Manufacturing method of high-integration half-hole step circuit board and half-hole step circuit board

Abstract

The invention provides a manufacturing method of a high-integration half-hole step circuit board and the half-hole step circuit board, belongs to the technical field of circuit board manufacturing, and solves the problems that the half-hole step circuit board is low in production efficiency and poor in product performance and quality. The method comprises the following steps: providing a first substrate and a second substrate; performing first pretreatment on the first substrate to obtain a to-be-laminated first substrate; performing second pretreatment on the second substrate to obtain a to-be-pressed second substrate; performing press-fit copper deposition treatment on the first substrate to be pressed and the second substrate to be pressed to obtain a substrate after press-fit copper deposition; carrying out electroplating and etching treatment on the substrate subjected to press-fit copper deposition to obtain a substrate subjected to electroplating and etching treatment; and carrying out forming treatment on the substrate after electroplating etching treatment to obtain the high-integration half-hole step circuit board. According to the scheme, the circuit board is firstly manufactured in a layered mode, then pressing and forming treatment are carried out, efficient production and manufacturing of the half-hole step circuit board are achieved, and the product performance quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a manufacturing method of a highly integrated half-hole step circuit board and a half-hole step circuit board. Background Art

[0002] With the development of small and diversified electronic products, new communication modules need to use high-frequency and high-speed printed circuit boards. Traditional printed circuit boards can no longer meet the needs of high frequency and high speed. With the development of high-frequency microwave technology, the functional requirements for high-frequency microwave printed circuit boards are also increasing. In order to meet the needs of fixing and installing some special functional devices or installing parts in a small size, the overall device height needs to be reduced after assembly. The constraints of space and safety make traditional planar design unable to meet the needs of many circuit boards in the electronic field. Therefore, circuit boards with stepped groove structures are gradually widely used. On the one hand, the stepped groove structure can maximize the use of the space inside the circuit board and provide technical support for the diversified development of electronic products; on the other hand, when customers are welding components, they need to stack or avoid other components in certain periods to ensure the safety of electrical components, which further highlights the superiority of the stepped groove structure. At present, in the production process of stepped boards in the printed circuit industry, processes similar to rigid-flex combined production, such as window opening of non-glue prepreg, blind groove, and cover removal, are usually used to achieve this. However, when special structures such as half-hole steps are required, the current production method will not be able to achieve this. Summary of the invention

[0003] The present invention provides a method for manufacturing a highly integrated half-hole step circuit board and a half-hole step circuit board, which solve the problems of low production efficiency and poor product performance and quality of the half-hole step circuit board.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] An embodiment of the present invention provides a method for manufacturing a highly integrated half-hole step circuit board, comprising:

[0006] providing a first substrate and a second substrate;

[0007] Performing a first pretreatment on the first substrate to obtain a first substrate to be pressed;

[0008] Performing a second pretreatment on the second substrate to obtain a second substrate to be pressed;

[0009] Performing a pressing copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper-deposited substrate;

[0010] Performing electroplating and etching treatment on the substrate after the copper deposition, to obtain a substrate after the electroplating and etching treatment;

[0011] The substrate after the electroplating and etching treatment is subjected to a molding treatment to obtain a highly integrated half-hole step circuit board.

[0012] Optionally, performing a first pretreatment on the first substrate to obtain a first substrate to be pressed includes:

[0013] Cutting the first substrate according to first preset cutting parameters to obtain a cut first substrate;

[0014] Performing a drilling process on the cut first substrate to obtain a drilled first substrate;

[0015] Performing pattern electroplating on the first substrate after drilling to obtain a first substrate after pattern electroplating;

[0016] Performing a half-hole process on the first substrate after the pattern electroplating to obtain a first substrate with a half-hole;

[0017] Performing an etching-browning treatment on the first substrate with the half hole to obtain an etched-brown first substrate;

[0018] The etched and browned first substrate is processed to obtain a first substrate to be pressed.

[0019] Optionally, the etched and browned first substrate is processed to obtain a first substrate to be pressed, including:

[0020] Performing a glue-coating process on the first substrate after etching and browning to obtain a glue-coated first substrate;

[0021] The step groove is formed on the first substrate after the glue is applied to obtain the first substrate to be pressed.

[0022] Optionally, performing a second pretreatment on the second substrate to obtain a second substrate to be pressed includes:

[0023] Cutting the second substrate according to second preset cutting parameters to obtain a cut second substrate;

[0024] Performing a drilling process on the cut second substrate to obtain a drilled second substrate;

[0025] Performing copper plate electroplating treatment on the drilled second substrate to obtain a copper plate electroplated second substrate;

[0026] Performing a plugging process on the second substrate after the copper plate is electroplated to obtain a plugged second substrate;

[0027] The second substrate after the plugging is processed to obtain the second substrate to be pressed.

