High-low temperature experimental device for electronic component

A technology of experimental devices and electronic components, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of less research on the thermal fatigue behavior of solder joints, and achieve the effects of simple structure, time saving, and increased heating and cooling rates

Active Publication Date: 2019-08-20
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still few studies on the thermal fatigue behavior of solder joints using accelerated thermal cycling, especially in the development and utilization of equipment.

Method used

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  • High-low temperature experimental device for electronic component
  • High-low temperature experimental device for electronic component
  • High-low temperature experimental device for electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] see Figure 1 to Figure 6 , the high and low temperature experimental device for electronic components shown includes a box body 1, a rotating disk 5 and a motor 6, and a heat insulation board 2 is arranged in the middle of the box body 1, and the heat insulation board 2 divides the box body 1 into a heating chamber above and cooling chamber 4 below 3, the rotating disc 5 is arranged in the box body 1 and its plane is perpendicular to the heat shield 2, a part is in the heating chamber 3, and the other part is in the cooling chamber 4, the disc surface of the rotating disc A mounting boss 51 for placing the sample 10 is provided. The rotating rod 61 of the motor 6 extends into the box body 1 and connects with the center of the rotating disk 5 , and the sample 10 switches between the heating chamber 3 and the cooling chamber 4 driven by the rotating disk 5 . ...

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PUM

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Abstract

The invention discloses a high-low temperature experimental device for an electronic component. The device comprises a box body, a rotating disc and a motor. A heat insulation board is arranged in thebox body. The heat insulation board divides the box body into an upper heating chamber and a lower cooling chamber. The rotating disk is arranged in the box body. The disk surface vertically passes through the heat insulation board. One part is in the heating chamber, and the other part is in the cooling chamber. The disk surface of the rotating disk is provided with a mounting boss for placing asample. The rotating rod of the motor extends into the box body and is connected with the center of the rotating disc. The sample is driven by the rotating disc to switch between the heating chamberand the cooling chamber. The heating and cooling efficiency can be improved. The holding time is reduced. The device has the advantages of fast temperature response and uniform heating and cooling. The efficiency of high and low temperature experiments is improved.

Description

technical field [0001] The invention relates to electronic component reliability testing equipment, in particular to an electronic component high and low temperature experimental device. Background technique [0002] At present, with the gradual promotion and application of high-power devices, the packaging density is getting higher and higher, the size of solder joints is getting smaller and larger, the internal electric power of components is getting larger, and the heat flux density is getting higher and higher. Cooling and cooling due to its performance, component solder joints will be subjected to high-frequency and sharp temperature changes during service, which will inevitably lead to mismatch of thermal expansion coefficients of various materials inside components, and solder joints that play a connecting role are subject to stress and strain The cyclic changes of the solder joints will cause thermal fatigue damage of the solder joints, resulting in the failure of th...

Claims

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Application Information

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IPC IPC(8): G01N3/60G01N3/02
CPCG01N3/02G01N3/60
Inventor杨栋华施雷张春红张海兵陈新年翟翔田将夏大权
OwnerCHONGQING UNIV OF TECH