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A kind of diamond grinding and polishing method

A diamond and diamond particle technology, applied in the field of precision machining, can solve the problems of reducing the efficiency of diamond grinding and polishing operations

Active Publication Date: 2017-02-22
盐城新汇村镇建设发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, before grinding and polishing the diamond, the step of first determining the diamond grinding crystal orientation itself greatly reduces the efficiency of the diamond grinding and polishing operation.

Method used

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  • A kind of diamond grinding and polishing method
  • A kind of diamond grinding and polishing method
  • A kind of diamond grinding and polishing method

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Embodiment Construction

[0023] The present invention will be further described in detail through the accompanying drawings and specific embodiments below.

[0024] The invention provides a diamond grinding and polishing method. While the grinding disc rotates at high speed to grind and polish the surface of the diamond particles, the clamping device that holds the diamond particles is driven by a driving device to rotate on the axis perpendicular to the grinding and polishing surface of the grinding disc. .

[0025] Using this method, multiple diamond particles can be installed on the clamping device, and the clamping device is driven to rotate through the driving device, thereby driving the diamond particles to rotate 360° on the grinding and polishing surface of the grinding disc. Each crystallographic orientation is ground.

[0026] When grinding and polishing the diamond particles, the diamond particles are pressed against the grinding and polishing surface of the grinding disc by using a spring...

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Abstract

The invention discloses a diamond grinding and polishing method; while the surfaces of diamond particles are ground and polished by the high-speed rotation of a grinding plate, a clamping device for clamping the diamond particles is driven by a driving device to rotate by means of the vertical line of the grinding and polishing surface of the grinding plate as an axis. With adoption of the technical scheme in the diamond grinding and polishing method, a plurality of diamond particles are rotated for 360 degrees around the vertical line of the grinding and polishing surface of the grinding plate, so that the grinding plate is capable of grinding the diamond particles in each crystal orientation; on one hand, the step of determining the grinding crystal orientations of the diamond particles in the prior art is omitted and the working efficiency is improved effectively; on the other hand, the uniform consumption of the grinding plate can be maintained, so that the service life of the tool is prolonged without repairing.

Description

technical field [0001] The invention relates to the technical field of precision machining, in particular to a diamond grinding and polishing method. Background technique [0002] Due to its unique physical and mechanical properties, especially its extremely high hardness, diamond has irreplaceable applications in the fields of industrial manufacturing and scientific and technological research. In the late 1950s, the United States developed SPDT (Single Point Diamond Turning) technology to meet the development requirements of ultra-precision cutting technology. In this technology, diamond is used as a cutting tool manufacturing material, which also makes diamond tool manufacturing technology a key technology in the field of ultra-precision machining. Diamond itself has strong anisotropy. This property is manifested in the friction characteristics. The most typical example is that the material removal efficiency of different crystal planes and orientations of diamonds shows...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/00B24B37/27
CPCB24B37/00B24B37/27
Inventor 方钲键杨新宽
Owner 盐城新汇村镇建设发展有限公司
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