[0028] Optionally, the second substrate after the plugging of the holes is processed to obtain the second substrate to be pressed, including:

[0029] Performing copper deposition and copper capping treatment on the second substrate after the plugging hole, so as to obtain the second substrate after copper deposition and copper capping;

[0030] Etching the second substrate after copper deposition and copper capping to obtain an etched second substrate;

[0031] The etched second substrate is subjected to browning treatment to obtain a second substrate to be pressed.

[0032] Optionally, performing a copper deposition process on the first substrate to be laminated and the second substrate to be laminated to obtain a laminated copper-deposited substrate, comprising:

[0033] Performing a lamination process on the first substrate to be laminated and the second substrate to be laminated to obtain laminated substrates;

[0034] Performing drilling processing on the pressed substrate to obtain a drilled substrate;

[0035] The drilled substrate is subjected to copper deposition treatment to obtain a pressed copper-deposited substrate.

[0036] Optionally, the substrate after the copper deposition is subjected to electroplating and etching treatment to obtain the substrate after the electroplating and etching treatment, comprising:

[0037] Performing pattern electroplating on the substrate after the copper deposition by pressing to obtain a substrate after pattern electroplating;

[0038] Processing the substrate after the pattern electroplating with blind grooves to obtain a substrate with blind grooves;

[0039] The substrate with the blind groove is etched to obtain a substrate after electroplating and etching.

[0040] Optionally, the substrate after the electroplating and etching process is subjected to a molding process to obtain a highly integrated half-hole step circuit board, including:

[0041] Performing solder resist text processing on the substrate after the electroplating and etching processing to obtain a substrate after the solder resist text processing;

[0042] Performing surface gold immersion treatment on the substrate after the solder mask text processing to obtain a substrate after the surface gold immersion treatment;

[0043] The substrate with the surface immersion gold is cut and formed to obtain a highly integrated half-hole step circuit board.

[0044] Optionally, the method for manufacturing the highly integrated half-hole step circuit board further includes:

[0045] The highly integrated half-hole step circuit board is tested and inspected according to preset test conditions to obtain a qualified highly integrated half-hole step circuit board; the preset test conditions include at least one of the following conditions:

[0046] Thermal stress test conditions: baking temperature is 121℃~149℃, baking time is at least 6h, thermal stress test temperature is 288℃±5℃, thermal stress test time is at least 10s, and the number of thermal stress tests is at least 3 times;

[0047] Constant temperature and humidity test conditions: the temperature of the constant temperature and humidity test is 85℃±1℃, the humidity of the constant temperature and humidity test is 85%±1%, and the time of the constant temperature and humidity test is at least 1000h.

[0048] An embodiment of the present invention further provides a half-hole step circuit board, and the half-hole step circuit board is prepared by the above method.

[0049] The technical solution of the present invention includes at least the following effects:

[0050] The above scheme of the present invention provides a first substrate and a second substrate; performs a first pretreatment on the first substrate to obtain a first substrate to be pressed; performs a second pretreatment on the second substrate to obtain a second substrate to be pressed; performs a pressing copper deposition treatment on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper deposition substrate; performs an electroplating and etching treatment on the pressed copper deposition substrate to obtain an electroplating and etching substrate; performs a molding treatment on the electroplating and etching substrate to obtain a highly integrated half-hole step circuit board. The scheme realizes the efficient production of the half-hole step circuit board by first layering the circuit board and then performing the pressing and molding treatment, thereby improving the product performance and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a flow chart of a method for manufacturing a highly integrated half-hole step circuit board provided by an embodiment of the present invention;

[0052] Figure 2 is a front view of a highly integrated half-hole step circuit board provided by an embodiment of the present invention;

[0053] Figure 3 is a side view of a highly integrated half-hole step circuit board provided by an embodiment of the present invention;

[0054] Among them, 1. half-hole step circuit board; 2. first substrate; 3. second substrate; 4. half-hole; 5. slot; 6. depth-controlled blind slot; 7. micro-etching position. DETAILED DESCRIPTION

[0055] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0056] like Figure 1 As shown, the present invention proposes a method for manufacturing a highly integrated half-hole step circuit board, comprising:

[0057] Step 11, providing a first substrate and a second substrate;

[0058] Step 12, performing a first pretreatment on the first substrate to obtain a first substrate to be pressed;

[0059] Step 13, performing a second pretreatment on the second substrate to obtain a second substrate to be pressed;

[0060] Step 14, performing a pressing copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper deposition substrate;

[0061] Step 15, performing electroplating and etching treatment on the substrate after the copper deposition, to obtain the substrate after the electroplating and etching treatment;

[0062] Step 16, performing molding processing on the substrate after the electroplating and etching processing to obtain a highly integrated half-hole step circuit board.

