Semiconductor refrigeration heat converter

A heat exchanger and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device parts, refrigerators, etc., can solve the problem of large thickness of semiconductor sheets and heat exchangers, low heat dissipation efficiency of semiconductor sheets, and increased width of water dispensers. problems, to achieve the effect of improving flexibility and compactness, strong sealing and space saving

Inactive Publication Date: 2008-09-10
卢振涛 +1
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  • Summary
  • Abstract
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Problems solved by technology

Although the structure of the heat exchanger is simple and the heat exchange is direct, affected by the structure of the heat exchanger, the semiconductor sheet of the heat exchanger must be placed close to the cooled medium or container (such as the cold tank of the water dispenser), so that the internal structure of the water dispenser The layout is limited, the thickness of the semiconductor chip and the heat exchange body is rel

Method used

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  • Semiconductor refrigeration heat converter
  • Semiconductor refrigeration heat converter
  • Semiconductor refrigeration heat converter

Examples

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Example Embodiment

[0021] Such as figure 1 As shown, the semiconductor refrigeration heat exchanger of the present invention includes a semiconductor refrigeration fin 1 and a heat exchange body 2. The heat exchange body 2 is provided with a fluid circulation channel, wherein the semiconductor refrigeration fin 1 is hidden in the heat exchange body 2, and the fluid circulation channel and The end faces on both sides of the semiconductor refrigeration fin 1 constitute independent cold and warm circulation channels 31, 32, and the two channels are equipped with a liquid pump 6 at the intersection of the two channels. The cold flow heat exchange channel 31 is wound around the medium storage container 4 (such as a water cooler). On the outer wall, the warm flow heat exchange channel 32 bypasses the condenser 5, and the condenser 5 is equipped with a heat dissipation fan.

[0022] When the present invention is applied to the field of water dispensers, the semiconductor refrigeration sheet 1 is designed ...

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Abstract

The invention discloses a semiconductor refrigeration heat exchanger, which comprises a semiconductor chilling plate and a heat exchange body on which a fluid circulation channel is arranged, wherein, the semiconductor chilling plate is stored in the heat exchange body; both end faces of the fluid circulation channel and the semiconductor chilling plate form a cold circulation channel and a warm circulation channel which are respectively independent. The semiconductor refrigeration heat exchanger has a reasonable structure, strong leak tightness and high heat exchange efficiency, utilizes two fluid circulation channels to independently transmit heat quantity and cold quantity which are generated by the semiconductor chilling plate, and uses pipes to exchange heat, thereby being favorable for saving the space and improving the flexibility and the compactness of the overall layout of products.

Description

technical field [0001] The invention relates to a heat exchanger, in particular to a heat exchanger applied in the field of semiconductor refrigeration. Background technique [0002] Semiconductor refrigeration technology uses the significant Peltier effect of semiconductor galvanic couples to achieve refrigeration. It has the advantages of small size, light weight, large temperature difference, high efficiency, convenient use, pollution-free, durable and reliable, and is widely used in drinking water. Machines, cold boxes, car cold boxes and other refrigeration products. [0003] The invention patent of the People's Republic of China 95236961.3 discloses a thermoelectric cooler heat exchanger, which includes a heat exchange body with a liquid circulation channel on its surface. The two ends of the channel are liquid inlet and outlet pipes, and the channel wall heat dissipation ribs are between the channels. The side of the heat exchange body with the channel is the joint p...

Claims

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Application Information

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IPC IPC(8): F25B21/02H01L23/38
Inventor 卢振涛崔铁生
Owner 卢振涛
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