Double-layer heat dissipation device of electronic device
By using a double-layer heat dissipation device in electronic devices, the heat dissipation structure and distribution density are optimized, and the problem of uneven heat dissipation of electronic devices is solved, achieving a more efficient and stable heat dissipation effect.
Patent Information
- Application Number
- CN202411345031.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-02-07
AI Technical Summary
The existing electronic device heat dissipation solutions cannot ensure the uniformity of the temperature of each electronic device, resulting in unstable heat dissipation effect and low heat dissipation efficiency.
The dual-layer heat dissipation device is adopted to ensure the uniformity of heat dissipation of electronic devices by optimizing the upper and lower double-layer heat dissipation structure and the heat dissipation component structure with different sizes and distribution densities.
It realizes the uniformity and stability of heat dissipation of electronic devices, improves the overall heat dissipation efficiency, and ensures the economicality of the structure.
Smart Images
Figure CN119403084A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation, and in particular to a double-layer heat dissipation device for electronic devices. Background Art
[0002] At present, common cooling methods for electronic devices include air cooling, liquid cooling, phase change cooling, etc. However, electronic devices are often used in parallel, and the heat dissipation conditions of electronic devices at different positions of the corresponding radiator are quite different. The coolant temperature of electronic devices near the inlet of the radiator is lower, and the coolant temperature of electronic devices near the outlet of the radiator is higher. At the same time, the loss and junction temperature of different modules are inconsistent under different working conditions. The existing heat dissipation scheme cannot guarantee the uniformity of the temperature of each electronic device, resulting in unstable heat dissipation effect and low heat dissipation efficiency. Summary of the invention
[0003] The present disclosure proposes a double-layer heat dissipation device for electronic devices, which can solve the technical problems of unstable heat dissipation effect and low heat dissipation efficiency of electronic devices to a certain extent.
[0004] Based on the above purpose, the present disclosure provides a double-layer heat dissipation device for an electronic device, comprising:
[0005] A first heat sink, wherein a first electronic device is disposed on a first side of the first heat sink, and a first heat dissipation component is disposed on a second side of the first heat sink;
[0006] A second heat sink, a second electronic device is disposed on a first side of the second heat sink, and a second heat dissipation component is disposed on a second side of the second heat sink;
[0007] The heat dissipation part includes a liquid inlet, a liquid outlet and an internal heat dissipation space, wherein the cooling liquid enters the heat dissipation space through the liquid inlet and flows out through the liquid outlet; wherein the first radiator and the second radiator are respectively arranged on two sides of the heat dissipation part opposite to each other, and the first heat dissipation component and the second heat dissipation component are accommodated in the heat dissipation space; the distribution density of the first heat dissipation component and the second heat dissipation component changes along the flow direction of the coolant.
[0008] From the above description, it can be seen that the double-layer heat dissipation device for electronic devices provided by the present disclosure ensures the uniformity of heat dissipation of electronic devices and the economy of overall structural processing by optimizing the upper and lower double-layer heat dissipation structures and adopting heat dissipation component structures with different sizes and distribution densities. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0010] Figure 1 Schematic diagram of a double-layer heat dissipation device for an electronic device according to an embodiment of the present disclosure.
[0011] Figure 2 Schematic diagram of a corrugated fin according to an embodiment of the present disclosure.
[0012] Figure 3 The diagram is a schematic diagram showing an example of the distribution of heat dissipation components according to an embodiment of the present disclosure.
[0013] Figure 4 A schematic diagram of a staggered design according to an embodiment of the present disclosure.
[0014] Figure 5-Figure 6 Schematic diagram of the heat dissipation unit of an embodiment of the present disclosure.
[0015] Figure 7 Schematic diagram of a heat dissipation path according to an embodiment of the present disclosure. DETAILED DESCRIPTION
[0016] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.
