Display module and electronic equipment

A technology of display module and fingerprint module, applied in the field of communication, can solve the problems of large overall thickness of the module and high difficulty in the bonding process of ultrasonic fingerprint module, so as to reduce the bonding process, reduce the bonding damage, and reduce the overall thickness. The effect of thickness

Pending Publication Date: 2021-04-06
VIVO MOBILE COMM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the embodiment of the present application is to provide a display module and electronic equipment, which can solve the problems of the existing ultrasonic fingerprint module lamination process is difficult, and the overall thickness of the module is relatively large

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  • Display module and electronic equipment
  • Display module and electronic equipment
  • Display module and electronic equipment

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0022] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "sec...

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Abstract

The embodiment of the invention provides a display module and electronic equipment and belongs to the technical field of communication. The display module comprises a packaging layer, a base layer, a light-emitting layer, a light-emitting circuit, a functional chip, an FPC and a fingerprint module, wherein the base layer comprises a first area and a second area, and the packaging layer covers the first area of the base layer; the light-emitting layer and the light-emitting circuit are arranged between the packaging layer and the base layer and located in the first area of the base layer; a functional chip binding area, an FPC binding area and a fingerprint module area are arranged in the second area of the base layer; the functional chip is arranged in the functional chip binding area, the FPC is arranged in the FPC binding area, and the fingerprint module is arranged in the fingerprint module area; the fingerprint module is electrically connected with the FPC. The display module is advantaged in that the fingerprint module is directly manufactured on the base layer, an original mode of attaching the fingerprint module to the back surface of the base layer is replaced, the overall thickness of the display module is greatly reduced, the attaching process is reduced, the attaching damage to the display module is reduced, and an under-screen fingerprint recognition function is realized.

Description

technical field [0001] The embodiments of the present application relate to the field of communication technologies, and in particular to a display module and electronic equipment. Background technique [0002] Ultrasonic fingerprints can only be applied to flexible screens with no gaps in the stack at present, and fingerprints need to be attached to the back of the flexible screen with a separate module using double-sided tape. The process is cumbersome, and the flexible screen itself has poor strength and is not pressure-resistant. Local force cannot be applied, and the bonding process can easily cause damage to the display screen, resulting in poor appearance or functionality, and the manufacturing difficulty and cost are high. [0003] At the same time, the ultrasonic fingerprint module is an independent module, and it is pasted with double-sided tape, which affects the thickness of the entire module. Contents of the invention [0004] The purpose of the embodiment of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32G06K9/00G09F9/30
CPCG09F9/301G06V40/1306H10K59/00H10K59/12
Inventor 王湖海
Owner VIVO MOBILE COMM CO LTD
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