Computer cooling case and cooling method thereof

A computer and chassis technology, applied in the computer field, to achieve the effect of increasing the average service life, improving cooling efficiency, and avoiding short circuit and overheating

Pending Publication Date: 2019-08-20
莫晶亮
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a computer heat dissipation case and its heat dissipation method, which can solve the phenomenon of dust adhesion, poor heat dissipation effect and short circuit of components caused by the turbulent airflow of the heat dissipation case in the prior art

Method used

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  • Computer cooling case and cooling method thereof
  • Computer cooling case and cooling method thereof
  • Computer cooling case and cooling method thereof

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Embodiment Construction

[0027] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0028] Please see attached figure 1 As shown, a computer cooling case includes a case 1, a cooling assembly 2, a flexible pipe 3, a fan group 4 and a cooling fin 5; a ventilation hole 6; the cooling fins 5 are installed in the inner cavity of the chassis 1, and cover the ventilation holes 6 of the front plate, and the fan group 4 is installed on the cooling fins 5; several of the heat dissipation components 2 Installed on the components in the chassis 1, several of the cooling assemblies 2 communicate with the cooling fins 5 through two hoses 3, and the hoses 3 are filled with cooling liquid.

[0029] Each of the heat dissipation components 2 includes a secondary heat sink 7 and a water pump 8; the water pump 8 is installed on the secondary heat sink 7, and the two are in liquid communication, and the water pump 8 drives the hot coolant in the secondary...

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PUM

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Abstract

The invention discloses a computer cooling case which comprises a case body, a cooling assembly, a hose, a fan set and cooling fins. The invention further discloses a cooling method of the computer cooling case. According to the cooling case of the computer, the cooling mode and layout are improved; the heat exchange of the main air flow is far away from parts and components, deposition of dust around medium and micro electronic elements can be effectively reduced, short circuit and overheating caused by dust accumulation are avoided, air resources of an open area at the front end of a computer are effectively utilized, hot air exhausted by the computer at the rear part of the computer is prevented from participating in flowing again, and the cooling efficiency of parts and components is improved. According to the computer heat dissipation case, an existing case production line is slightly changed, and a production process does not need to be changed. Meanwhile, due to the fact that the front portion is open and the rear portion is closed in the position where the computer host is placed, a heat dissipation system can absorb more cold air through the case of a new heat dissipationlayout, continuous fault-free time of a computer is prolonged, and the service life of the computer is prolonged.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer cooling case and a cooling method thereof. Background technique [0002] Existing heat dissipation methods for internal components of computers are mostly down-pressurized air cooling at the parts - air out from the rear of the chassis or down-pressure water cooling at the parts - outflow from the rear of the chassis. The advantages of this method are simple structure, easy installation, and easy Match the common mainframe chassis in the market. The disadvantage is that these two heat dissipation methods do not fully take into account the use environment and placement position of the existing main computer chassis. Existing computers have been popularized, and the use environment has changed from the original high-demand precision environment with constant temperature and dust to an open ordinary office space, which exposes computers to the most important causes of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20G06F2200/201
Inventor 莫晶亮
Owner 莫晶亮
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