Anti-static packaging unit for high-grade electronic components

An electronic component and anti-static technology, which is applied in the field of anti-static packaging units for advanced electronic components, can solve the problems of limited anti-static effect, lack of long-term usability, and lack of aesthetics, and achieve non-destructive and good static dissipation functions Effect

Inactive Publication Date: 2020-04-24
TIANJIN XIANGLONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even the most obvious precautions cannot guarantee adequate ESD protection for electronically sensitive components
At present, the anti-static protection measures on the market use the anti-static agent to continuously

Method used

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  • Anti-static packaging unit for high-grade electronic components
  • Anti-static packaging unit for high-grade electronic components
  • Anti-static packaging unit for high-grade electronic components

Examples

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Embodiment Construction

[0015] Now in conjunction with the accompanying drawings, the structure and use of the present invention will be further described. As shown in the figure, the anti-static packaging unit includes 1, box, 2, box cover, 3, iron sheet, 4, anti-static protective film, 5, storage box, 6, sealing strip, 7, magnet, 8, anti-pressure block . Its specific structure is an anti-static packaging unit for advanced electronic components, including a box and a box cover. The side wall of the box is inlaid with iron sheets and anti-static protective films. There is a storage box inside the box, and a sealing strip is fixed on the surface of the box cover. and anti-pressing blocks, the inside of the sealing strip is inlaid with several magnet strips, and the inside of the cover is provided with an anti-static protective film; there are three storage boxes, each of which is provided with a cover that can be opened and closed, and each plant Three electronic components can be placed in the box, ...

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PUM

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Abstract

The invention discloses an anti-static packaging unit for high-grade electronic components. The anti-static packaging unit comprises a box and a box cover; an iron sheet and an anti-static protectivefilm are embedded in the side wall of the box; storage boxes are arranged in the box, a sealing strip and an anti-pressing block are fixedly connected to the surface of the box cover, a plurality of magnet strips are embedded in the sealing strip, and the anti-static protective film is arranged in the box cover; each of the three storage boxes is provided with a cover capable of being opened and closed, three electronic elements can be placed in each storage box, and nine electronic elements can be placed in total. The box body and the anti-static protective film are fixedly assembled, so thatattractiveness is achieved, and the anti-static packaging unit is suitable for transportation of high-grade electronic elements; the used anti-static protective film is made of an electrostatic consumable material, has a good electrostatic dissipation function, does not depend on environmental humidity, is not easy to damage, and has permanent antistatic property.

Description

technical field [0001] The invention relates to an antistatic packaging unit for high-grade electronic components. Background technique [0002] Movement is unavoidable throughout the manufacturing process of electronic component products. Devices move from one place to another, and during the movement they come into contact with various materials. Even the most obvious precautions cannot guarantee adequate ESD protection for electronically sensitive components. At present, the anti-static protection measures on the market use the anti-static agent to continuously absorb moisture to produce anti-static effect, but this anti-static effect is limited and does not have long-term usability, and the anti-static agent is placed randomly In the storage box, it is not aesthetically pleasing. Contents of the invention [0003] In order to overcome the above disadvantages, the purpose of the present invention is to provide a high-grade electronic component anti-static packaging un...

Claims

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Application Information

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IPC IPC(8): B65D25/14B65D53/02
CPCB65D25/14B65D53/02
Inventor 孙伯柱
Owner TIANJIN XIANGLONG ELECTRONICS CO LTD
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