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Virtual instrument platform

A virtual instrument and platform technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem of virtual instrument mobility, poor drop resistance, waterproof and dustproof capabilities, and lack of portability and stability of the system In order to improve portability, maintain integrity and improve mobility

Active Publication Date: 2015-10-21
广州岱诺智能系统有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It makes its accessories complex, with many connections, the system is not portable, and the stability is low
And because the components need to be connected by cables, the mobility, drop resistance, waterproof and dustproof capabilities of the existing virtual instrument are relatively poor

Method used

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0020] The first embodiment of the present invention relates to a virtual instrument platform, such as figure 1 and figure 2 Combined with what is shown, it includes a shell 1 , a board 2 and a main board 8 . Wherein, the main board 8 is detachably connected to the board 2, the board 2 and the main board 8 are located in ...

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Abstract

The present invention relates to a virtual instrument platform. The platform comprises a housing, a board card and a mainboard, wherein the mainboard and the board card can be detachably connected to each other, both the board card and the main board are located out of the housing, a board card interface hole is pre-arranged on the surface of the housing, and a board card interface that connects the board card with an external device is exposed outside by means of the board card interface hole. The virtual instrument platform further comprises a touch display screen, wherein the touch display screen is mounted on the housing and forms a panel structure together with the housing. In the implementation mode of the present invention, the housing further comprises a body and a side cover, wherein the side cover and the body can be detachably connected with each other and the side cover is located on one side of the board card. Compared with the prior art, the virtual instrument platform provided by the present invention has an in-built board card, has relatively high mobility and stability and has a better weak three-proofing ability, without being limited by the application environment and the scenarios.

Description

technical field [0001] The invention relates to an electronic device, specifically a virtual instrument platform. Background technique [0002] Virtual instrument technology is a technology that uses high-performance modular hardware combined with efficient and flexible computer software to complete various testing, measurement and automation applications. The advantage of virtual instrument technology is to provide users with an instrument solution that is more flexible than special instruments, can be customized, its performance can be improved with computer software and hardware, and its price is more favorable. Virtual instrument technology uses boards with multiple functions. These boards and computers form a virtual instrument platform, which is widely used in data acquisition, testing, measurement and other fields in aerospace, navigation, electric power, automation and other industries. [0003] The existing virtual instrument platform usually adopts a large-scale c...

Claims

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Application Information

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IPC IPC(8): G06F1/16
Inventor 李明东青建德刘军
Owner 广州岱诺智能系统有限公司
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