Device and method for cooling high-heat-flux device by using magnetic field

Abstract

The invention relates to the technical field of the cooling of high-heat-flux devices. The invention further discloses a device and a method for cooling a high-heat-flux device by using the magnetic field. The problems that the device and the method for cooling a high-heat-flux device by a magnetic field in the current market need an electromagnetic pump for active driving, an electromagnetic pumpoccupies a certain space and is restrained by space, the heat dissipation area is small, extra electric energy is consumed for driving the electromagnetic pump, the device does not have the capacityof being automatically adjusted along with the thermal power of a high-heat-flux device, and the single-loop heat exchange area is limited are solved. According to the invention, the device comprisesa heating device, the automatic driving under the seebeck effect and the magnetic field effect can be realized by using the temperature difference; an electromagnetic pump is not needed, the space constraint does not exist, the heat dissipation area is large, extra electric energy is not consumed, the automatic adjustment is conducted according to the thermal power of a high-current-density device, the automatic adaptation to cooling of electronic devices within a certain power range is achieved, and the flowing and heat exchange area of conductive fluid is increased through double annular loops.

Description

technical field

[0001] The invention belongs to the technical field of cooling devices with high heat flux density, and specifically relates to a device and method for cooling devices with high heat flux density by using a magnetic field. Background technique

[0002] At present, the use of conductive fluid in the market to cool high heat flux devices needs to be driven by electromagnetic pumps, and the flow speed of conductive fluid will not be automatically adjusted with the increase of heat flux density. The existing conductive fluid liquid metal cooling is driven by electromagnetic pumps. Next, the liquid metal flows into the heat exchanger to take the heat out to the external environment, and then flows back to the electromagnetic pump for the next cycle after being cooled by a cooling device such as a fan, so as to achieve the purpose of cooling; The dissipated heat drives the electromagnetic pump through the electric energy generated by the thermoelectric effect to re...

Examples

Embodiment 1

[0026] Embodiment one, by figure 1 Given, the present invention includes a heating device 1, a copper metal 2 is installed on the top of the heating device 1, a conductive fluid circuit 3 is provided on the surface of the copper metal 2, and a magnetic field coverage area 4 is provided on the surface of the copper metal 2 at the bottom of the conductive fluid circuit 3 , the top of the red copper metal 2 is equipped with a cooling fan 5.

Embodiment 2

[0027] Embodiment 2, on the basis of Embodiment 1, the material of the red copper metal 2 is a red copper block, and the arrangement of the red copper metal 2 enables it to transfer heat in the device by way of heat conduction.

Embodiment 3

[0028] Embodiment three, on the basis of embodiment one, conductive fluid circuit 3 comprises conductive fluid and liquid metal or conductive fluid and conductive metal powder, through the setting of conductive fluid circuit 3, the liquid metal that it flows such as gallium, gallium alloy, mercury , potassium-sodium alloy, etc., conductive fluid or conductive metal powder, in the high temperature zone generated by the thermal power of the device with large heat flux density and the low temperature zone generated by the rotation and cooling of the cooling fan 5.

technical field

[0001] The invention belongs to the technical field of cooling devices with high heat flux density, and specifically relates to a device and method for cooling devices with high heat flux density by using a magnetic field. Background technique

[0002] At present, the use of conductive fluid in the market to cool high heat flux devices needs to be driven by electromagnetic pumps, and the flow speed of conductive fluid will not be automatically adjusted with the increase of heat flux density. The existing conductive fluid liquid metal cooling is driven by electromagnetic pumps. Next, the liquid metal flows into the heat exchanger to take the heat out to the external environment, and then flows back to the electromagnetic pump for the next cycle after being cooled by a cooling device such as a fan, so as to achieve the purpose of cooling; The dissipated heat drives the electromagnetic pump through the electric energy generated by the thermoelectric effect to re...

Examples

Embodiment 1

[0026] Embodiment one, by figure 1 Given, the present invention includes a heating device 1, a copper metal 2 is installed on the top of the heating device 1, a conductive fluid circuit 3 is provided on the surface of the copper metal 2, and a magnetic field coverage area 4 is provided on the surface of the copper metal 2 at the bottom of the conductive fluid circuit 3 , the top of the red copper metal 2 is equipped with a cooling fan 5.

Embodiment 2

[0027] Embodiment 2, on the basis of Embodiment 1, the material of the red copper metal 2 is a red copper block, and the arrangement of the red copper metal 2 enables it to transfer heat in the device by way of heat conduction.

Embodiment 3

[0028] Embodiment three, on the basis of embodiment one, conductive fluid circuit 3 comprises conductive fluid and liquid metal or conductive fluid and conductive metal powder, through the setting of conductive fluid circuit 3, the liquid metal that it flows such as gallium, gallium alloy, mercury , potassium-sodium alloy, etc., conductive fluid or conductive metal powder, in the high temperature zone generated by the thermal power of the device with large heat flux density and the low temperature zone generated by the rotation and cooling of the cooling fan 5.

Images