[0017] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0018] With the development of new energy technology, cars around the world have entered the era of intelligence. The demand for chips in cars has increased dramatically, and the power level requirements for electronic devices IGBT modules have become increasingly higher. The corresponding cooling technology has always been a research hotspot in the industry. Common cooling methods for current electronic equipment include air cooling, liquid cooling, phase change cooling, etc. At present, IGBT modules are generally used in parallel, and the heat dissipation conditions of IGBT modules at different positions of the corresponding radiator are quite different. The coolant temperature of the IGBT module near the inlet of the radiator is lower, and the coolant temperature of the IGBT module near the outlet of the radiator is higher. At the same time, the loss and junction temperature of different modules are inconsistent under the working state. The existing heat dissipation scheme cannot achieve the individual control of the heat dissipation conditions of each module, and cannot ensure the uniformity of the temperature of each IGBT. It is urgent to propose a liquid cooling plate radiator structure based on IGBT modules to ensure the thermal stability of the equipment, the uniformity of the temperature of each device, and the economy of the overall structure processing. Therefore, how to improve the heat dissipation effect and heat dissipation efficiency of electronic devices has become a technical problem that needs to be solved urgently.
[0019] In view of this, a heat dissipation device for electronic devices provided in an embodiment of the present disclosure optimizes the water-cooling plate structure and the radiator structure, utilizes the upper and lower double-layer water-cooling structure and the staggered heat dissipation fin structures of different sizes, to ensure the thermal stability of the equipment and the uniformity of the temperature of each device, while ensuring the economy of the overall structural processing.
[0020] See also Figure 1 , Figure 1 A schematic diagram of a heat dissipation device for an electronic device according to an embodiment of the present disclosure is shown. Figure 1 In the present invention, the heat dissipation device of the electronic device may include:
[0021] A first heat sink 1, a first electronic device 5 is disposed on a first side of the first heat sink 1, and first heat dissipation components 1-6, 1-7 are disposed on a second side of the first heat sink 1;
[0022] A second heat sink 2, a second electronic device 5 is disposed on a first side of the second heat sink 2, and second heat sink components 2-6, 2-7 are disposed on a second side of the second heat sink 2;
[0023] The heat dissipation part 3 includes a liquid inlet end 3-1, a liquid outlet end 3-2 and an internal heat dissipation space, wherein the cooling liquid enters the heat dissipation space through the liquid inlet end 3-1 and flows out through the liquid outlet end 3-2; wherein the first radiator 1 and the second radiator 2 are respectively arranged on both sides of the heat dissipation part 3 opposite to each other, and the first heat dissipation components 1-6, 1-7 and the second heat dissipation components 2-6, 2-7 are accommodated in the heat dissipation space; the distribution density of the first heat dissipation components 1-6, 1-7 and the second heat dissipation components 2-6, 2-7 changes along the flow direction of the coolant.
[0024] The first heat sink and the second heat sink are located on both sides of the heat sink, respectively. The first electronic device and the second electronic device can be IGBT modules, which are evenly distributed on one side of the first heat sink and the second heat sink; the first heat sink and the second heat sink are distributed on the other side of the first heat sink and the second heat sink and are contained in the heat dissipation space, and their distribution density changes along the flow direction of the coolant to meet the heat dissipation requirements of different areas. This structure can effectively improve the heat dissipation efficiency, ensure that the electronic devices work within a suitable temperature range, and thus improve the stability and reliability of the system. Figure 1 In the embodiment, the first heat sink 1 and the second heat sink 2 can be sealed and connected to the heat dissipation part 3 through the seal 4 to ensure the sealing of the heat dissipation space. The first heat dissipation component and the second heat dissipation component can be made of metal.
[0025] In some embodiments, the first heat dissipation component and / or the second heat dissipation component include corrugated fins.
