Coupling sheet and method for manufacturing coupling sheet

Abstract

The present invention provides a coupling sheet and a method for manufacturing the coupling sheet, belonging to the field of communication technology, comprising a substrate, on the front side of the substrate, a first circuit layer and a second circuit layer are stacked in sequence from bottom to top, an insulating medium layer is arranged between the first circuit layer and the second circuit layer, and a packaging layer is arranged on the second circuit layer. The coupling sheet provided by the present invention has a first circuit layer and a second circuit layer stacked on the substrate, the first circuit layer and the second circuit layer are separated by an insulating medium layer, and when the breakdown voltage is met, the thickness of the printed insulating medium layer is very thin, which can reduce the distance between the coupling circuits and improve the coupling effect of the device; at the same time, due to the stacked arrangement of the coupling circuits, the volume of the device can also be reduced, and the production cost can be reduced; because the coupling circuit is manufactured on a substrate, the amount of the substrate is reduced, and the production cost of the product is also reduced.

Description

Technical Field

[0001] The present invention belongs to the field of communication technology, and more specifically, relates to a coupling sheet and a method for manufacturing the coupling sheet. Background Art

[0002] There are two ways to make a traditional coupling film: one is to make a coupling circuit on the same side of the substrate, and the other is to use LTCC (LTCC-Low Temperature Co-fired Ceramic) low temperature co-fired ceramic technology to make a coupling circuit. In the first production method, it is difficult to minimize the distance between the coupling circuits. Based on the coupling principle that the closer the distance, the better the coupling effect, if the first coupling film needs a better coupling effect, it is necessary to increase the volume of the coupling film. The volume of the coupling film is difficult to reduce. The large volume, on the one hand, due to the large spacing between the circuits, the coupling effect is poor; on the other hand, it does not meet the current market demand for the miniaturization of devices, and also increases the production cost. The second production method uses three substrates stacked together, and the coupling circuit is printed on both sides of the middle substrate. Since the middle substrate has a certain thickness, it cannot be made the thinnest, and there is also a large spacing between the coupling circuits, and the coupling effect is poor; and during the stacking process, if the middle circuit substrate is deformed, cracked, and other defects occur, the outside world cannot observe the internal structure state in time, which will cause the problem of difficult control of the yield rate, increased defective rate, and high production cost. Summary of the invention

[0003] The purpose of the present invention is to provide a coupling plate, aiming to solve the problems of poor coupling effect and high manufacturing cost of existing coupling plates.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a coupling sheet, including a substrate, on the front side of the substrate, a first circuit layer and a second circuit layer are stacked in sequence from bottom to top, an insulating medium layer is provided between the first circuit layer and the second circuit layer, and a packaging layer is provided on the second circuit layer.

[0005] As another embodiment of the present application, a first port and a third port are respectively provided at two ends of the first circuit layer, a second port and a fourth port are respectively provided at two ends of the second circuit layer, and among the four ports, one is an input port and three are output ports.

[0006] As another embodiment of the present application, an isolation resistor is provided on the substrate, one of the three output ports is an isolation port, and the isolation resistor is close to the isolation port and connected to the isolation port.

[0007] As another embodiment of the present application, the back side of the substrate is provided with four signal pads for signal lead-out and a ground pad for grounding, and the four signal pads correspond one-to-one to the first port, the second port, the third port and the fourth port, and the side of the substrate is provided with signal connecting lines and ground connecting lines, and the first port, the second port, the third port and the fourth port are respectively connected to the corresponding signal pads through different signal connecting lines; the ground end of the first circuit layer and the ground end of the second circuit layer are connected to the ground pad through the ground connecting line.

[0008] As another embodiment of the present application, a side surface of the substrate is provided with a metallized through hole used as the signal connection line and the ground connection line.

[0009] As another embodiment of the present application, the first port, the second port, the third port and the fourth port are respectively located at the four corners of the front side of the substrate, the corresponding four signal pads are arranged at the four corners of the back side of the substrate, the ground pad is located in the middle of the back side of the substrate, and the signal pad and the ground pad are isolated by an insulating isolation tape.

[0010] As another embodiment of the present application, the ground connection lines are symmetrically arranged on four sides of the substrate.

[0011] As another embodiment of the present application, the first circuit layer, the insulating medium layer and the second circuit layer are stacked in a stepped manner.

[0012] As another embodiment of the present application, the substrate is a ceramic substrate.