[0063] In this example, two substrates are first prepared as basic materials for manufacturing circuit boards. These substrates are usually made of insulating materials, such as epoxy resin, glass fiber, etc., to meet the subsequent circuit design and functional requirements. The first substrate and the second substrate are made of the same material, and the thickness and size are basically the same. According to the design requirements, the thickness and size may also be different, such as the thickness of the first substrate is 3mm, and the thickness of the second substrate is 2mm. The pretreatment step is to ensure that the surface of the substrate is clean, flat, and has good adhesion, which specifically includes cleaning the surface of the substrate to remove impurities such as grease and dust, and roughening the surface to increase surface adhesion. Finally, the substrate needs to be dried to ensure that its surface is dry and free of moisture. After these pretreatment steps, the first substrate is ready for subsequent pressing operations. Similar to the first substrate, the second substrate also needs to undergo a pretreatment step to ensure that its surface is clean, flat, and has good adhesion. The first substrate and the second substrate can be pressed together after the pretreatment; during the pressing process, the first substrate and the second substrate after the pretreatment are first tightly combined together through the pressing equipment; after the pressing is completed, copper plating treatment is required, that is, a thin copper layer is formed on the surface of the substrate, and this copper layer will serve as the basis for the subsequent electroplating and etching steps; after the copper plating treatment, electroplating and etching treatment is performed, firstly, a thicker copper layer is formed on the copper layer by electroplating to meet the conductivity requirements of the circuit design, and then the unnecessary copper layer parts are exposed by masking or photolithography technology, and these parts are removed by chemical etching to form a substrate with a specific circuit pattern; the molding process is the process of processing the substrate after the electroplating and etching treatment into the final required shape and size, including cutting, polishing and other steps. After the molding process, the final highly integrated half-hole step circuit board is obtained.

[0064] The above technical solution of the present invention solves the problems of low production efficiency and poor product performance and quality of half-hole step circuit boards by first manufacturing the circuit boards in layers and then performing pressing and molding processes, thereby realizing efficient production of half-hole step circuit boards and improving product performance and quality.

[0065] In an optional embodiment of the present invention, step 12 may include:

[0066] Step 121, cutting the first substrate according to first preset cutting parameters to obtain a cut first substrate;

[0067] Step 122, drilling the cut first substrate to obtain a drilled first substrate;

[0068] Step 123, performing pattern electroplating on the first substrate after drilling to obtain a first substrate after pattern electroplating;

[0069] Step 124, performing half-hole processing on the first substrate after the pattern electroplating to obtain a first substrate with half-holes;

[0070] Step 125, performing an etching-browning treatment on the first substrate with the half hole to obtain an etched-brown first substrate;

[0071] Step 126 , processing the etched and browned first substrate to obtain a first substrate to be pressed.

[0072] In this example, the first substrate is firstly cut according to the first preset cutting parameters to obtain the first substrate after cutting; specifically, a cutting knife is used to cut the material under the conditions of a cutting speed of 4.5±0.5m / min and a cutting size tolerance of ±0.1mm; after cutting, the first substrate after cutting is drilled to obtain the first substrate after drilling; specifically, a drill bit, a pad, and an aluminum sheet are used to drill holes in a workshop environment at a temperature of 20±2°C and the drill bit is ground no more than 5 times; after drilling, the first substrate is subjected to pattern electroplating to obtain the first substrate after pattern electroplating; specifically, an etching technology is used to make the inner layer pattern line Circuit; first, a layer of photoresist is coated on the copper foil substrate, and the required circuit pattern is formed through exposure and development steps, and then the copper foil part not protected by the photoresist is etched away with an etchant to obtain the inner layer pattern circuit, wherein the industrial sulfuric acid pickling concentration is 3-5%, the drying temperature is 90±5℃, the dry film laminating speed is 0.9±0.2m / min, the dry film laminating temperature is 120±10℃, the exposure scale is 6-7 levels, the LDI exposure energy is: 24.3MJ, the dust-free workshop ambient temperature is 20±2℃; the dry film developing speed is 2.5±0.5m / min, the dry film developing temperature is 30±2℃, and the sodium carbonate developer concentration is 1.0±0.2%; After obtaining the inner layer pattern circuit, the inner layer pattern is electroplated, and the main materials include copper polish, tin polish, AR grade sulfuric acid, copper ball, tin ball, anode bag, titanium basket, high-efficiency carbon core, copper sulfate, and stannous sulfate; the first substrate after the pattern electroplating is subjected to half-hole processing to obtain a first substrate with half holes; specifically, a gong knife is used to gong the half hole under the conditions of a feed speed of 15±5m / min, a feed speed of 10±5m / min, a rotation speed of 48000 to 51000r / min, a workshop environment of 23±3℃, and a humidity of 60±10%; after gong the half hole, an etching solution, a tin stripping solution, an organic film stripping solution, and ammonia water are used for alkaline etching, and a browning solution and a degreasing agent are used. , CP grade sulfuric acid, hydrogen peroxide, and pre-dip liquid are used for browning treatment, and the parameters of alkaline etching are shown in Table 1; after the etching browning treatment, the first substrate is subjected to glue treatment to obtain the first substrate after glueing; the step grooves are grooved on the first substrate after glueing to obtain the first substrate to be pressed; specifically, AD glue is used to perform glue treatment under the conditions of a hot pressing roller temperature of 30±5°C and a hot pressing roller speed of 3.0±0.5m / min, and a grooving knife is used to grooving the step grooves under the conditions of a feed speed of 10±5m / min, a travel speed of 5±2m / min, a rotation speed of 48000 to 51000r / min, a workshop environment of 23±3°C, and a humidity of 60±10%.