[0026] Among them, the corrugated fin can be a heat dissipation fin with a wavy structure, and its surface has continuous corrugated undulations. The corrugated fin can increase the surface area of the heat dissipation component, thereby improving the heat exchange efficiency with the coolant. Compared with traditional straight fins, the corrugated fin can provide a larger contact area in the same volume, thereby enhancing the heat conduction and dissipation capabilities. In addition, the corrugated structure can also promote the turbulent effect of the fluid during the flow process, further improving the heat transfer performance. Using corrugated fins as the first heat dissipation component and / or the second heat dissipation component can significantly improve the heat exchange efficiency between the coolant and the heat dissipation component. This means that the system can take away more heat in a shorter time, thereby effectively reducing the operating temperature of the electronic device, ensuring its long-term stable operation, and possibly extending the service life of the electronic device. At the same time, the design of the corrugated fin can also help optimize the flow characteristics of the coolant, reduce flow resistance, and make the entire cooling system more efficient and reliable. See Figure 2 , Figure 2 A schematic diagram of a corrugated fin according to an embodiment of the present disclosure is shown. Figure 2 In the embodiment, the first heat dissipation component and the second heat dissipation component in the first radiator 1 and the second radiator 2 may be corrugated fins, the fin length of the corrugated fins may refer to the length of the corrugated fins in the horizontal direction (or transverse direction), the fin width of the corrugated fins may refer to the thickness of the corrugated fins in the vertical direction (or longitudinal direction), the transverse spacing of the corrugated fins may refer to the spacing between adjacent corrugated fins in the horizontal direction (or transverse direction), and the longitudinal spacing of the corrugated fins may refer to the spacing between adjacent corrugated fins in the vertical direction (or longitudinal direction).
[0027] The change in the distribution density of the heat dissipation component can specifically be a change in at least one of the parameters of the heat dissipation component, such as the length, width, height, horizontal spacing or vertical spacing. The change in the length of the heat dissipation component will affect the total heat dissipation area (fin area), flow disturbance intensity and inlet and outlet pressure drop, thereby improving the heat dissipation performance. The change in the width of the heat dissipation component affects the heat dissipation performance through the heat dissipation area, that is, after the fin width increases, the total heat dissipation area increases, and the flow disturbance capacity is also improved to a certain extent, so that the heat dissipation performance is enhanced. The change in the fin height affects the heat dissipation performance, and the reason is mainly reflected in the heat dissipation area, that is, after the fin height increases, the other parameters remain unchanged, the total heat dissipation area increases, and the heat dissipation performance is enhanced. The height of the heat dissipation component affects the inlet and outlet pressure drop difference through the influence on the flow cross-sectional area, that is, after the height of the heat dissipation component increases, the other parameters remain unchanged, the coolant flow cross-sectional area becomes smaller, the flow velocity increases to a certain extent, the flow resistance increases, and the inlet and outlet pressure drop gradually increases. After the horizontal spacing of the heat dissipation component changes, the total heat dissipation area remains unchanged, but the heat dissipation area (fin area) at the corresponding position of the heat source of a single controller will change, which will lead to differences in heat dissipation effects. The heat dissipation efficiency can be improved by reasonably setting the horizontal spacing between the fins. After the horizontal spacing of the heat dissipation components is changed, the coolant flow cross-sectional area and the flow channel volume do not change, the local resistance loss of a single heat dissipation component remains basically unchanged, and the total resistance loss along the coolant and the inlet and outlet pressure drop difference remain basically unchanged. When the longitudinal spacing of the heat dissipation components changes, the total heat dissipation area remains unchanged, the total flow cross-sectional area remains unchanged, but the flow cross-sectional area between the heat dissipation components will change. The longitudinal spacing mainly affects the heat dissipation performance by changing the flow state of the coolant between the liquid cooling plates. By reasonably setting the longitudinal spacing of the fins, the coolant flow rate and flow rate between the heat dissipation components can be significantly improved, thereby improving the turbulence degree and heat exchange efficiency of the coolant. In addition, the increase in the flow rate and flow rate of the coolant will also increase the friction resistance between the fins. These factors all cause the inlet and outlet pressure drop difference to gradually increase.