[0013] The present invention also provides a method for manufacturing a coupling sheet, the manufacturing method comprising:

[0014] printing a back conductor layer on the back side of the substrate;

[0015] sintering the back conductor layer;

[0016] Printing a first circuit layer on the front side of the substrate;

[0017] sintering the first circuit layer;

[0018] printing an insulating dielectric layer on the first circuit layer;

[0019] Sintering the insulating dielectric layer;

[0020] Printing a second circuit layer on the insulating dielectric layer;

[0021] sintering the second circuit layer;

[0022] printing a packaging layer on the second circuit layer;

[0023] sintering the encapsulation layer;

[0024] Connecting the areas to be connected on both sides of the substrate through side connection;

[0025] Electroplating protective layer.

[0026] The coupling sheet and the manufacturing method provided by the present invention have the following beneficial effects: compared with the prior art, the coupling sheet of the present invention has a first circuit layer and a second circuit layer stacked on a substrate, and only an insulating dielectric layer is provided between the first circuit layer and the second circuit layer. When the breakdown voltage is met, the thickness of the printed insulating dielectric layer is very thin, which can reduce the distance between the coupling circuits and improve the coupling effect of the device; at the same time, since the coupling circuits are stacked, the volume of the device can be reduced and the production cost can be reduced; since the coupling circuits are manufactured on a substrate, the amount of the substrate is reduced, and the production cost of the product is also reduced.

[0027] The invention has a simple structure, is easy to manufacture, has a small volume, has a good coupling effect, and has a low production cost, and can improve the competitive advantage of an enterprise in the market and bring good economic benefits to the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the front three-dimensional structure of a coupling sheet provided in an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of the back three-dimensional structure of a coupling sheet provided in an embodiment of the present invention;

[0031] Figure 3 A schematic diagram of the front planar structure of a coupling sheet provided in an embodiment of the present invention;

[0032] Figure 4 For along Figure 3 The cross-sectional structure diagram along the AA line;

[0033] Figure 5 For along Figure 3 The cross-sectional structure diagram of the middle BB line;

[0034] Figure 6 A schematic diagram of the back plane structure of a coupling sheet provided in an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of the three-dimensional structure of the coupling sheet provided in an embodiment of the present invention after hiding the second circuit layer;

[0036] Figure 8 A schematic diagram of the three-dimensional structure of the coupling sheet provided in an embodiment of the present invention after hiding the second circuit layer and the insulating medium layer;

[0037] Fig. 9 for Figure 8 A schematic diagram of the front planar structure of the coupling piece provided;

[0038] Fig.10 A schematic diagram of the structure of stacking a first circuit layer and a second circuit layer of a coupling sheet provided by an embodiment of the present invention.

[0039] In the figure: 1, substrate; 2, ground connection line; 3, insulating dielectric layer; 4, signal connection line; 5, second circuit layer; 51, fourth port; 52, second port; 6, signal pad; 7, insulating isolation zone; 8, ground pad; 9, first circuit layer; 91, first port; 92, third port. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0041] Please also read Figures 1 to 10 The coupling sheet provided by the present invention is now described. The coupling sheet comprises a substrate 1, on the front side of the substrate 1, a first circuit layer 9 and a second circuit layer 5 are stacked in sequence from bottom to top, an insulating medium layer 3 is arranged between the first circuit layer 9 and the second circuit layer 5, and a packaging layer is arranged on the second circuit layer 5.

[0042] Compared with the prior art, the coupling sheet provided by the present invention has a first circuit layer 9 and a second circuit layer 5 stacked on a substrate 1, and only an insulating dielectric layer 3 is provided between the first circuit layer 9 and the second circuit layer 5. When the breakdown voltage is met, the thickness of the printed insulating dielectric layer 3 is very thin, which reduces the distance between the coupling circuits and improves the coupling effect of the device. At the same time, since the coupling circuits are stacked, the volume of the device can be reduced and the production cost can be reduced. Since the coupling circuits are manufactured on a substrate 1, the amount of the substrate 1 is reduced, and the production cost of the product is also reduced.

[0043] The invention has a simple structure, is easy to manufacture, has a small volume, has a good coupling effect, and has a low production cost, and can improve the competitive advantage of an enterprise in the market and bring good economic benefits to the enterprise.

[0044] This embodiment is manufactured by low-temperature co-fired ceramic technology. The insulating dielectric layer 3 between the first circuit layer 9 and the second circuit layer 5 is manufactured by screen printing. The screen printing technology can obtain a very thin insulating dielectric layer 3. Therefore, the insulating dielectric layer 3 of the present invention can be made very thin while meeting the voltage breakdown resistance requirement, thereby reducing the distance between the coupling circuits.

