A microwave plasma chemical vapor deposition device
A chemical vapor deposition, microwave plasma technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of low use rate of doping gas and unsatisfactory film forming effect.
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Embodiment 1
[0026] Such as figure 1 As shown, the present invention includes a waveguide device 1 for introducing microwaves. The waveguide device 1 comprises: a microwave input device 11 having a rectangular cross-sectional shape; a microwave output device 12 having a circular cross-sectional shape; wherein the microwave input device 11 is connected with the microwave output device 12, so that Microwaves are introduced into the microwave output device 12 . Generally speaking, the frequency of the microwave input in the microwave input device 11 is between 0.5 and 15 GHz, and 2.45 GHz is an ideal microwave source. The waveguide device 1 also includes a height-adjustable antenna 13 that passes through the microwave input device 11 transversely and extends into the microwave output device 12 and is coaxial with the microwave output device. The antenna 13 is used to convert the microwaves of the rectangular coordinates in the rectangular waveguide is the microwave in cylindrical coordinate...
Embodiment 2
[0047] Such as Figure 7 As shown, the microwave plasma chemical vapor deposition device of the present invention includes: a waveguide device 1 for introducing microwaves, the waveguide device 1 is connected to the reaction chamber 2 arranged below it, and the top of the reaction chamber 2 is uniformly arranged on the circumferential direction. A plurality of reaction gas inlets 9; an isolation window 7 is arranged horizontally at the connection between the waveguide device 1 and the reaction chamber 2, and the isolation window 7 is used to isolate the waveguide device 1 from the reaction chamber 2 and keep the reaction chamber 2 preset The degree of vacuum; inside the reaction chamber 2, a sample stage 4 for supporting the substrate holder 3 is coaxially arranged, and the diameter of the substrate holder 3 is 10-50 millimeters; around the substrate holder 3, there is a gas outlet for the reaction gas to flow out of the reaction chamber. Gas channel for chamber 2.
[0048] D...
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Abstract
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