[0073] Table 1 Alkaline etching parameters

[0074]

[0075] In an optional embodiment of the present invention, step 13 may include:

[0076] Step 131, cutting the second substrate according to a second preset cutting parameter to obtain a cut second substrate;

[0077] Step 132, drilling the cut second substrate to obtain a drilled second substrate;

[0078] Step 133, performing copper plate electroplating treatment on the drilled second substrate to obtain a copper plate electroplated second substrate;

[0079] Step 134, performing a plugging process on the second substrate after the copper plate is electroplated to obtain a plugged second substrate;

[0080] Step 135 , processing the second substrate after plugging the holes to obtain a second substrate to be pressed.

[0081] In this example, the second substrate is firstly cut according to the second preset cutting parameters to obtain the second substrate after cutting; specifically, the cutting knife is used to cut the material under the conditions of cutting speed of 4.5±0.5m / min and cutting size tolerance controlled within ±0.1mm; the second substrate after cutting is drilled to obtain the second substrate after drilling; specifically, a drill bit, a pad, and an aluminum sheet are used to drill holes in a workshop environment with a temperature of 20±2°C and a drill bit grinding number of no more than 5 times; after drilling, the second substrate is subjected to copper plating, and the main materials for the copper plating include a bulking agent M160. 1A, neutralizer M1603, degreasing agent M105D, pre-dip salt M201, activator M202, accelerator M204, accelerating salt M204S, as well as cylinder opening agent M1000HM, chemical copper M1000HA, chemical copper M1000HB, water-based lubricant J, water-based lubricant Q, potassium permanganate, sodium hydroxide, sodium persulfate, sulfuric acid (CP grade), sulfuric acid (industrial grade), hydrogen peroxide, AR hydrochloric acid; the second substrate after copper deposition treatment is subjected to whole-board electroplating treatment, and the main materials for whole-board electroplating treatment include copper sulfate, sulfuric acid, and CP grade sulfuric acid; then epoxy resin is used with a scraper speed of 5±0 .5m / min, and a vacuum pressure of -99kPa, resin plugging treatment is performed; copper plating cap treatment is performed on the second substrate after the plugging to obtain a second substrate after copper plating cap; specifically, the main materials for copper plating cap treatment include copper sulfate, sulfuric acid, and CP grade sulfuric acid; etching treatment is performed on the second substrate after the copper plating cap to obtain an etched second substrate; browning treatment is performed on the second substrate after etching to obtain a second substrate to be pressed; specifically, the main materials include anti-corrosion dry film, industrial sodium carbonate, industrial sulfuric acid, and grinding brushes, and the main parameters include: the pre-treatment grinding plate speed is 2 .0±0.5m / min, pickling concentration is 3%~5%, drying temperature is 90±5℃, water break test is not less than 15s; dry film pasting speed is 0.9±0.2m / min, dry film pasting temperature is 120±10℃, film into the board temperature is 50±5℃, film out of the board temperature is 55±5℃; exposure scale is 6~7 levels, LDI exposure energy is 24.3MJ, dust-free workshop environment temperature is 20±2℃, humidity is 55±5%; dry film developing speed is 2.5±0.5m / min, dry film developing temperature is 30±2℃, sodium carbonate developer concentration is 1.0±0.2%.

[0082] In an optional embodiment of the present invention, step 14 may include:

[0083] Step 141, performing a lamination process on the first substrate to be laminated and the second substrate to be laminated to obtain laminated substrates;

[0084] Step 142, drilling the laminated substrate to obtain a drilled substrate;

[0085] Step 143, performing copper deposition treatment on the drilled substrate to obtain a copper-deposited substrate.

