Heating exchange chamber for liquid state cooling fluid

Abstract

A heat exchange chamber for liquid state cooling fluid is provided, which comprises a thermal dissipation device, and the thermal dissipation device sites in a cavity of the heat exchange chamber for liquid state cooling fluid. The thermal dissipation device comprises a plate and a plurality of heat dissipating fins formed on the plate, and the thermal dissipation device comprises at least one groove. After flowing through the heat dissipating fins, partial cooling fluid absorbs the heat of the heat dissipating fins and gasifies to bubbles. The design of the groove could discharge the bubbles trapped between heat dissipating fins helpfully and improve the efficiency of heat dissipation.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims benefits and priority under 35 U.S.C. §119(a) on Patent Application No. 099136465 filed in Taiwan, R.O.C. on Oct. 26, 2010, the entire contents of which are hereby incorporated by reference.FIELD OF THE INVENTION[0002]The present invention relates to a heat dissipation module using cooling fluid, and more particularly, to a heat exchange chamber capable of discharging bubbles trapped between its heat dissipating fins smoothly and easily whereas the bubbles are the partially gasified cooling fluid after or during the flowing through of the heat dissipating fins.BACKGROUND OF THE INVENTION[0003]In many typical mainframe computers such as servers, poor heat dissipation performance is usually the case that cause the computer to malfunction so that how to design a heat dissipating fin or heat dissipating device with optimized heat dissipation performance is becoming the key issue in modern electronic com...

AI Technical Summary

Benefits of technology

[0006]In view of the disadvantages of prior art, the primary object of the present invention is to provide a heat exchange chamber capable of discharging bubbles trapped between its heat dissipating fins smoothly and easily whereas the bubbles are the partially gasified cooling fluid after or during the flowing through of the heat dissipating fins.

Problems solved by technology

In many typical mainframe computers such as servers, poor heat dissipation performance is usually the case that cause the computer to malfunction so that how to design a heat dissipating fin or heat dissipating device with optimized heat dissipation performance is becoming the key issue in modern electronic computing industry.

And not to mention that the complexity of the heat dissipation system for modern cloud data centers that are crowded with servers in high density is generally almost double comparing with those for common data centers.

The results can be ugly if there is no proper heat dissipation system with good performance available and consequently all distinct possibilities can be caused, such as the operation of the servers may be unstable or even fail, energy can be wasted, the performance of the personnel working in the server room may be poor since an uncomfortable working environment can be resulted, the cost for managing the server room may increase, and so on.

However, during the heat exchanging process, a portion of such liquid state cooling fluid flowing in the heat exchange chamber will be vaporized by the heat absorbed thereby, and since the bubbles resulting from the vaporized cooling fluid will massively accumulated inside the heat exchange chamber and trapped between its heat dissipating fins, the flowing of the cooling fluid inside the heat exchange chamber can be blocked or even clogged and thus the heat dissipation performance of the heat exchange chamber is adversely affected.

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