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Subsea Micro Seismic Sensor Mounting Platform

A seismic sensor and miniature technology, applied in the field of sensors, can solve the problems of many components, high cost and large volume, and achieve the effect of small size, low cost and increased adaptability

Active Publication Date: 2020-06-16
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing seismic sensor mounting platforms adopt the method of mechanical structure leveling and sensor fixing. There are many components, high cost and bulky volume. There is no suitable mounting structure for miniature seismic sensors to keep them flat.

Method used

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  • Subsea Micro Seismic Sensor Mounting Platform
  • Subsea Micro Seismic Sensor Mounting Platform
  • Subsea Micro Seismic Sensor Mounting Platform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Introduce detailed technical scheme of the present invention below in conjunction with accompanying drawing:

[0027] like figure 1 , 2 As shown, the subsea micro-seismic sensor carrying platform includes an outer packaging structure, silicone oil and an inner packaging structure, wherein: the outer packaging structure includes: an upper shell 3, a convex flange 4, a concave flange 5, a lower shell 6, and 12 pieces Double-ended studs 8, 24 nuts 9, sealing gasket 11 and cable gland 30; the upper shell and the lower shell are both hollow structures with the same size, the upper surface 35 of the upper shell and the bottom surface 37 of the lower shell The edges are all rounded, the interior of the upper shell and the lower shell are semi-circular cavities, and the upper shell is processed with a cable hole 10 and two ring threaded holes 7, the cable hole is round A through hole is located on the upper surface of the upper casing near the apex; the two ring threaded hole...

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Abstract

The invention provides a seabed miniature earthquake sensor carrying platform by aiming at the problem that a miniature earthquake sensor lacks a carrying structure capable of keeping the miniature earthquake sensor horizontal all the time. The carrying platform adopts a spherical inner packaging structure and a hollow outer packaging structure, the miniature earthquake sensor which needs to be carried is put in the inner packaging structure, and then, the inner packaging structure is put in the outer packaging structure full of silicone oil; on the basis of the dynamic equilibrium principle of a tumbler, the inner packaging structure finally can keep an upward and horizontal state no matter how the attitude changes; and therefore, a sealing and anti-corrosion working platform which is suitable for the seabed environment and guarantees that the sensor is always under a horizontal state is provided for the miniature earthquake sensor and relevant electronic devices thereof. The seabed miniature earthquake sensor carrying platform disclosed by the invention has the advantages of simple structure, reliable performance, small volume, low cost and the like.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a submarine micro-seismic sensor carrying platform. Background technique [0002] The submarine seismograph is an important tool for people to study the seabed structure and detect seabed resources. The submarine seismic sensor carrying platform is an important part of the submarine seismograph. Its function is mainly to provide a safe, A stable operating environment provides a working environment for sensors with direction requirements to keep them in a horizontal state. [0003] When testing the seabed vibration signal, the seabed vibration signal is transmitted to the shell of the seismic sensor carrying platform in contact with it through the seabed ground, and then transmitted to the seismic sensor mounted therein through the internal structure of the seismic sensor carrying platform, the sensor collects the vibration signal, and Transmission via cable or wirele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V1/00G01V1/20
Inventor 郝惠敏李灵程黄家海熊晓燕
Owner TAIYUAN UNIV OF TECH