[0086] In this example, kraft paper, steel plate, high temperature cushion pad, sticky cloth, sanding belt, and hot kerosene are used to press the first substrate and the second substrate. The main pressing parameters are shown in Table 2.

[0087] Table 2 Main pressing parameters

[0088]

[0089] Use a drill bit, a pad, and an aluminum sheet to drill holes in the laminated substrate in a workshop environment at a temperature of 20±2°C and with the drill bit grinding times not exceeding 5 times; after drilling, the laminated substrate is subjected to copper plating treatment. The main materials for copper plating treatment include bulking agent M1601A, neutralizing agent M1603, degreasing agent M105D, pre-impregnation salt M201, activating agent M202, accelerator M204, accelerating salt M204S, as well as cylinder opening agent M1000HM, chemical copper M1000HA, chemical copper M1000HB, water-based lubricant J, and water-based lubricant Q , potassium permanganate, sodium hydroxide, sodium persulfate, sulfuric acid (CP grade), sulfuric acid (industrial grade), hydrogen peroxide, AR hydrochloric acid; the substrate after copper deposition is flash-plated. Through flash-plating, a 2~3um copper plating layer is added to the substrate, which can increase the thickness of the copper layer after copper deposition and improve the substrate's ability to resist quality risks. The main materials for flash-plating include copper sulfate, sulfuric acid, and CP grade sulfuric acid; the substrate is micro-etched after flash-plating to remove unnecessary copper. The main materials for micro-etching include industrial sulfuric acid and hydrogen peroxide. The micro-etching rate The speed is 1.0±0.5m / min, and the micro-etching temperature is 35±3℃; after the micro-etching treatment, the substrate is subjected to film stripping treatment. The main materials for film stripping treatment include sodium hydroxide and sulfuric acid. The main parameters are shown in Table 3; after the film stripping treatment, the substrate is subjected to outer layer pattern circuit treatment to achieve that the anti-corrosion dry film covers the required copper and exposes the copper position that needs micro-etching in the next process. The main materials for outer layer pattern circuit treatment include anti-corrosion dry film, industrial sodium carbonate, industrial sulfuric acid, and grinding brush. The main parameters include: the pre-treatment grinding speed is 2.0±0.5m / min, and the pickling concentration is 3% ~5%, the drying temperature is 90±5℃, and the water breaking test is not less than 15s; the dry film pasting speed is 0.9±0.2m / min, the dry film pasting temperature is 120±10℃, the film pasting board temperature is 50±5℃, and the film pasting board temperature is 55±5℃; the exposure scale is 6~7 levels, the LDI exposure energy is 24.3MJ, the temperature of the dust-free workshop environment is 20±2℃, and the humidity is 55±5%; the dry film developing speed is 2.5±0.5m / min, the dry film developing temperature is 30±2℃, and the sodium carbonate developer concentration is 1.0±0.2%.

[0090] Table 3 Main parameters of film removal treatment

[0091]

[0092] In an optional embodiment of the present invention, step 15 may include:

[0093] Step 151, performing pattern electroplating on the substrate after the copper deposition by pressing, to obtain a substrate after pattern electroplating;

[0094] Step 152, the substrate after the pattern electroplating is subjected to blind groove processing to obtain a substrate with blind grooves;

[0095] Step 153, etching the substrate with the blind groove to obtain a substrate after electroplating and etching.

[0096] In this example, the substrate after the pressed copper deposition is subjected to a pattern electroplating treatment to obtain a substrate after pattern electroplating; specifically, the main materials for the pattern electroplating treatment include copper sulfate, sulfuric acid, and CP-grade sulfuric acid, and industrial sulfuric acid and hydrogen peroxide are used for micro-etching, wherein the micro-etching speed is 1.0±0.5m / min, and the micro-etching temperature is 35±3°C; after micro-etching, sodium hydroxide and sulfuric acid are used for film stripping, wherein the film stripping concentration is 5±2%, the film stripping temperature is 50±2°C, the film stripping speed is 3.0±0.5m / min, and the drying temperature is 80±5°C; after the pattern electroplating treatment, a gong knife, a bottom plate, and a masking glue are used to gong a blind groove on the substrate, and the depth of the gong blind groove is controlled under the conditions of a feed speed of 10±5m / min, a travel speed of 5±2m / min, a rotation speed of 48000 to 51000r / min, a workshop environment of 23±3°C, and a humidity of 60±10%; and then alkaline etching is performed, and the main parameters of the alkaline etching are shown in Table 1.

