3results about How to "Avoid printing" patented technology

The application relates to an LED light-emitting module, an LED packaging structure and a related manufacturing method, and relates to the technical field of semiconductor light emission. Each light-emitting diode chip is packaged in advance, a plurality of annular grooves are formed in the first packaging layer, each annular groove surrounds a corresponding light-emitting diode chip, a magnetic adsorption structure is formed in each annular groove, the magnetic adsorption structure is embedded into a plurality of second grooves, the peeling of the magnetic adsorption structure can be effectively avoided, the magnetic adsorption structure is magnetized, the above magnetic adsorption structure can realize the detachable connection of the light-emitting diode chip and the circuit substrate, the printing of solder and the reflow soldering process can be avoided, the manufacturing cost is greatly reduced, and since the light-emitting diode chip and the circuit substrate are detachably connected, the removal of a defective light-emitting diode chip is facilitated, and the repair of the light-emitting module can be smoothly realized.

The utility model relates to the technical field of strapping, in particular to strapping equipment with a needle type printing function, which comprises a casing, a tape reel and a printing component are mounted in the casing, a strapping tape is wound on the tape reel, and one end of the strapping tape is led out of the tape reel and penetrates through the printing component. Wherein the printing assembly comprises a guide plate, a needle type printing head, a colored tape box and a colored tape driving assembly, the guide plate is provided with an inner cavity penetrating through the guide plate so that the binding tape can penetrate through, the guide plate is provided with a first opening and a second opening which penetrate through the two side walls in the thickness direction of the guide plate and are oppositely arranged, and a guide wheel abutting against the binding tape is installed at the first opening. A colored tape is stored in the colored tape box, part of the colored tape is led out of the colored tape box and located at the second opening, the colored tape located outside the colored tape box is attached to the binding tape at the second opening, the colored tape located at the second opening is located between the needle type printing head and the binding tape, and the colored tape driving assembly can drive the colored tape and the binding tape to synchronously move at the second opening.

This utility model discloses a special ceramic metallization printing fixture, belonging to the field of special ceramic processing technology. The fixture includes a positioning frame and a mounting plate detachably installed within the positioning frame. It also includes: mounting holes arranged in a rectangular array on the mounting plate for placing ceramic substrates; each mounting hole has a clamping part for limiting the ceramic substrate's position. When the ceramic substrate is located within the mounting hole, its surface is flush with the mounting hole. Through the arrangement of the mounting plate and mounting holes, when the ceramic substrate is placed into the mounting hole, it directly contacts the anti-slip texture on the anti-slip pad, and the elasticity of the elastic sheet compresses the sidewall of the ceramic substrate, thereby limiting its position. This fixture can adapt to ceramic substrates of different sizes of the same type, effectively improving the adaptability of the mounting plate to the ceramic substrate and further improving production efficiency.