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Preparation method of sound absorption piece

A technology of sound-absorbing parts and sound-absorbing materials, applied in electrical components, frequency/direction characteristic devices, sensors, etc., can solve the problems of low structural strength of sound-absorbing material particles, easy dusting of sound-absorbing material particles, and large amount of adhesive added. Achieve the effects of good low frequency effect, good sound absorption effect and good drop resistance

Active Publication Date: 2019-06-21
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the amount of adhesive added is too large, it will have a negative impact on the sound-absorbing effect of the sound-absorbing material particles; if the amount of adhesive added is too small, the structural strength of the sound-absorbing material particles will be low, and the drop resistance performance will deviate. Among them, the particles of sound-absorbing materials are easy to powder or even break

Method used

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  • Preparation method of sound absorption piece
  • Preparation method of sound absorption piece
  • Preparation method of sound absorption piece

Examples

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Embodiment Construction

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0028] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0029] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a preparation method of a sound absorption piece. The preparation method comprises the following steps: providing a three-dimensional network skeleton matched with the shape ofa rear sound cavity of the sound production device; Attaching a binder to a surface of the three-dimensional network backbone; Bonding a non-foaming sound-absorbing material to the surface of the three-dimensional network skeleton through the binder; Carrying out drying treatment on the three-dimensional network framework bonded with the non-foaming sound-absorbing material; And roasting the dried three-dimensional network framework to form the blocky sound absorption part.

Description

technical field [0001] The invention relates to the technical field of material preparation, and more specifically, to a method for preparing a sound-absorbing piece. Background technique [0002] In order to pursue better sound quality, it is required that the Fo of the micro-speaker or the speaker module can be lower. The reduction of Fo requires that the rear sound cavity of the speaker module can be made larger. Due to the development trend of limited micro-speakers, thinner and smaller speaker modules, it is usually necessary to add sound-absorbing materials inside the rear acoustic cavity of the speaker module. Sound absorbing materials are usually porous materials. Holes can play the role of virtual expansion, thereby reducing Fo. [0003] Commonly used sound-absorbing materials mainly include foam-type foams (such as polyurethane foam, melamine, etc.) and non-foamed sound-absorbing materials (such as activated carbon, natural zeolite, white carbon black, activated...

Claims

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Application Information

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IPC IPC(8): H04R1/28H04R31/00C08L83/04C08L33/12C08L31/04C08L9/00C08L75/04C08L97/02C08L87/00C08K7/06C08K3/36C08K3/08C08K7/26C08K7/24
Inventor 曹晓东
Owner GOERTEK INC
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