[0097] In an optional embodiment, the embodiment of the present invention provides that step 16 may include:

[0098] Step 161, performing solder mask text processing on the substrate after the electroplating and etching processing to obtain a substrate after the solder mask text processing;

[0099] Step 162, performing surface gold deposition on the substrate after the solder mask text processing to obtain a substrate after the surface gold deposition;

[0100] Step 163, cutting and shaping the substrate after the surface immersion gold treatment to obtain a highly integrated half-hole step circuit board.

[0101] In this example, the substrate after the electroplating and etching treatment is subjected to solder mask text treatment to obtain a substrate after solder mask text treatment; wherein, the main materials for the solder mask treatment include solder mask ink, oil water, industrial sodium carbonate and industrial sulfuric acid, and the main parameters include a pre-treatment grinding speed of 1.5±0.5m / min, a pickling concentration of 3%~5%, a drying temperature of 90±5°C, and a printing speed of 1.5±0.5m / min; the main materials for text treatment include character ink and inkjet cleaning liquid; the substrate after the solder mask text treatment is subjected to surface gold immersion treatment to obtain a substrate after surface gold immersion; wherein, the main materials for surface treatment include gold salt, active chemical nickel temperature is 79~81℃, nickel bath concentration is 4.3~4.6g / L, bath load is 0.3~1.0d㎡ / L, PH is 4.5~4.7, immersion gold plating temperature is 85~90℃, PH is 4.8~6.0, gold concentration is 0.5~1.2%, and gold liquid concentration is 100ml / L.

[0102] A specific embodiment of the method for manufacturing a highly integrated half-hole step circuit board provided by an embodiment of the present invention is:

[0103] Step 1, providing a first substrate and a second substrate;

[0104] The first substrate and the second substrate are made of epoxy resin and are substantially the same in size; the first substrate is 3 mm thick and the second substrate is 2 mm thick.

[0105] Step 2, performing a first pretreatment on the first substrate and performing a second pretreatment on the second substrate to obtain a first substrate and a second substrate to be pressed together;

[0106] The first substrate and the second substrate are cut by a cutting knife at a cutting speed of 4.5±0.5m / min and a cutting size tolerance of ±0.1mm; after cutting, the first substrate and the second substrate are drilled by a drill bit, a pad, and an aluminum sheet in a workshop environment at a temperature of 20±2°C and the number of drill bit grinding does not exceed 5 times; after drilling, the first substrate is subjected to pattern electroplating to obtain a first substrate after pattern electroplating; and the first substrate after pattern electroplating is subjected to a gong cutter at a feed speed of 15±5m / min and Under the conditions of a tool speed of 10±5m / min, a rotation speed of 48000 to 51000r / min, a workshop environment of 23±3℃, and a humidity of 60±10%, half a hole is drilled; after drilling the half a hole, an etching solution, a tin stripping solution, an organic film stripping solution, and ammonia water are used for alkaline etching, and a browning solution, a degreasing agent, CP-grade sulfuric acid, hydrogen peroxide, and a pre-dip solution are used for browning treatment; after etching and browning treatment, the first substrate is subjected to a gluing treatment to obtain a first substrate after gluing; step grooves are drilled on the first substrate after gluing to obtain a first substrate to be pressed;

[0107] The second substrate after drilling is subjected to copper plating treatment, and a uniform layer of chemical copper is deposited on the second substrate to serve as a base for copper electroplating to improve the overall reliability of the circuit board; the second substrate after copper plating treatment is subjected to whole-board electroplating treatment, and the main materials for whole-board electroplating treatment include copper sulfate, sulfuric acid, and CP-grade sulfuric acid; then epoxy resin is used to perform resin plugging treatment under the conditions of a scraper speed of 5±0.5m / min and a vacuum pressure of -99kPa; the second substrate after plugging is subjected to copper plating cap treatment to obtain a second substrate after copper plating cap; specifically, the main materials for copper plating cap treatment include copper sulfate, sulfuric acid, and CP-grade sulfuric acid; the second substrate after copper plating cap is subjected to etching treatment to obtain an etched second substrate; the etched second substrate is subjected to browning treatment to obtain a second substrate to be pressed.

[0108] Step 3, performing a pressing and copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed and copper deposited substrate.

[0109] The first substrate to be pressed and the second substrate to be pressed are pressed together, and are firmly fixed together by high temperature and high pressure to form an integral structure to obtain a pressed substrate; the pressed substrate is drilled to form component sockets and wiring connection ports to obtain a drilled substrate; the drilled substrate is copper plated to obtain a pressed copper plated substrate.

[0110] Step 4, performing electroplating and etching treatment on the substrate after the pressing and copper deposition to obtain the substrate after the electroplating and etching treatment.

