Crimp bottom die

A technology of bottom mold and support block, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of paying the cost of crimping bottom molds, poor versatility, increasing material costs and processing time costs, and reducing the manufacturing cycle , easy to operate, easy to produce effects

Active Publication Date: 2022-06-03
MAIPU COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) Small batches and multiple varieties are already the status quo and future trend of the industry. If each product has a separate crimping bottom mold, it will increase the design cycle and time cost of the bottom mold
[0005] 2) Each product is processed with a special crimping bottom mold, which has poor versatility, wastes bottom mold processing materials, and increases material costs and processing time costs
[0006] 3) In the early stage of research and development, the PCB board has not been fully finalized, and the possibility of upgrading and revision is very high. Often, the crimping base mold made before cannot be used due to design revisions and needs to be remade. A product needs to be developed from research and development to mass production. To make a variety of crimping bottom molds, it is necessary to repeatedly pay the cost of crimping bottom molds

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0025] The technical term involved in the present invention and explanation are as follows:

[0026] Crimp: Crimp connection, as the name suggests, is to press an interference-sized plug into a drilled through hole on a printed circuit board. As a widely accepted and used non-soldering technology, it is used to connect a connector plug to a printed circuit board with high reliability, plug safety and ease of operation.

[0027] Bottom mold: Bottom mold, which plays the role of limit, bottom protection and support.

[0028] Air flotation: use jet high-pressure air to make the object to be blown float or reduce the weight of the object to be blown, and it is convenient to move.

[0029] Material packaging silk screen frame: refers to the outline frame of the components on the PCB, which is expressed in the form of regular or irregular lines composed of lines in the design software, and the form of expression on the PCB is generally the regular or irregular shape formed by white...

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PUM

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Abstract

The invention relates to a crimping bottom die, which belongs to the technical field of crimping bottom dies for electronic products. The invention includes a base and a support block, the support block includes a support block for position limiting and positioning and a support block for crimping materials, the support block for position limiting and positioning is a position limiting support block or a positioning support block or a combination of both, and the crimping material Use the support block as the support block for the feet or the support block for the feet or a combination of the two. The height of the bottom of the support block to the top of the bottom of the PCB board is consistent; the support blocks are arranged on the upper surface of the base, and the base and the support block Adhered together based on magnetic force. The invention modularizes and standardizes the bottom support block corresponding to the crimping material, and then selects the corresponding standardized support block according to the crimping material in actual use; uses the simple principle of magnetic force to fix the support block and the base. The invention can be generally used for crimping of different electronic products.

Description

technical field [0001] The invention relates to a crimping bottom die, which is a crimping bottom die used in the crimping process of electronic products, and belongs to the technical field of crimping bottom dies for electronic products. Background technique [0002] With the advancement of science and technology, the development and requirements of technology, the use of crimping devices such as high-speed connectors in the communication industry, aerospace, national defense and ships has become more and more widespread; at the same time, the modularization of products, the convenience of installation and maintenance The modernization also makes the use of crimping materials more and more, and the demand for crimping bottom molds in the corresponding product production process is also increasing. [0003] In the crimping process of electronic products, due to the different sizes of products, the distribution of crimping devices (including but not limited to high-speed conn...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K3/30
CPCH05K3/306H05K2203/0165
Inventor王刚
OwnerMAIPU COMM TECH CO LTD