[0045] As a specific implementation of the coupling sheet provided by the present invention, please refer to Fig.10 The first circuit layer 9 has a first port 91 and a third port 93 at both ends, and the second circuit layer 5 has a second port 52 and a fourth port 51 at both ends. Among the four ports, the first port 91, the second port 52, the third port 93 and the fourth port 51, one is an input port and three are output ports.

[0046] As a specific implementation of the embodiment of the present invention, an isolation resistor is provided on the substrate 1 (the isolation resistor is not shown in the figure), one of the three output ports is an isolation port, and the isolation resistor is close to the isolation port and connected to the isolation port. In this embodiment, the isolation resistor is integrated on the substrate 1, and the isolation resistor is directly connected to the isolation port on the substrate 1. When manufacturing the device, there is no need to connect the isolation resistor outside the substrate 1, which improves the integration of the device and simplifies the structure.

[0047] In this embodiment, refer to Fig.10 , when the first port 91 is an input port, the other three ports are output ports; when the second port 52 is an input port, the other three ports are output ports. Specifically, when the first port 91 is an input port, the third port 93 at the other end of the first circuit layer 9 is an output port, the fourth port 51 of the second circuit layer 5 is a coupling port, and the second port 52 is an isolation port; when the first port 91 is an isolation port, the third port 93 is a coupling port, the second port 52 is an input port, and the fourth port 51 is an output port; when the first port 91 is an output port, the second port 52 is a coupling port, the third port 93 is an input port, and the fourth port 51 is an isolation port; when the first port 91 is a coupling port, the second port 52 is an output port, the third port 93 is an isolation port, and the fourth port 51 is an input port.

[0048] As a specific implementation of the embodiment of the present invention, please refer to Figure 1 to Figure 2 , Figures 8 to 9The back of the substrate 1 is provided with four signal pads 6 for signal lead-out and a ground pad 8 for grounding. The four signal pads correspond to the first port 91, the second port 52, the third port 93 and the fourth port 51 one by one. The side of the substrate 1 is provided with a signal connection line 4 and a ground connection line 2. The first port 91, the second port 52, the third port 93 and the fourth port 51 are respectively connected to the corresponding signal pads through the signal connection line 4; the ground end of the first circuit layer 9 and the ground end of the second circuit layer 5 are vertically connected to the ground pad 8 through the ground connection line 2. The signals of the first circuit layer 9 and the second circuit layer 5 are led out through the signal pad 6 through the signal connection line 4. When the signal needs to be grounded, it can be grounded through the ground pad 8 on the back of the substrate 1 through the ground connection line 2. By making the signal pad 6 and the ground pad 8 on the back of the substrate 1, it is also beneficial to reduce the size of the device and facilitate the miniaturization of the device.

[0049] As a specific implementation of the embodiment of the present invention, refer to Figure 1 and Figure 2 The side of the substrate 1 is provided with metallized through holes used as signal connection lines 4 and ground connection lines 2. In this embodiment, the side of the substrate 1 is provided with metallized through holes, which can be semicircular holes or arc-shaped holes with a cross section smaller than a semicircle.

[0050] As a specific implementation of the embodiment of the present invention, please refer to Figures 1 to 3 , Figures 8 to 9 The first port 91, the second port 52, the third port 93 and the fourth port 51 are respectively located at the four corners of the front side of the substrate 1, and the corresponding four signal pads 6 are arranged at the four corners of the back side of the substrate 1. The ground pad 8 is located in the middle of the back side of the substrate 1, and the signal pad 6 and the ground pad 8 are isolated by the insulating isolation tape 7. The positions of the four ports correspond to the ground pads 8 one by one, and the shortest transmission distance is achieved through the vertical connection of the signal connection line 4, which can not only shorten the material of the connection line and reduce the production cost, but also improve the effect of signal transmission.

[0051] As a specific implementation of the embodiment of the present invention, please refer to Figure 1 to Figure 2 The ground connection lines 2 are symmetrically arranged on four sides of the substrate 1 .

[0052] As a specific implementation of the embodiment of the present invention, please refer to Figure 1, the first circuit layer 9, the insulating dielectric layer 3 and the second circuit layer 5 are stacked in a stepped shape. Since the insulating dielectric layer 3 has a certain thickness during the printing process, which has a certain impact on the printing, the surface area and the outer contour size of the insulating dielectric layer 3 in the upper layer are smaller than the surface area and the outer contour size of the substrate 1, and the surface area and the outer contour size of the second circuit layer 5 are smaller than the surface area and the outer contour size of the insulating dielectric layer 3 in the next layer. The outer contour line after stacking is a step-like shape with a larger bottom and a smaller top, or the outer contour is a slope shape.