[0111] After the copper plating is pressed, the substrate needs to be pre-treated first to ensure that the surface is clean, free of grease, oxides and other pollutants; the surface of the substrate is cleaned with a cleaning agent, and then micro-etching is performed to remove tiny surface unevenness and enhance the bonding force between the electroplating layer and the substrate; the designed circuit pattern is transferred to the substrate through photolithography technology, and the photoresist film containing the circuit pattern is tightly attached to the substrate, and then ultraviolet light is used to cause the photoresist to react chemically in the pattern area, and the developer is used to remove the unexposed photoresist, leaving the pattern area corresponding to the circuit pattern; copper electroplating is performed in the pattern area; the copper electroplating solution contains copper ions and an appropriate amount of additives, which reacts with the pattern area through electrochemical reactions. Deposit a layer of copper; after the electroplating is completed, use a debonding agent to remove the photoresist to expose the copper layer in the non-electroplating area, and then thoroughly clean the substrate to remove all residues. According to the design requirements, mark the position and size of the blind groove on the substrate, and use a guillotine machine or laser cutting equipment to guillotine the substrate according to the marked position to form a blind groove; clean the substrate with the blind groove before etching to remove all residues, and use anti-etching ink or dry film to cover the copper layer areas that need to be retained to protect these areas from the influence of the etching solution; immerse the substrate in the etching solution, and the etching solution will dissolve the unprotected copper layer; after etching, use a cleaning solution to remove all residues, including anti-etching ink or dry film.

[0112] Step 5, performing molding processing on the substrate after the electroplating and etching processing to obtain a highly integrated half-hole step circuit board.

[0113] After electroplating and etching, the substrate needs to be coated with solder mask first. The solder mask is usually a special ink or resin material used to protect the non-conductive area of ​​the circuit board to prevent short circuit or damage during the subsequent welding process; after the solder mask is dried and cured, text printing is performed. Text printing usually includes logos, component numbers, polarity marks, etc. on the circuit board to guide subsequent assembly and testing; after the solder mask and text printing are completed, curing treatment is required to fully cure the ink or resin material to improve adhesion and durability; the substrate after solder mask text processing needs to be pre-treated, including degreasing, micro-etching, etc., to ensure good bonding between the metal layer and the substrate; then immersion gold treatment is performed, which is a chemical gold plating method that deposits a thin layer of gold on the surface of the substrate through a chemical reaction. This layer of gold not only has good conductivity and corrosion resistance, but also provides an aesthetic appearance; after the immersion gold is completed, post-processing is performed, including steps such as cleaning and drying to remove all residues and ensure the firm adhesion of the gold layer; using equipment such as laser cutting machines, mechanical punching machines or water jets, the substrate is cut and formed according to the cutting procedure to obtain a half-hole step circuit board.

[0114] The above technical solution of the present invention solves the problems of low production efficiency and poor product performance and quality of half-hole step circuit boards by first manufacturing the circuit boards in layers and then performing pressing and molding processes, thereby realizing efficient production of half-hole step circuit boards and improving product performance and quality.

[0115] In an optional embodiment of the present invention, the method further comprises the following steps:

[0116] Step 171, testing and inspecting the highly integrated half-hole step circuit board according to preset test conditions to obtain a qualified highly integrated half-hole step circuit board; the preset test conditions include at least one of the following conditions:

[0117] Step 172, thermal stress test conditions, baking temperature is 121°C~149°C, baking time is at least 6 hours, thermal stress test temperature is 288°C±5°C, thermal stress test time is at least 10 seconds, and the number of thermal stress tests is at least 3 times;

[0118] Step 173, constant temperature and humidity test conditions, the temperature of the constant temperature and humidity test is 85℃±1℃, the humidity of the constant temperature and humidity test is 85%±1%, and the time of the constant temperature and humidity test is at least 1000h.

[0119] In this embodiment, in order to improve the qualified rate of circuit boards and user satisfaction, it is necessary to inspect the highly integrated half-hole step circuit boards. Only circuit boards that pass the preset inspection conditions are qualified highly integrated half-hole step circuit boards and can be used for subsequent production or shipment. In this embodiment, after the half-hole step circuit boards are inspected according to the above inspection method, the qualified rate of the half-hole step circuit boards is high, which fully meets the market demand.

[0120] like Figure 2 and Figure 3 As shown, an embodiment of the present invention proposes a half-hole step circuit board 1, which is prepared by the method for making a highly integrated half-hole step circuit board according to any one of the above embodiments. The half-hole step circuit board 1 includes: a first substrate 2, a second substrate 3, a half hole 4 and a slot 5; the total thickness of the product is 5mm, wherein the thickness of the first substrate 2 is 3mm, the thickness of the second substrate 3 is 2mm, and the slot depth is 3mm. The production efficiency and product performance of the half-hole step circuit board are effectively improved.