[0028] Therefore, the distribution density of the heat dissipation components can be reasonably set by reasonably setting at least one of the parameters such as the length, width, height, horizontal spacing or vertical spacing of the heat dissipation components to achieve the purpose of improving the heat dissipation effect.
[0029] In some embodiments, the distribution density of the first heat dissipation component and the second heat dissipation component changes along the flow direction of the coolant, including:
[0030] The distribution density of the first heat dissipation component increases or decreases along the flow direction of the coolant;
[0031] And / or, the distribution density of the second heat dissipation components increases or decreases along the flow direction of the coolant.
[0032] The distribution density of the first heat sink components and the distribution density of the second heat sink components may refer to the number of first heat sink components and second heat sink components in each column, respectively. The distribution density of the first heat sink components may gradually increase or decrease along the flow direction of the coolant; similarly, the distribution density of the second heat sink components may also gradually increase or decrease along the flow direction of the coolant. Such a design can dynamically adjust the heat dissipation capacity of each area according to actual heat dissipation needs, ensure sufficient heat dissipation performance in key areas, and reduce resource waste in areas that do not require excessive heat dissipation. In this way, more refined heat management can be achieved, improving the efficiency and reliability of the overall heat dissipation system, while also helping to save energy and reduce operating costs. See Figure 3 , Figure 3 An exemplary schematic diagram showing the distribution of heat dissipation components according to an embodiment of the present disclosure is shown. Figure 3 In the figure, as the direction of the coolant flow points to the right, the density of the heat dissipation components gradually increases. In area 6, the number of heat dissipation components in each column is A, and in area 7, the number of heat dissipation components in each column is B, and the number B>the number A. It should be understood that Figure 3 The density change is only an example and is not intended to limit the density change. The density change can also be a gradual increase or decrease in the number of heat dissipation components in each column, or a gradual increase or decrease in the number of heat dissipation components in each interval C columns, which is not limited here.
[0033] Figure 3 In the figure, each row of heat dissipation components is aligned left and right in space, and a corrugated fin structure can be used. The relatively smooth sinusoidal corrugations can more effectively guide the coolant to flow through the fins, reduce dead water areas, and increase the effective heat exchange area and heat exchange efficiency. The corrugated fins can be divided into two areas, 6 and 7. There are several rows of corrugated fins distributed in both areas, and the height of each row of corrugated fins is the same. In area 6, each row of heat dissipation fins can also be designed to be staggered with the next row of heat dissipation fins. In area 7, the corrugated fins can be designed to be aligned. The thickness of each row of corrugated fins is reduced but the number is increased, so that the total volume of each row of corrugated fins remains unchanged, so as to ensure that the coolant flow resistance remains basically unchanged, while providing a larger heat dissipation area.
[0034] In some embodiments, the first heat dissipation component is staggeredly disposed in a first region of the first heat sink, and the first heat dissipation component is alignedly disposed in a second region of the first heat sink.
[0035] In some embodiments, the second heat dissipation component is staggeredly disposed in the third region of the second heat sink, and the second heat dissipation component is alignedly disposed in the fourth region of the second heat sink.
[0036] Among them, the first area on the first radiator adopts the method of staggered setting of the first heat dissipation component, while the second area of the first radiator uses the method of aligned setting of the first heat dissipation component. The third area of the second radiator adopts the method of staggered setting of the second heat dissipation component, while the fourth area of the second radiator uses the method of aligned setting of the second heat dissipation component. In this way, the heat exchange efficiency can be optimized according to the actual heat dissipation needs in different areas: the staggered setting can improve the effectiveness of heat exchange in places where the heat dissipation area needs to be increased to avoid local overheating; and the aligned setting helps to maintain the consistency and stability of heat dissipation in areas where heat is more evenly distributed. In this way, the heat dissipation system can better adapt to the heat dissipation needs of different areas, thereby improving the overall heat dissipation efficiency and the working stability of electronic devices.
