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Smartphone integrated vapor chamber

A smart phone and integrated technology, applied in indirect heat exchangers, electric solid devices, semiconductor devices, etc., can solve problems such as poor cooling efficiency, damage to the vapor chamber, and adverse effects of heat dissipation

Inactive Publication Date: 2020-10-20
POLAR&CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In this regard, in existing smartphones, the heat generated in the internal central processing unit (CPU) and battery (Battery) is cooled by using a heat pipe structure, but this existing vapor chamber has Disadvantages of increased thickness and poor cooling efficiency
[0006] In more detail, when using a vapor chamber made of copper material, since the inner thickness increases by 0.5mm, and the copper material is very soft, the vapor chamber is easily damaged by a slight impact or contact, and the vapor chamber Bonding both sides to the inner frame of the smartphone creates thermal resistance and adversely affects heat dissipation

Method used

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Embodiment Construction

[0042] Before describing multiple embodiments of the present invention in detail, it should be understood that the application of the present invention is not limited to the detailed structures and arrangements of the structural elements described in the following detailed description or shown in the accompanying drawings. The invention can be realized and carried out in other embodiments and in various ways. Also, it should be understood that reference to, for example, the orientation of a device or element (e.g., "front", "back", "up", "down", "top" , "bottom (bottom)", "left (left)", "right (right)", "lateral (lateral)" and other terms, the expressions and terms herein are only used to simplify the description of the present invention, It does not indicate or imply that the relative device or element must have a specific orientation. In addition, terms such as "first" and "second" are used in the present invention and the appended claims for the purpose of illustration, an...

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Abstract

The present invention relates to a smartphone integrated steam chamber. More specifically, provided is the smartphone integrated steam chamber, which can manufacture a steam chamber on a smartphone frame in an integrated type without changing the thickness. A mounting portion is formed on the smartphone frame to mount the steam chamber, and a stepped edge is formed on a rim between each other foreasy coupling between each other. On the stepped edge, grooves and protrusions are further formed to increase the fastening force, so as to be applicable to a structure in which the steam chamber is integrally combined to the smartphone frame and a structure in which the steam chamber is formed on a smartphone frame itself.

Description

technical field [0001] The present invention relates to a smartphone-integrated vapor chamber that is integrally formed with a smartphone frame without changing the thickness. Background technique [0002] As far as the basic structure of a smart phone is concerned, the current smart phone has the following structure: a frame structure made of stainless steel, magnesium or aluminum is arranged inside, a display (Display) is installed in front of the frame, and a drive circuit and Battery. [0003] For such smartphones, since the central processing unit (CPU) has a fast processing speed and can perform various tasks, the CPU has a heavy workload, and thus the CPU generates a lot of heat. In particular, it is not easy to provide an effective cooling unit on a smartphone due to the thin structure of the smartphone. [0004] Therefore, a large amount of heat is generated in the smartphone, and the excessive heat generated in the smartphone may cause discomfort and anxiety of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H01L23/367H01L23/46
CPCH01L23/367H01L23/46H04M1/026F28D15/0233F28D15/046F28D2021/0029F28F3/12H01L23/427H05K7/20336H04M1/0202
Inventor 李基雨金宗善金相景崔京龙
Owner POLAR&CO
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