Wafer cleaning device

A technology for cleaning devices and wafers, applied in cleaning methods and tools, cleaning methods using tools, cleaning methods using liquids, etc., can solve problems affecting wafer quality, easily scratching wafers, and low cleaning efficiency. Achieve the effect of unaffected quality and qualified rate, clean and thorough scrubbing, and improved scrubbing efficiency
CN111681978AActive Publication Date: 2020-09-18SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
Publication Date
2020-09-18

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Abstract

The invention belongs to the technical field of wafer production and processing, and provides a wafer cleaning device, which comprises a cleaning workbench, wherein a cleaning box is installed on thecleaning workbench, a wafer taking and placing opening is formed in one side of the cleaning box, an installation frame driven by a first driving device is installed below the cleaning workbench in asliding mode, a vacuum pipe driven by a second driving device is rotationally installed on the installation frame, a Bernoulli sucking disc is installed at the top end of the vacuum pipe, a lower mounting plate driven by a third driving device is further slidably mounted on the cleaning workbench, an upper mounting plate driven by a fourth driving device is slidably mounted on the lower mounting plate, one end of the upper mounting plate extends into the cleaning box and is rotatably provided with a rotating shaft driven by a fifth driving device, and a sponge brush head is fixedly mounted atthe bottom end of the rotating shaft. According to the invention, automatic scrubbing of the wafer is achieved, the scrubbing efficiency is greatly improved, scrubbing is clean and thorough, secondarypollution and scratching cannot be caused to the wafer, and it is guaranteed that the quality and the percent of pass of the wafer are not affected in the scrubbing process.
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Description

technical field

[0001] The invention relates to the technical field of wafer production and processing, in particular to a wafer cleaning device. Background technique

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. With the continuous shrinking of the critical dimensions of semiconductor devices and the introduction of new materials, during the production and processing of wafers, the requirements for the cleanliness of the wafer surface are becoming more and more stringent, and multiple cleanings are usually required to remove Attached dirt and process fluid.

[0003] At present, the cleaning of wafers is usually divided into two methods: tank cleaning and single-chip cleaning; tank cleaning is to put the wafer in the cleaning tank for cleaning, which can realize the cleaning of several wafers at the same time, with high cleaning efficiency , but the cleaning effect on ...

Claims

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