[0037] In some embodiments, the first region is opposite to the third region, and the second region is opposite to the fourth region.
[0038] In some embodiments, the first region is opposite to the fourth region, and the second region is opposite to the third region.
[0039] Among them, the first area of the first radiator can be opposite to the third area of the second radiator, and the second area of the first radiator can be opposite to the fourth area of the second radiator; and in other embodiments, the first area of the first radiator can be opposite to the fourth area of the second radiator, and the second area of the first radiator can be opposite to the third area of the second radiator. This allows the heat dissipation components to form a complementary layout between different areas of the radiator, so that during the flow of the coolant, the heat dissipation efficiency can be flexibly adjusted according to the actual heat source distribution. When the hot spot areas correspond to each other, the heat dissipation effect of these areas can be enhanced; and when the non-hot spot areas correspond to each other, the consistency of heat dissipation can be guaranteed. This not only improves the heat dissipation performance of the entire system, but also ensures that the electronic devices can maintain a good operating temperature under various working conditions, thereby improving the overall stability and efficiency of the system.
[0040] In some embodiments, the first region of the first heat sink disposes the first heat dissipation components in a staggered manner, including: adjacent columns of the first heat dissipation components in the first region are staggeredly distributed.
[0041] In some embodiments, the second heat dissipation components are staggered in the third region of the second heat sink, including: adjacent columns of the second heat dissipation components in the third region are staggered in distribution.
[0042] The first heat sink components or second heat sinks in adjacent rows are arranged in a staggered distribution manner, which can increase the contact area and path length between the heat sink components and the coolant, thereby improving the heat exchange efficiency. The staggered distribution also helps to promote the turbulence of the coolant, further enhance the heat dissipation effect, ensure that the electronic devices can maintain a low operating temperature under high load conditions, and improve the stability and reliability of the system. Figure 1 In the figure, 3-1 is the liquid inlet end, and the corrugated fin areas through which the coolant flows are 1-6, 1-7, 2-6, and 2-7. The width of the corrugated fin areas 1-6 and 2-6 is 12 rows and 7 columns, the fin length is 11.8mm, the fin width is 2.4mm, the horizontal spacing is 1.8mm, and the vertical spacing is 2.6mm. The 1st, 3rd, 5th, and 7th columns are moved up by 0.2mm, and the 2nd, 4th, and 6th columns are moved down by 0.2mm. Figure 4 shown. Figure 4 A schematic diagram of a staggered design according to an embodiment of the present disclosure is shown. Figure 4 In the process, the staggered arrangement of corrugated fins can enhance the turbulence effect and improve the heat exchange efficiency of the coolant. The corrugated fins are partially encrypted to increase the effective heat dissipation area, weaken the cumulative effect of the temperature when the coolant flows, and reduce the temperature difference between the power modules.
[0043] In some embodiments, the first heat dissipation component includes a first fin and a second fin, and the second heat dissipation component includes a third fin and a fourth fin; wherein the distribution density of the first fin is greater than the distribution density of the second fin, and the distribution density of the third fin is greater than the distribution density of the fourth fin.
[0044] Among them, the distribution density of different heat dissipation components can be suitable for different areas. For example, in heat-concentrated areas (such as near processors or high-power components), high-density fins can provide a larger heat exchange area, thereby enhancing the heat dissipation effect; while in areas with less heat distribution, lower-density fins are used to maintain appropriate heat dissipation capacity and reduce unnecessary material use. In this way, the heat dissipation system can more effectively respond to the heat management needs of different areas, ensure the thermal balance of the entire system, and improve the working stability and life of electronic devices. Figure 1 and Figure 3 As shown, when the first fins in area 1-7 and the third fins in area 2-7 are locally encrypted, the width of each row of fins is reduced but the number is increased, so that the total volume of each row of fins remains unchanged, so as to ensure that the cross-sectional area and flow resistance of the coolant in the lateral direction remain basically unchanged, while providing a larger heat dissipation area. The number of second fins in each row in area 1-6 and the number of fourth fins in each row in area 2-6 are 12, and the width is 2.4mm. After encryption, the number of fins in each row in areas 1-7 and 2-7 is 16, and the width is 1.8mm. Other parameters remain unchanged, and the total volume of each row of fins before and after encryption can remain unchanged.
