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A glue coating equipment for power amplifier chip production

A power amplifier and gluing technology, which is applied to the cleaning method, coating, cleaning method and utensils of tools, can solve the problems that the power amplifier chip cannot be dusted and the dust ingress rate can be reduced.

Active Publication Date: 2021-11-02
北京澳丰源科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a kind of gluing equipment for the production of power amplifier chips, to solve the problem that in the prior art, the power amplifier chips cannot be dedusted before installation and gluing, and the power amplifier chips can be minimized during the installation and gluing process. Technical problems of ash rate

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  • A glue coating equipment for power amplifier chip production
  • A glue coating equipment for power amplifier chip production
  • A glue coating equipment for power amplifier chip production

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] Combine below Figure 1 to Figure 11 As shown, the embodiment of the present invention provides a kind of gluing equipment for the production of power amplifier chips, including a dust removal device 1, a chip mounting device 3 and a gluing device 4, and the chip mounting device 3 is arranged on one side of the dust removal device 1 , the gluing device 4 i...

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Abstract

The invention discloses a gluing device for power amplifier chip production, which belongs to the technical field of power amplifier chip production equipment, and includes a dust removal device, a chip mounting device and a gluing device, and the chip mounting device is arranged on one side of the dust removal device , the gluing device is installed under the chip mounting device, the dust removal device includes a dust removal part, a moving assembly, an inflatable assembly and a replacement assembly, the moving assembly includes a base platform and a first electric push rod, and the first electric push rod The push rod is horizontally arranged on the top of the base platform, the inflatable assembly is installed on the output end of the first electric push rod, the replacement assembly is arranged on one side of the inflatable assembly, and the dust removal part is installed on the replacement assembly; the present invention Dust removal, gluing and installation operations can be carried out when the chip base and chip cover are at a small distance, which can greatly reduce the dust ingress rate during gluing, thereby improving the quality of the power amplifier chip Rate.

Description

technical field [0001] The invention relates to the technical field of power amplifier chip production equipment, in particular to a glue coating equipment for power amplifier chip production. Background technique [0002] Power amplifier (English name: power amplifier), referred to as "power amplifier", refers to an amplifier that can generate maximum power output to drive a certain load (such as a speaker) under a given distortion rate. The power amplifier plays a pivotal role in the "organization and coordination" of the entire audio system, and to some extent determines whether the entire system can provide good sound quality output. [0003] In the production and processing of the chip in the power amplifier, gluing is an essential process. The power amplifier chip is usually set on the chip base, and then the power amplifier chip is installed by bonding the chip base and the chip cover. Inside the chip base and chip cover, the chip is a relatively precise part product...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C9/10B08B1/00B08B13/00B05C5/02
CPCB05C5/0212B05C9/10B08B1/001B08B13/00
Inventor 孟剑姚建海
Owner 北京澳丰源科技股份有限公司
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