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Electronic package and manufacturing method thereof

A technology for electronic packaging and electronic components, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as difficulty in preventing electromagnetic interference.

Pending Publication Date: 2021-07-06
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, although the periphery of the existing radio frequency module 1 can be coated with the metal film 14 to avoid EMI, if the radio frequency chips 11a, 11b are low frequency components, it is still difficult to prevent electromagnetic interference with a single metal film 14 as a barrier layer.

Method used

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  • Electronic package and manufacturing method thereof
  • Electronic package and manufacturing method thereof
  • Electronic package and manufacturing method thereof

Examples

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Embodiment Construction

[0047] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0048] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "first", "second", "uppe...

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Abstract

An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

Description

technical field [0001] The invention relates to a semiconductor packaging process, in particular to an electronic package with a shielding structure and its manufacturing method. Background technique [0002] With the vigorous development of the electronic industry, most electronic products are developing toward the goal of miniaturization and high speed, especially the development of the communication industry has generally integrated communication devices into various electronic products, such as mobile phones (Cell phone) , laptop (laptop), etc. However, the above-mentioned electronic products need to use high-frequency radio frequency chips, and the radio frequency chips may be adjacent to digital integrated circuits, digital signal processors (Digital Signal Processor, DSP) or baseband chips (BB, Base Band), causing electromagnetic interference ( Electromagnetic Interference, referred to as EMI) problem, so it is necessary to carry out electromagnetic shielding (Electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/31H01L21/50H01L21/56
CPCH01L23/552H01L23/3107H01L23/3114H01L21/50H01L21/56H01L21/561H01L23/3121H01L2224/48227H01L2224/32225H01L2224/73265H01L2924/15192H01L2924/3025H01L2224/97H01L2924/19107H01L2224/48247H01L2224/16227H01L2224/16245H01L2224/32245H01L24/16H01L24/48H01L24/97H01L23/49822H01L2224/45144H01L24/45H01L24/49H01L2224/48091H01L2924/181H01L2224/16225H01L24/85H01L2224/4917H01L2224/85H01L2224/81H01L2924/00H01L2924/00014H01L2924/00012H01L21/4853H01L21/565H01L23/49838
Inventor 蔡明汎陈志伟蔡宗贤杨超雅陈嘉扬
Owner SILICONWARE PRECISION IND CO LTD
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