[0045] In some embodiments, the distribution density of the first fins is greater than the distribution density of the second fins, including: the thickness of the first fins is less than the thickness of the second fins, and the first number of the first fins in each column is greater than the second number of the second fins in each column.
[0046] In some embodiments, the distribution density of the third fins is greater than the distribution density of the fourth fins, including: the thickness of the third fins is less than the thickness of the fourth fins, and the third number of the third fins in each column is greater than the fourth number of the fourth fins in each column.
[0047] In areas where higher heat dissipation efficiency is required (such as high heat density areas), the total surface area can be increased by increasing the number of fins and reducing the thickness of a single fin, thereby improving heat exchange efficiency; while in areas with a smaller heat load, thicker but fewer fins are used to maintain the heat dissipation effect while reducing material usage and potential flow resistance. This approach can optimize the overall performance of the heat dissipation system, ensuring that each part can be properly cooled, thereby improving the stability and energy efficiency of the system.
[0048] In some embodiments, the first heat sink includes a first heat dissipation plate, and the first electronic device and the first heat dissipation component are respectively disposed on both sides of the first heat dissipation plate;
[0049] The second heat sink comprises a second heat dissipation plate, and the second electronic device and the second heat dissipation component are respectively arranged on two sides of the second heat dissipation plate;
[0050] The heat dissipation part further includes a heat dissipation body, and the liquid inlet end and the liquid outlet end are arranged on the heat dissipation body; wherein, the first heat dissipation plate and the second heat dissipation plate form the heat dissipation space with the heat dissipation body.
[0051] Specifically, see Figure 5 and Figure 6 , Figure 5 and Figure 6 A schematic diagram of a heat dissipation unit according to an embodiment of the present disclosure is shown. Figure 5 and Figure 6 In the embodiment, the coolant (such as water) can enter the heat dissipation space from the liquid inlet 3-1, and after being fully in contact with the first heat dissipation component and the second heat dissipation component, it flows out from the liquid outlet 3-2, effectively removing the heat generated by the electronic device. This solution can not only improve the heat dissipation efficiency and ensure that the electronic device operates at a safe temperature, but also simplify the system structure, facilitate maintenance and installation, and thus improve the reliability and performance of the overall system.
[0052] In some embodiments, the heat dissipation portion further includes a through hole and an isolating member, the through hole is used to connect a first heat dissipation channel formed by the first heat dissipation component and a second heat dissipation channel formed by the second heat dissipation component, and the isolating member is used to isolate the first heat dissipation channel from the second heat dissipation channel;
[0053] The liquid inlet end is connected to the first heat dissipation channel, and the cooling liquid enters the first heat dissipation channel through the liquid inlet end, flows through the first heat dissipation channel, enters the second heat dissipation channel through the through hole, and flows out through the liquid outlet end;
[0054] Alternatively, the liquid inlet is connected to the second heat dissipation channel, and the cooling liquid enters the second heat dissipation channel through the liquid inlet, flows through the second heat dissipation channel, enters the first heat dissipation channel through the through hole, and flows out through the liquid outlet.
