Semiconductor refrigeration heat converter

Abstract

The invention discloses a semiconductor refrigeration heat exchanger, which comprises a semiconductor chilling plate and a heat exchange body on which a fluid circulation channel is arranged, wherein, the semiconductor chilling plate is stored in the heat exchange body; both end faces of the fluid circulation channel and the semiconductor chilling plate form a cold circulation channel and a warm circulation channel which are respectively independent. The semiconductor refrigeration heat exchanger has a reasonable structure, strong leak tightness and high heat exchange efficiency, utilizes two fluid circulation channels to independently transmit heat quantity and cold quantity which are generated by the semiconductor chilling plate, and uses pipes to exchange heat, thereby being favorable for saving the space and improving the flexibility and the compactness of the overall layout of products.

Description

technical field [0001] The invention relates to a heat exchanger, in particular to a heat exchanger applied in the field of semiconductor refrigeration. Background technique [0002] Semiconductor refrigeration technology uses the significant Peltier effect of semiconductor galvanic couples to achieve refrigeration. It has the advantages of small size, light weight, large temperature difference, high efficiency, convenient use, pollution-free, durable and reliable, and is widely used in drinking water. Machines, cold boxes, car cold boxes and other refrigeration products. [0003] The invention patent of the People's Republic of China 95236961.3 discloses a thermoelectric cooler heat exchanger, which includes a heat exchange body with a liquid circulation channel on its surface. The two ends of the channel are liquid inlet and outlet pipes, and the channel wall heat dissipation ribs are between the channels. The side of the heat exchange body with the channel is the joint p...

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Problems solved by technology

Although the structure of the heat exchanger is simple and the heat exchange is direct, affected by the structure of the heat exchanger, the semiconductor sheet of the heat exchanger must be placed close to the cooled medium or container (such as the cold tank of the water dispenser), so that the internal structure of the water dispenser The layout is limited, the thickness of the semiconductor chip and the heat exchange body is relatively large, and the width of the water dispenser is increased when it is pasted on the cooler of the water dispenser, which affects the appearance; and it hinders the design of the cooling ribs on the channel wall of the heat exchanger liquid circulation channel , leading to low heat dissipation efficiency of the semiconductor chip; the closed liquid channel formed by the bonding plane and the cooled plane has a low sealing degree

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