[0053] As a specific implementation of the embodiment of the present invention, the substrate 1 is a ceramic substrate 1, and an alumina ceramic substrate 1 is commonly used.

[0054] The present invention also provides a method for manufacturing a coupling sheet, the manufacturing method comprising:

[0055] S1, printing a back conductor layer on the back of the substrate 1; wherein the back conductor layer is screen-printed silver paste; the back conductor layer is divided into four signal pads 6 and a ground pad 8 located between the four signal pads 6 by an insulating isolation tape 7;

[0056] S2, sintering back conductor layer;

[0057] S3, printing a first circuit layer 9 on the front side of the substrate 1 by screen printing silver paste;

[0058] S4, sintering the first circuit layer 9;

[0059] S5, screen printing an insulating material with voltage breakdown resistance on the first circuit layer 9, and printing an insulating dielectric layer 3;

[0060] S6, sintering the insulating dielectric layer 3;

[0061] S7, screen printing silver paste on the insulating dielectric layer 3 to print the second circuit layer 5;

[0062] S8, sintering the second circuit layer 5;

[0063] S9, printing a packaging layer on the second circuit layer 5;

[0064] S10, sintering encapsulation layer;

[0065] S11, connecting the areas to be connected on both sides of the substrate through side connection, that is, connecting the four ports to the corresponding signal pads 6 respectively, and connecting the ground pad 8 to the ground end on the front side of the substrate 1;

[0066] S12, electroplating a protective layer, specifically electroplating a nickel layer and / or a silver layer on the outside of the semi-finished product made above, to improve the soldering resistance and solderability of the product and protect the circuit; after electroplating, inspection and packaging are carried out to complete the production of the coupling sheet.

[0067] The manufacturing method of the coupling sheet provided by the present invention adopts screen printing and lamination, and the manufacturing is simple. The manufactured coupling sheet has a small volume and good coupling performance, and meets the demand for miniaturization development of electronic components.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A coupling sheet, characterized in that: include: A substrate, on the front side of which a first circuit layer and a second circuit layer are stacked in sequence from bottom to top, an insulating medium layer is provided between the first circuit layer and the second circuit layer, and a packaging layer is provided on the second circuit layer; The first circuit layer has a first port and a third port at both ends, and the second circuit layer has a second port and a fourth port at both ends, wherein one of the four ports is an input port and three are output ports; An isolation resistor is provided on the substrate, one of the three output ports is an isolation port, and the isolation resistor is connected to the isolation port; The back side of the substrate is provided with four signal pads for signal lead-out and a ground pad for grounding, the four signal pads correspond to the first port, the second port, the third port and the fourth port one by one, the side of the substrate is provided with signal connection lines and ground connection lines, the first port, the second port, the third port and the fourth port are respectively connected to the corresponding signal pads through different signal connection lines; the ground end of the first circuit layer and the ground end of the second circuit layer are connected to the ground pads through the ground connection lines; The side surface of the substrate is provided with metallized through holes used as the signal connection line and the ground connection line; The first port, the second port, the third port and the fourth port are respectively located at the four corners of the front side of the substrate, the corresponding four signal pads are arranged at the four corners of the back side of the substrate, the ground pad is located in the middle of the back side of the substrate, and the signal pad and the ground pad are isolated by an insulating isolation tape.

2. The coupling sheet according to claim 1, characterized in that: The ground connection lines are symmetrically arranged on four side surfaces of the substrate.

3. The coupling sheet according to any one of claims 1 to 2, characterized in that: The first circuit layer, the insulating medium layer and the second circuit layer are stacked in a step-like manner.

4. The coupling sheet according to any one of claims 1 to 2, characterized in that: The substrate is a ceramic substrate.

5. A method for manufacturing a coupling sheet according to any one of claims 1 to 4, characterized in that: The production method comprises: printing a back conductor layer on the back side of the substrate; sintering the back conductor layer; Printing a first circuit layer on the front side of the substrate; sintering the first circuit layer; printing an insulating dielectric layer on the first circuit layer; Sintering the insulating dielectric layer; Printing a second circuit layer on the insulating dielectric layer; sintering the second circuit layer; printing a packaging layer on the second circuit layer; sintering the encapsulation layer; Connecting the areas to be connected on both sides of the substrate through side connection; Electroplating protective layer.

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