[0055] The isolating member may be a partition, such as Figure 5 and Figure 6 The partition 3-3 in the partition 3-3 can be a water cooling plate. The inlet and outlet of the coolant can be interchanged. If 3-1 is the inlet, the coolant first passes through the first radiator 1, then passes through the through hole on the right side of the partition, and then flows out through the second radiator 2 and the outlet 3-2. Figure 7 As shown, Figure 7 The schematic diagram of the heat dissipation path according to the embodiment of the present disclosure is shown. If 3-2 is the liquid inlet end, the coolant first passes through the second radiator 2, then passes through the through hole, and then flows out through the first radiator 1 and the liquid outlet end 3-1 (not shown in the figure).
[0056] In some embodiments, a sum of heights of the first heat dissipation component, the second heat dissipation component, and the isolation element is less than or equal to a height of the heat dissipation body.
[0057] The height of the first heat dissipation component may refer to the height in the vertical direction with respect to the first heat dissipation plate, and the height of the second heat dissipation component may refer to the height in the vertical direction with respect to the second heat dissipation plate. The coolant may enter from the liquid inlet and connect with the first heat dissipation channel, then flow through the first heat dissipation channel, enter the second heat dissipation channel through the through hole, and finally flow out from the liquid outlet; or, the coolant may first enter the second heat dissipation channel connected with the liquid inlet, flow through the second heat dissipation channel, enter the first heat dissipation channel through the through hole, and then flow out from the liquid outlet. This design ensures the independence between the two heat dissipation channels through the isolation part, and realizes the circulation of the coolant between the two channels through the through hole, thereby improving the flexibility and heat dissipation efficiency of the heat dissipation system, ensuring that the electronic devices can obtain effective cooling under various working conditions, and improving the stability and reliability of the system. Figure 1 In the figure, the sum of the height of the fin of the upper radiator 1, the height of the fin of the lower radiator 2, and the thickness of the partition 3-3 should be less than the thickness of the partition 3.
[0058] It can be seen that according to the heat dissipation device of the embodiment of the present disclosure, several rows of corrugated fins in the heat dissipation component area close to the liquid inlet end adopt a staggered design to enhance the turbulence effect and improve the heat dissipation efficiency. Several rows of corrugated fins in the heat dissipation component area far from the liquid inlet end have a reduced thickness but increased number, which increases the local heat dissipation area and ensures that the coolant flow resistance remains basically unchanged, weakens the cumulative effect of the coolant temperature, and reduces the temperature difference between multiple electronic device modules. By adjusting the passing area, pressure, and flow rate of the fluid, the overall temperature uniformity effect of the heat dissipation device is achieved.
[0059] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present disclosure (including the claims) is limited to these examples. Based on the concept of the present disclosure, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of simplicity.
[0060] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present disclosure difficult to understand, the known power / ground connections to the integrated circuit (IC) chips and other components may or may not be shown in the provided figures. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present disclosure difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present disclosure will be implemented (that is, these details should be fully within the scope of understanding of those skilled in the art). Where specific details (e.g., circuits) are set forth to describe exemplary embodiments of the present disclosure, it is apparent to those skilled in the art that the embodiments of the present disclosure can be implemented without these specific details or with changes in these specific details. Therefore, these descriptions should be considered illustrative rather than restrictive.
[0061] Although the present disclosure has been described in conjunction with specific embodiments of the present disclosure, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.
[0062] The embodiments of the present disclosure are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure should be included in the scope of protection of the present disclosure.
Claims
1. A double-layer heat dissipation device for electronic devices, characterized in that: include: A first heat sink, wherein a first electronic device is disposed on a first side of the first heat sink, and a first heat dissipation component is disposed on a second side of the first heat sink; A second heat sink, a second electronic device is disposed on a first side of the second heat sink, and a second heat dissipation component is disposed on a second side of the second heat sink; The heat dissipation part includes a liquid inlet, a liquid outlet and an internal heat dissipation space, wherein the cooling liquid enters the heat dissipation space through the liquid inlet and flows out through the liquid outlet; wherein the first radiator and the second radiator are respectively arranged on two sides of the heat dissipation part opposite to each other, and the first heat dissipation component and the second heat dissipation component are accommodated in the heat dissipation space; the distribution density of the first heat dissipation component and the second heat dissipation component changes along the flow direction of the coolant.
