Instrument with double-layer linkage flip cover
A flip-cover and instrument technology, applied in the field of instruments, can solve problems such as limited terminal space and inability to meet electrostatic protection requirements, and achieve the effects of reducing the number of lead seals, improving instrument safety, and simplifying wiring steps.
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[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] Such as figure 1 Shown is an instrument with a double-layer interlocking flip cover, including an outer flip cover 1 , an inner flip cover 2 , a first housing 3 , a second housing 4 and a circuit board assembly 5 .
[0035] Such as figure 2 As shown, the outer flip cover 1 includes the outer flip cover body, the inner bottom of the ...
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