[0121] The above are preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for manufacturing a highly integrated half-hole step circuit board, characterized in that: include: providing a first substrate and a second substrate; Performing a first pretreatment on the first substrate to obtain a first substrate to be pressed; Performing a second pretreatment on the second substrate to obtain a second substrate to be pressed; Performing a pressing copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper-deposited substrate; Performing electroplating and etching treatment on the substrate after the copper deposition, to obtain a substrate after the electroplating and etching treatment; The substrate after the electroplating and etching treatment is subjected to a molding treatment to obtain a highly integrated half-hole step circuit board.

2. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: Performing a first pretreatment on the first substrate to obtain a first substrate to be pressed, comprising: Cutting the first substrate according to first preset cutting parameters to obtain a cut first substrate; Performing a drilling process on the cut first substrate to obtain a drilled first substrate; Performing pattern electroplating on the first substrate after drilling to obtain a first substrate after pattern electroplating; Performing a half-hole process on the first substrate after the pattern electroplating to obtain a first substrate with a half-hole; Performing an etching-browning treatment on the first substrate with the half hole to obtain an etched-brown first substrate; The etched and browned first substrate is processed to obtain a first substrate to be pressed.

3. The method for manufacturing a highly integrated half-hole step circuit board according to claim 2, characterized in that: The first substrate after etching is processed to obtain a first substrate to be pressed, including: Performing a glue-coating process on the first substrate after etching and browning to obtain a glue-coated first substrate; The step groove is formed on the first substrate after the glue is applied to obtain the first substrate to be pressed.

4. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: Performing a second pretreatment on the second substrate to obtain a second substrate to be pressed, comprising: Cutting the second substrate according to second preset cutting parameters to obtain a cut second substrate; Performing a drilling process on the cut second substrate to obtain a drilled second substrate; Performing copper plate electroplating treatment on the drilled second substrate to obtain a copper plate electroplated second substrate; Performing a plugging process on the second substrate after the copper plate is electroplated to obtain a plugged second substrate; The second substrate after the plugging is processed to obtain the second substrate to be pressed.

5. The method for manufacturing a highly integrated half-hole step circuit board according to claim 4, characterized in that: The second substrate after plugging the holes is processed to obtain a second substrate to be pressed, including: Performing copper deposition and copper capping treatment on the second substrate after the plugging hole, so as to obtain the second substrate after copper deposition and copper capping; Etching the second substrate after copper deposition and copper capping to obtain an etched second substrate; The etched second substrate is subjected to browning treatment to obtain a second substrate to be pressed.

6. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: Performing a pressing copper deposition process on the first substrate to be pressed and the second substrate to be pressed to obtain a pressed copper-deposited substrate, comprising: Performing a lamination process on the first substrate to be laminated and the second substrate to be laminated to obtain laminated substrates; Performing drilling processing on the pressed substrate to obtain a drilled substrate; The drilled substrate is subjected to copper deposition treatment to obtain a pressed copper-deposited substrate.

7. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: The substrate after the copper deposition is subjected to electroplating and etching treatment to obtain the substrate after the electroplating and etching treatment, comprising: Performing pattern electroplating on the substrate after the copper deposition by pressing to obtain a substrate after pattern electroplating; Processing the substrate after the pattern electroplating with blind grooves to obtain a substrate with blind grooves; The substrate with the blind groove is etched to obtain a substrate after electroplating and etching.

8. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: The substrate after the electroplating and etching process is subjected to a molding process to obtain a highly integrated half-hole step circuit board, including: Performing solder resist text processing on the substrate after the electroplating and etching processing to obtain a substrate after the solder resist text processing; Performing surface gold immersion treatment on the substrate after the solder mask text processing to obtain a substrate after the surface gold immersion treatment; The substrate with the surface immersion gold is cut and formed to obtain a highly integrated half-hole step circuit board.

9. The method for manufacturing a highly integrated half-hole step circuit board according to claim 1, characterized in that: Also includes: The highly integrated half-hole step circuit board is tested and inspected according to preset test conditions to obtain a qualified highly integrated half-hole step circuit board; the preset test conditions include at least one of the following conditions: Thermal stress test conditions: baking temperature is 121℃~149℃, baking time is at least 6h, thermal stress test temperature is 288℃±5℃, thermal stress test time is at least 10s, and the number of thermal stress tests is at least 3 times; Constant temperature and humidity test conditions: the temperature of the constant temperature and humidity test is 85℃±1℃, the humidity of the constant temperature and humidity test is 85%±1%, and the time of the constant temperature and humidity test is at least 1000h.

10. A half-hole step circuit board, characterized in that: The half-hole step circuit board is prepared by the method described in any one of claims 1 to 9.

Images