A high and low temperature experimental device for electronic components

Abstract

The invention discloses a high and low temperature experimental device for electronic components, which includes a box body, a rotating disk and a motor. The box body is provided with a heat insulation board, and the heat insulation board separates the box body into an upper heating chamber and a lower cooling chamber. , the rotating disk is set in the box, the surface of the disk passes through the heat shield vertically, one part is in the heating chamber, and the other part is in the cooling chamber, the surface of the rotating disk is provided with a mounting boss for placing the sample, so The rotating rod of the motor extends into the box and connects with the center of the rotating disk, and the sample is switched between the heating chamber and the cooling chamber driven by the rotating disk. It can improve heating and cooling efficiency, reduce heat preservation time, and respond quickly to temperature changes, uniform heating and cooling, and improve the efficiency of high and low temperature experiments.

Description

technical field [0001] The invention relates to electronic component reliability testing equipment, in particular to an electronic component high and low temperature experimental device. Background technique [0002] At present, with the gradual promotion and application of high-power devices, the packaging density is getting higher and higher, the size of solder joints is getting smaller and larger, the internal electric power of components is getting larger, and the heat flux density is getting higher and higher. Cooling and cooling due to its performance, component solder joints will be subjected to high-frequency and sharp temperature changes during service, which will inevitably lead to mismatch of thermal expansion coefficients of various materials inside components, and solder joints that play a connecting role are subject to stress and strain The cyclic changes of the solder joints will cause thermal fatigue damage of the solder joints, resulting in the failure of th...

Images