Interconnection structure, manufacturing method thereof and memory
A technology of interconnect structure and manufacturing method, which is applied in the field of semiconductors and can solve problems such as small critical dimensions and reduced reliability of semiconductor devices
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[0058] In order to make the technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be further described in detail below with reference to the drawings and embodiments. While the drawings show exemplary embodiments of the invention, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.
[0059] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, a...
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