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Light-emitting diode with light distributing function and preparation method thereof

A technology of light-emitting diodes and functions, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of soft light, small light-emitting area, the gap between actual service life and theoretical life, etc., to expand the divergence angle and increase the light-emitting area. , soft light effect

Inactive Publication Date: 2010-12-22
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, traditional LEDs have many defects: 1. Expensive price; 2. Low light output efficiency; 3. There is a big gap between actual service life and theoretical life; 4. Poor heat dissipation and high heat generation; 5. Small light-emitting area Concubine uneven; 6. There are great differences in luminous intensity and brightness at different angles, and the light is not soft

Method used

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  • Light-emitting diode with light distributing function and preparation method thereof

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Embodiment Construction

[0011] The present invention is described in detail below in conjunction with accompanying drawing:

[0012] Such as figure 1 As shown, the light-emitting diode with light distribution function of the present invention includes a heat sink 1, several LED chips 2 fixed on the heat sink, a phosphor layer 3 fixed on the heat sink 1 and covering the LED chips 2, and a phosphor layer 3 covered on the phosphor The silicone encapsulation layer 4 on the layer 3, and the electrode leads 5 connected with the LED chip 2.

[0013] The LED chips 2 are connected in series or in parallel by bonding wires to form a matrix, and are fixed on the cooling plate 1 .

[0014] The phosphor layer 3 is coated on the heat dissipation plate 1 and covers the LED chip 2 .

[0015] The silica gel encapsulation layer 4 is formed by mixing silica gel and nanometer or micron particles, so that the luminescent area can be increased, the emission angle can be increased, and at the same time, the light can be ...

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Abstract

The invention provides a light-emitting diode with a light distributing function and a preparation method thereof. The light-emitting diode comprises a heat-radiating panel (1), LED chips (2), a fluorescent powder layer (3), a silica gel packaging layer (4) and electrode leads (5), wherein the LED chips (2) are fixed on the heat-radiating panel (1) and are arranged in an array way; the fluorescent powder layer (3) is coated on the heat-radiating panel (1) and completely covers the LED chips (2); the silica gel packaging layer (4) is coated on the fluorescent powder layer (3); the electrode leads (5) are connected with electrodes of the LED chips (2) and are exposed to the outside; and the silica gel packaging layer (4) is formed by mixing silica gel, nano or silica gel and micron particles. In the light-emitting diode, nano or micro particles are added in the silica gel packaging layer, thereby enlarging the divergence angle, increasing the light-emitting area and enabling the light to be milder.

Description

【Technical field】 [0001] The invention relates to a light-emitting diode and a preparation method thereof, in particular to a light-emitting diode with a light distribution function and a preparation method thereof. 【Background technique】 [0002] In recent years, the technology of LED has developed rapidly. The improvement of its luminous brightness and the extension of its life, coupled with the substantial reduction of production costs, have made LED quickly enter the field of lighting and enter the stage of practical application. LED is a solid-state semiconductor device that can directly convert electricity into light. It is an ideal light source to replace traditional light sources. It has a wide range of uses and many advantages, such as: small size, low power consumption, and long service life. Long, high brightness, low heat, environmental protection, energy saving, durable, etc. [0003] LED packaging adopts corresponding dimensions according to different applicat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56
Inventor 张方辉毕长栋蒋谦丁磊
Owner SHAANXI UNIV OF SCI & TECH
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