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Artificial heat-dissipation bonsai

A bonsai, real technology, applied in the direction of cooling/ventilation/heating transformation, clothing, electrical components, etc., can solve the problems of shortened service life, poor heat dissipation, unstable system operation, etc., to achieve strong plasticity and better viewing effect good effect

Active Publication Date: 2017-05-10
济宁高新科达科技项目服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components
However, the existing radiators are generally integrated into electronic products. Since the volume of electronic products is getting smaller and smaller, the integration difficulty is increased, and the heat dissipation effect is not good. If the radiator is placed externally, it will affect the appearance of electronic products.

Method used

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  • Artificial heat-dissipation bonsai
  • Artificial heat-dissipation bonsai
  • Artificial heat-dissipation bonsai

Examples

Experimental program
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Embodiment Construction

[0023] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below with reference to the drawings and embodiments.

[0024] The present invention provides a simulated heat dissipation bonsai, specifically as shown in Figure 1-3, the bonsai includes a metal base 1 with a heat conduction function, a fixing seat 2 and a plurality of heat dissipation blades 3 of different lengths, the heat dissipation blades 3 in this embodiment The base 1 is made of copper-aluminum bonded material. Among them, the fixed seat 2 is fixedly connected with the base 1, and the fixed seat 2 is provided with a socket 4, and the user can insert the long blade and the short blade in the socket 4 at different positions according to his personal preference. When changing the shape, the cooling fins 3 are pulled out, and the position can be changed arbitrarily.

[0025] The heat dissipation blade 3 is made of thin aluminum plate mater...

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PUM

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Abstract

The invention discloses an artificial heat-dissipation bonsai which comprises a metal base having a heat conducting function, a fixing base and multiple heat-dissipation blades made of a thin aluminum material. The base is fixedly connected with the fixing base, insertion holes are formed in the fixing base, and the heat-dissipation blades are fixed to the heat-dissipation base through the insertion holes. A light source is further arranged in the fixing base. The heat-dissipation blades are covered with a layer of transparent film. The transparent film is provided with veins made from light-guiding fiber. The light-guiding fiber conducts out light from the light source. The transparent film and the light-guiding fiber are arranged on the surfaces of the heat-dissipation blades, the light from the light source is conducted and extends, so that the light irradiated on the heat-dissipation blades is uniform, and the whole artificial heat-dissipation bonsai simultaneously has heat dissipation and light-emitting functions and a good ornamental effect.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a simulated heat dissipation bonsai. Background technique [0002] A radiator refers to a device or instrument that transfers heat generated by machinery or other appliances in the course of work in a timely manner to avoid affecting its normal operation. [0003] Integrated circuits are widely used in components of electronic products such as computers, game machines or projectors. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. However, the existing heat sinks are generally integrated into electronic products. Since the volume of electronic products is getting smaller and smaller, the difficulty of integration increases, and the heat dissipation effect is not good. If the heat sink is placed externally, it will affect the a...

Claims

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Application Information

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IPC IPC(8): A41G1/00H05K7/20
CPCA41G1/001H05K7/20409
Inventor 谭弘平邓中应姜文新
Owner 济宁高新科达科技项目服务有限公司
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