Capacitor cooling device

A technology of heat dissipation device and capacitor, applied in the field of capacitors, can solve the problems of slow cooling rate of natural cooling, small heat dissipation area of ​​capacitors, etc., and achieve the effects of improving heat dissipation performance, strong heat dissipation effect, and large heat dissipation area

Active Publication Date: 2019-02-26
宁波博恩电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The capacitor heat dissipation device of the present invention solves the problems of small heat dissipation area of ​​capacitors and slow cooling speed of natural cooling in the prior art

Method used

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  • Capacitor cooling device

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Embodiment Construction

[0033] The following is a further detailed description through specific implementations:

[0034] The reference signs in the drawings of the specification include: capacitor 1, insulating paper 2, heat pipe 3, first heat conducting column 4, second heat conducting column 5, first conductive block 6, second conductive block 7, support plate 8, fan 9. The conductive plate 10, the airbag 11, and the thermal conductive film 12.

[0035] The embodiment is basically as attached figure 1 Shown:

[0036] The capacitor heat dissipation device of the present invention includes a heat pipe 3 and a power supply (not shown in the figure). The heat pipe 3 is provided with a capacitor 1 element wrapped with insulating paper 2, and the end of the heat pipe 3 away from the lead of the capacitor 1 is provided with heat insulation Handle; the two ends of the heat pipe 3 are respectively provided with a first heat conduction column 4 and a second heat conduction column 5; a dust-proof mesh cloth is pr...

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Abstract

The invention discloses a capacitor cooling device, which belongs to the field of capacitors and aims at solving the problems that the cooling area of the capacitor is small and the natural cooling and temperature reduction speed is slow in the prior art. The capacitor cooling device comprises a heat conduction tube; a capacitor element wrapped with insulating paper is arranged in the heat conduction tube; two ends of the heat conduction tube are provided with a first heat conduction column and a second heat conduction column respectively; the top end of the second heat conduction column is fixedly provided with a supporting plate; and a fan facing the capacitor element is fixedly arranged on the supporting plate; the top end of the first heat conduction column is fixedly provided with a first conductive block; a second conductive block is fixedly arranged at the edge of the supporting plate; the side wall of the heat conduction tube is provided with a groove; an air bag is arranged inthe groove; the air bag is sleeved with a heat conduction film; the top part of the heat conduction film is fixedly provided with a conductive plate; and the conductive plate can be contacted with afirst conductive block and a second conductive block at the same time. The scheme is suitable for the design of the cooling structure of a compensation capacitor.

Description

Technical field [0001] The invention belongs to the field of capacitors, and specifically relates to a capacitor heat dissipation device. Background technique [0002] As the basic component of the compensation circuit, the compensation capacitor is very important in the compensation circuit. Its quality directly affects the working state of the compensation circuit. As a high-power component, how to improve the heat dissipation performance of the compensation capacitor is a problem. important topic. [0003] Chinese patent CN105428061B provides a heat dissipation structure for power compensation capacitors, which includes a capacitor barrel-shaped shell. A plurality of capacitor elements connected in parallel are arranged longitudinally in the center of the shell. Filled with insulating paraffin, the capacitor element is connected to the electrode connecting piece through the electrode connecting wire, the electrode connecting piece is fixed on the bottom surface of the pin plate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G2/08
CPCH01G2/08
Inventor 陈亮
Owner 宁波博恩电气有限公司
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