2. The device according to claim 1, characterized in that The first heat dissipation component and / or the second heat dissipation component comprises corrugated fins; The distribution density of the first heat dissipation component and the second heat dissipation component changes along the flow direction of the coolant, including: The distribution density of the first heat dissipation component increases or decreases along the flow direction of the coolant; And / or, the distribution density of the second heat dissipation components increases or decreases along the flow direction of the coolant.
3. The device according to claim 1, characterized in that The first heat dissipation component is staggeredly arranged in the first area of the first heat sink, and the first heat dissipation component is alignedly arranged in the second area of the first heat sink; And / or, the second heat dissipation component is staggeredly arranged in the third area of the second heat sink, and the second heat dissipation component is alignedly arranged in the fourth area of the second heat sink.
4. The device according to claim 3, characterized in that The first area is opposite to the third area, and the second area is opposite to the fourth area; Alternatively, the first area is opposite to the fourth area, and the second area is opposite to the third area.
5. The device according to claim 3, characterized in that The first heat dissipation components are staggered in the first region of the first heat sink, including: the first heat dissipation components in adjacent rows in the first region are staggered; And / or, the second heat dissipation components are staggeredly arranged in the third region of the second heat sink, including: the second heat dissipation components in adjacent rows in the third region are staggeredly distributed.
6. The device according to claim 1, characterized in that The first heat dissipation component includes a first fin and a second fin, and the second heat dissipation component includes a third fin and a fourth fin; wherein the distribution density of the first fin is greater than that of the second fin, and the distribution density of the third fin is greater than that of the fourth fin.
7. The device according to claim 6, characterized in that The distribution density of the first fins is greater than the distribution density of the second fins, including: the thickness of the first fins is less than the thickness of the second fins, and the first number of the first fins in each column is greater than the second number of the second fins in each column; The distribution density of the third fins is greater than the distribution density of the fourth fins, including: the thickness of the third fins is less than the thickness of the fourth fins, and the third number of the third fins in each column is greater than the fourth number of the fourth fins in each column.
8. The device according to claim 1, characterized in that The first heat sink comprises a first heat dissipation plate, and the first electronic device and the first heat dissipation component are respectively arranged on both sides of the first heat dissipation plate; The second heat sink comprises a second heat dissipation plate, and the second electronic device and the second heat dissipation component are respectively arranged on two sides of the second heat dissipation plate; The heat dissipation part further includes a heat dissipation body, and the liquid inlet end and the liquid outlet end are arranged on the heat dissipation body; wherein, the first heat dissipation plate and the second heat dissipation plate form the heat dissipation space with the heat dissipation body.
9. The device according to claim 1, characterized in that The heat dissipation part further includes a through hole and an isolating member, wherein the through hole is used to connect a first heat dissipation channel formed by the first heat dissipation component and a second heat dissipation channel formed by the second heat dissipation component, and the isolating member is used to isolate the first heat dissipation channel from the second heat dissipation channel; The liquid inlet end is connected to the first heat dissipation channel, and the cooling liquid enters the first heat dissipation channel through the liquid inlet end, flows through the first heat dissipation channel, enters the second heat dissipation channel through the through hole, and flows out through the liquid outlet end; Alternatively, the liquid inlet is connected to the second heat dissipation channel, and the cooling liquid enters the second heat dissipation channel through the liquid inlet, flows through the second heat dissipation channel, enters the first heat dissipation channel through the through hole, and flows out through the liquid outlet.
10. The device according to claim 9, characterized in that The sum of the heights of the first heat dissipation component, the second heat dissipation component, and the isolation member is less than or equal to the height of the heat dissipation body.