Communication chip for single-wire power supply communication

A communication chip, single-wire technology, applied in the field of communication chips for single-wire power supply communication, can solve the problems of affecting use and slow communication speed of the chip, and achieve the effect of reducing the transmission time and speeding up the communication speed.

Pending Publication Date: 2021-07-20
NATIONZ TECH INC
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current single-bus communication uses a single signal line for communication, which can save input/output communication resources, has a simple structure, low cost, and is convenient for bus expansion and maintenance, etc., and is widely used; Infineon chip single-bus solution, Maxim chip single-bus solution adopts single-bus power

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Communication chip for single-wire power supply communication
  • Communication chip for single-wire power supply communication
  • Communication chip for single-wire power supply communication

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Next, the technical solutions in the present application embodiment will be clear and complete, and it is understood that the described embodiments are merely described herein, not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor premises, all of the present application protected.

[0022] See figure 1 , figure 1 It is a schematic structural diagram of an embodiment of a communication chip provided by the present application for single-line power supply communication, and the communication chip is connected to other communication chips by a power supply communication line, and the communication chip includes a transmission circuit 10.

[0023] The power supply communication line can transmit the power supply signal and the communication signal, and the transmission circuit 10 is connected to the power supply communication line to...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a communication chip for single-wire power supply communication, the communication chip is connected with other communication chips through a power supply communication line, the communication chip comprises a transmitting circuit, the transmitting circuit is connected to the power supply communication line to generate a transmitting signal on the power supply communication line, the transmitting circuit generates a full-modulation transmitting signal in a first modulation working mode and generates a non-full-modulation transmitting signal in a second modulation working mode; wherein the modulation speed of the non-full modulation sending signal is higher than the modulation speed of the full modulation sending signal. Through the above mode, the communication speed can be improved while single-line power supply is realized.

Description

Technical field [0001] The present application relates to the field of integrated circuit technology, and more particularly to a communication chip for single-wire supply communication. Background technique [0002] The current single-bus communication uses a single signal line to communicate, saving input / output communication resources, simple structure, low cost, easy bus expansion and maintenance, is widely used; single bus communication scheme includes US letter chip single bus scheme and English Flying Ling Chip Single Bus Solution, USC Chip Single Bus Scheme Adopt Single Bus Power Supply and Communication, due to the need to take care of single-line communication and power supply, chip communication rate is slower; Yingfa Ling chip single bus plan medium single bus communication rate can be equipped, support fast Communication, but requires a separate power supply to use in some scenarios. Inventive content [0003] The present application provides a communication chip f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H04B1/40H04B1/401
CPCH04B1/40H04B1/401
Inventor 石道林赵辉梁洁
Owner NATIONZ TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap