Display device and manufacturing method thereof

Abstract

The present invention provides a display device and a manufacturing method thereof, the method comprising: providing a backplate, the backplate comprises a substrate and a driving circuit set on the substrate; providing a plurality of LED chips; transferring the LED chips vertically to the backplate to electrically connect the bottom electrode of the LED chips to the driving circuit; providing a cover plate, the cover plate comprises a plate body and a ground circuit set on the plate body; covering the backplate with the cover plate, such that the ground circuit is aligned with at least a portion of the driving circuit, and the top electrode of each of the LED chips is electrically connected to the ground circuit; and pressing the cover plate, such that the LED chips are tilted relative to a vertical direction.

Description

BACKGROUND OF INVENTIONField of Invention[0001]The present invention relates to the display technology field, particularly to a display device and a manufacturing method thereof.Description of Prior Art[0002]Due to the advantages of high display quality, power saving, thinness, and wide application range, flat display devices have been widely used in a variety of consumer electronic products such as mobile phones, TV sets, personal digital assistants, digital cameras, laptops, and desktop computers, and have gone mainstream.[0003]Micro light emitting diode (micro LED) / mini light emitting diode (mini LED) display devices are a kind of display devices that display images by an array of small size LEDs in high density integrated on a substrate as pixels. Like a large size outdoor LED display device, each pixel of a micro LED / mini LED display device can be addressed and driven individually, and micro LED / mini LED display devices can be deemed as a smaller version of an outdoor LED displ...

AI Technical Summary

Benefits of technology

The present invention is a method for manufacturing a display device that improves resolution, penetration, and display quality. The method involves providing a backplate with a driving circuit, transferring LED chips vertically to the backplate to connect them to the driving circuit, and covering the backplate with a cover plate that aligns with the driving circuit. The LED chips are then pressed to tilt them relative to a vertical direction, which increases resolution, penetration, and display quality. Overall, the method allows for a better display performance.

Problems solved by technology

Consumers who have experienced a virtual reality (VR) / augmented reality (AR) head-mounted display device are aware of the fact that improving the resolution is the biggest bottleneck for developing the head-mount display device.

Although the present micro LED / mini LED display devices can achieve 50% of penetration in a way of active driving by manufacturing metal oxide semiconductor thin film transistor on a glass substrate, it is not enough to satisfy the need of the application environment of AR / VR display devices and automobile glass windshields, which requires a penetration greater than 70%.

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