Method for positioning defective part of part, electronic device, equipment and storage medium

Abstract

The invention discloses a method for positioning a defective part of a part. The method comprises the following steps: acquiring an element appearance electronic map of the part with the defective part; receiving an instruction, and forming a mark at a preset position on the element appearance electronic map according to the instruction; and transmitting the element appearance electronic map with the bad mark to a preset terminal. With the adoption of the method, the element appearance electronic picture of the part with the bad part is obtained and then is electronically marked, so that a maintainer can quickly confirm the bad position of the part according to the mark on the element appearance electronic picture for maintenance. By means of the method, the situation that in the prior art, an arrow sticker is prone to falling off in the part transportation process can be avoided, or the sticker is relatively large. The invention further provides an electronic device, terminal equipment and a storage medium.

Description

technical field [0001] The present application relates to the field of electronic technology, and in particular to a method for locating a defective part, an electronic device, a terminal device, and a storage medium. Background technique [0002] Electronic devices such as mobile phones and tablet computers contain many parts and components. During the production or installation process, some parts will inevitably have local defects, which need to be improved by maintenance personnel. In order to facilitate the maintenance personnel to quickly find the location of the defective part, if a part is found to be defective locally, physical marks will be made at the location of the defective part, such as a sticker with a red arrow, etc. [0003] With the continuous improvement of the modularization, miniaturization and densification of the motherboards of mobile phones and other electronic devices, the method of using small red arrow stickers to mark defective products has seri...

AI Technical Summary

Problems solved by technology

[0003] With the continuous improvement of the modularization, miniaturization and densification of the motherboards of mobile phones and other electronic devices, the method of using small red arrow stickers to mark defective products has serious defects. It is easy to fall off, so that the defective products that have been checked and marked cannot be quickly located after the sticker falls off, wasting time to confirm again

Second, as the components become smaller and smaller, the arrow stickers are larger than the components, which cannot accurately mark the defective part number, which is easy to cause misunderstanding and misjudgment to the maintenance personnel, which brings great trouble to the maintenance positioning

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