Crimping bottom die
A technology of bottom mold and support block, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of paying the cost of crimping bottom molds, poor versatility, increasing material costs and processing time costs, and reducing the manufacturing cycle , cost reduction, and easy operation
Active Publication Date: 2020-01-21
MAIPU COMM TECH CO LTD
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AI Technical Summary
Problems solved by technology
[0004] 1) Small batches and multiple varieties are already the status quo and future trend of the industry. If each product has a separate crimping bottom mold, it will increase the design cycle and time cost of the bottom mold
[0005] 2) Each product is processed with a special crimping bottom mold, which has poor versatility, wastes bottom mold processing materials, and increases material costs and processing time costs
[0006] 3) In the early stage of research and development, the PCB board has not been fully finalized, and the possibility of upgrading and revision is very high. Often, the crimping base mold made before cannot be used due to design revisions and needs to be remade. A product needs to be developed from research and development to mass production. To make a variety of crimping bottom molds, it is necessary to repeatedly pay the cost of crimping bottom molds
Method used
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[0025] The technical term involved in the present invention and explanation are as follows:
[0026] Crimp: Crimp connection, as the name suggests, is to press an interference-sized plug into a drilled through hole on a printed circuit board. As a widely accepted and used non-soldering technology, it is used to connect a connector plug to a printed circuit board with high reliability, plug safety and ease of operation.
[0027] Bottom mold: Bottom mold, which plays the role of limit, bottom protection and support.
[0028] Air flotation: use jet high-pressure air to make the object to be blown float or reduce the weight of the object to be blown, and it is convenient to move.
[0029] Material packaging silk screen frame: refers to the outline frame of the components on the PCB, which is expressed in the form of regular or irregular lines composed of lines in the design software, and the form of expression on the PCB is generally the regular or irregular shape formed by white...
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The invention relates to a crimping bottom die, and belongs to the electronic product crimping bottom die technology field. The bottom die comprises a substrate and supporting blocks. The supporting blocks comprise the supporting block for limiting and positioning and the supporting block for crimping materials. The supporting block for limiting and positioning is a limiting supporting block or apositioning supporting block or a combination of the limiting supporting block and the positioning supporting block, the supporting block for crimping materials is a pin-out supporting block or a non-pin-out supporting block or a combination of the pin-out supporting block and the non-pin-out supporting block, and heights from a bottom to a top of the supporting block in contact with a bottom surface of the PCB are consistent. The supporting blocks are all arranged on an upper surface of the substrate, and the substrate and the supporting blocks are attracted together based on a magnetic forceeffect. A bottom supporting block corresponding to the crimping materials is modularized and standardized, and then the corresponding standardized supporting block is selected according to the crimping materials in actual use. The supporting blocks and the substrate are fixed by using a simple magnetic action principle. The crimping bottom die can be universally applied to crimping of different electronic products.
Description
technical field [0001] The invention relates to a crimping bottom die, which is a crimping bottom die used in the crimping process of electronic products, and belongs to the technical field of crimping bottom dies for electronic products. Background technique [0002] With the advancement of science and technology, the development and requirements of technology, the use of crimping devices such as high-speed connectors in the communication industry, aerospace, national defense and ships has become more and more widespread; at the same time, the modularization of products, the convenience of installation and maintenance The modernization also makes the use of crimping materials more and more, and the demand for crimping bottom molds in the corresponding product production process is also increasing. [0003] In the crimping process of electronic products, due to the different sizes of products, the distribution of crimping devices (including but not limited to high-speed conn...
Claims
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IPC IPC(8): H05K3/30
CPCH05K3/306H05K2203/0165
Inventor王刚
OwnerMAIPU COMM TECH CO LTD