Connecting method of printed circuit board

Abstract

By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.

Description

technical field [0001] The invention relates to a connection structure and a connection method of printed circuit boards, in particular to a connection method of printed circuit boards with laminated configuration. Background technique [0002] In order to control the power supplied from the power source to the load, a control module is inserted into the power supply line. [0003] In this control module, in addition to a power control element for controlling electric power, a control element for controlling the power control element is generally mounted. [0004] Therefore, a common control module is composed of a control substrate for controlling elements and a power substrate on which power control elements are mounted, that is, two types of substrates. The electrical connections between the substrates are made using copper wires. [0005] Furthermore, lead wires are generally fixed at predetermined positions by resin frames (see Patent Document 1). [0006] Furthermor...

AI Technical Summary

Problems solved by technology

[0014] 1. Since the formed wire must pass through the frame to make the wire and the frame integrally formed into a mold to make the terminal, the price of the terminal itself is high

[0015] 2. Since the upper end of the wire is to be inserted into the through hole of the control board, it is required to manage the relative position of the wire and the connection hole to a specified accuracy, and it is difficult to maintain the specified accuracy by molding alone

[0016] 3. Since the frame of the terminal block is a "mouth" shape, the area of ​​the terminal block on the substrate is large, resulting in a reduction in the area of ​​the actual mountable components

[0017] 4. Since the terminal material resin has a temperature limit, strict temperature management and engineering management must be carried out when welding the connection joint between the connection part and the substrate

[0018] That is to say, in the conventional connection structure, since the molded terminal is mounted on the substrate after forming, it is difficult to ensure the relative accuracy of the wire and the substrate.

Images