Distributed radiating LED (light emitting diode) lamp bulb

Abstract

The invention relates to a distributed radiating LED (light emitting diode) lamp bulb which belongs to the technical field of semiconductor lighting and comprises a conductive lamp head inserting port, a lamp shell, and LED chips which are covered in a lamp cover and are connected with the conductive lamp head, wherein one end of the lamp shell is fixedly connected with the lamp head inserting port by an insulating bracket, the other end of the lamp shell is provided with a conductive insulating board and is buckled with the lamp cover, the conductive insulating board is provided with a group of radiation-shaped radial slot holes, radiating blades are inserted in the radial slot holes, one ends of the radiating blades extend into the lamp shell, each radiating blade comprises a positioning surface and a radiating surface, the positioning surfaces are fixed with the conductive insulating board in a fitting way, the radiating surfaces are vertical to the positioning surfaces, an outer ring of the lamp shell is provided with radiating windows which are distributed at intervals and extend axially, each LED chip is arranged between the positioning surfaces of the adjacent radiating blades in a span way, and radiating pins are respectively welded with the adjacent positioning surfaces. After the distributed radiating LED lamp bulb is adopted, under the condition that the original shape and the original volume of the lamp bulb are not changed, as the radiating performance is improved greatly, the power is increased, and use requirements are met.

Description

technical field [0001] The invention relates to an LED light bulb, in particular to a distributed heat dissipation LED light bulb, which belongs to the technical field of semiconductor lighting. Background technique [0002] As far as the applicant knows, the core technology of semiconductor lighting lies in its luminous efficiency and heat dissipation structure. At present, the existing LED bulbs often use figure 1 In the integrated heat dissipation structure shown, a plurality of LED chips are fixed on the heat conductor through thermal conductive glue, and then the heat conductor is fixed on the heat dissipation lamp housing of the overall structure. When the LED power is increased and the heat dissipation effect needs to be improved, it must be achieved by increasing the volume of the lamp housing and the heat dissipation surface area. As a result, not only the weight and cost of the lamp are increased, but also often limited by the installation structure of the lamp. ...

AI Technical Summary

Problems solved by technology

This technical solution is still an overall heat dissipation structure, so the improvement of heat dissipation performance is still limited by the structure of the lamp itself, and it is difficult to significantly improve it without increasing the volume

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