the glass frit composition 5%-30%.

[0030] The present invention adopts glass frit with isotropic negative coefficient of thermal expansion filler, which can adjust the coefficient of thermal expansion (CTE) to 30×1...

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Abstract

The invention provides a frit composition. The frit composition comprises a frit base material and a filler, wherein the filler is an isotropic negative thermal expansion material, and the mass of the isotropic negative thermal expansion material accounts for 5-30% of the total mass of the frit composition. The frit composition can reduce the thermal expansion coefficient of frit in order to be matched with a glass substrate, can uniformly adjust the overall thermal expansion coefficient in all directions, avoids the cracks caused by the stress between the frit and the glass substrate, and improves the yield of products.

Description

technical field [0001] The invention relates to the technical field of glass frit, in particular to a glass frit composition, a glass frit paste composition and an electrical component obtained by hermetically sealing the glass paste composition. Background technique [0002] There are organic layer materials in OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) devices. Since the organic layer materials are extremely sensitive to water vapor and oxygen, the lifespan of OLED display devices is greatly reduced. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside world. Among them, the main sealing method is to fill the sealing area of ​​the upper and lower glass substrates of the OLED display panel with glass frit, and then use the laser beam to move and heat the glass frit to melt it, thereby forming a hermetic package connection. [0003] figure 1 is a schemat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/24
Inventor 李丹丹梅伟民
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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