A microwave plasma chemical vapor deposition device

A chemical vapor deposition, microwave plasma technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of low use rate of doping gas and unsatisfactory film forming effect.

Active Publication Date: 2016-02-24
西安德盟特半导体科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a microwave plasma chemical vapor deposition device to solve the technical problems of low doping gas usage rate and unsatisfactory film forming effect in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A microwave plasma chemical vapor deposition device
  • A microwave plasma chemical vapor deposition device
  • A microwave plasma chemical vapor deposition device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 As shown, the present invention includes a waveguide device 1 for introducing microwaves. The waveguide device 1 comprises: a microwave input device 11 having a rectangular cross-sectional shape; a microwave output device 12 having a circular cross-sectional shape; wherein the microwave input device 11 is connected with the microwave output device 12, so that Microwaves are introduced into the microwave output device 12 . Generally speaking, the frequency of the microwave input in the microwave input device 11 is between 0.5 and 15 GHz, and 2.45 GHz is an ideal microwave source. The waveguide device 1 also includes a height-adjustable antenna 13 that passes through the microwave input device 11 transversely and extends into the microwave output device 12 and is coaxial with the microwave output device. The antenna 13 is used to convert the microwaves of the rectangular coordinates in the rectangular waveguide is the microwave in cylindrical coordinate...

Embodiment 2

[0047] Such as Figure 7 As shown, the microwave plasma chemical vapor deposition device of the present invention includes: a waveguide device 1 for introducing microwaves, the waveguide device 1 is connected to the reaction chamber 2 arranged below it, and the top of the reaction chamber 2 is uniformly arranged on the circumferential direction. A plurality of reaction gas inlets 9; an isolation window 7 is arranged horizontally at the connection between the waveguide device 1 and the reaction chamber 2, and the isolation window 7 is used to isolate the waveguide device 1 from the reaction chamber 2 and keep the reaction chamber 2 preset The degree of vacuum; inside the reaction chamber 2, a sample stage 4 for supporting the substrate holder 3 is coaxially arranged, and the diameter of the substrate holder 3 is 10-50 millimeters; around the substrate holder 3, there is a gas outlet for the reaction gas to flow out of the reaction chamber. Gas channel for chamber 2.

[0048] D...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a microwave plasma chemical vapor deposition device. The device comprises a waveguide device for guiding microwave, wherein the waveguide device is connected with a reaction chamber below the waveguide device, a plurality of reaction gas inlets are uniformly formed in the reaction chamber in a peripheral direction, an isolation window is horizontally arranged at the joint between the waveguide device and the reaction chamber, the isolation window is used for separating the waveguide device from the reaction chamber and allowing the reaction chamber to keep the preset vacuum degree, a sample platform for supporting a substrate support is coaxially arranged in the reaction chamber, and gas channels, from which the reaction gas flows out of the reaction chamber, are arranged around the substrate support. According to the microwave plasma chemical vapor deposition device, the technical problems in the prior art that the service efficiency of doped gases is low and the film forming effect is non-ideal as doping elements cannot be effectively mixed into the film formed on the surface of a substrate are solved. The device disclosed by the invention is mainly used in the field of plasma processing.

Description

technical field [0001] The invention relates to the field of microwave plasma processing, in particular to a microwave plasma chemical vapor deposition device. Background technique [0002] Microwave plasma is a kind of plasma formed by using microwave energy to ionize gas: the gas in the reaction chamber is ionized under the action of the imported microwave electromagnetic field to form a mixture of atoms, atomic groups, ions and electrons. Chemical vapor deposition (Chemical vapor deposition, referred to as CVD) is a process technology in which reactive substances are ionized or decomposed under gaseous conditions, react on or near the surface of the substrate, and deposit solid substances on it, thereby producing solid materials. [0003] Microwave plasma CVD is a process device that uses microwave energy to realize chemical vapor deposition, which has the advantages of large output, high quality and low cost. The principle is that microwaves resonate in the reaction cha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityPatents(China)
IPC IPC(8): C23C16/517C23C16/511C23C16/513
Inventor王宏兴
Owner西安德盟特半导体科技有限公司