Circuit board with thick copper lines and manufacturing method thereof
A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as poor etching factor, and achieve the effect of avoiding unclean etching and burr phenomenon.
Active Publication Date: 2020-11-03
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the lines, so there are limitations in using thick copper to make thin lines; and the conductive lines of conventional printed circuit boards are usually reduced. It is a well-established method, but limited by the thickness of copper, it can only be used with thin copper for making thin lines, and the etching factor is poor after production, and the etching is not clean to form burrs
Method used
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Embodiment Construction
[0033] The circuit board provided by the present invention and its manufacturing method will be further described in detail below with reference to the drawings and embodiments.
[0034] see Figure 1-15 , the first embodiment of the present invention provides a method for manufacturing a circuit board with thick copper lines, the steps of which include:
[0035] For a first step, see Figure 1 to Figure 2 , provide a single-sided copper-clad substrate 10, the single-sided copper-clad substrate 10 includes a support layer 11 and a base copper layer 12 covering the surface of the support layer 11, the base copper layer 12 includes a first surface 121 and the support layer 11 contact with the second surface 123 . The support layer 11 may be polyethylene terephthalate (PET).
[0036] The method for providing the single-sided copper-clad substrate 10 includes: see figure 1 , provide the base copper layer 12 wound on the reel 101, roll out the base copper layer 12 from the reel...
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Abstract
A method for manufacturing a circuit board, comprising: providing a copper-clad substrate, the copper-clad substrate including a support layer and a base copper layer; electroplating on a surface of the base copper layer to form a first conductive circuit pattern; Form the first protective layer on the surface of the pattern, and the first protective layer also fills the gap between the first conductive circuit pattern and the base copper layer; peel off the supporting layer; form a second electroplating on the other surface of the base copper layer. Conductive circuit pattern; the part of the base copper layer exposed by the first conductive circuit pattern and the second conductive circuit pattern is etched away to form the base copper layer into a base copper conductive circuit pattern, the base copper conductive circuit pattern, the The first conductive circuit pattern and the second conductive circuit pattern jointly form a conductive circuit; and a second protective layer is formed on the surface of the second conductive circuit pattern, and the second protective layer also fills the second conductive circuit pattern and the first conductive circuit pattern. Gaps between protective layers.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with thick copper lines and a production method thereof. Background technique [0002] With the rapid development of electronic products, the printed circuit board as the support of components and the carrier of electrical signals should also gradually become miniaturized, lightweight, high-density and multi-functional, and then the production of fine lines of printed circuit boards put forward higher requirements. The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the line, so the use of thick copper to make thin lines has its own limitations; and the conductive lines of conventional printed circuit boards are usually reduced. However, limited by the thickness of copper, only thin copper can be used to make thin lines, and the etching factor...
Claims
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IPC IPC(8): H05K1/11H05K3/06H05K3/24
CPCH05K1/11H05K3/06H05K3/243H05K2203/054Y10T29/49155H05K3/0097H05K2201/0355H05K3/064H05K3/427H05K2203/1545H05K3/108H05K2203/0152H05K1/0393H05K3/4652H05K2201/0137H05K2201/0154H05K2203/107H05K2203/0228H05K3/4682H05K1/0225H05K3/282H05K3/188H05K3/0026H05K1/111H05K1/09
Inventor许芳波吴鹏沈鉴泉吴科建
OwnerAVARY HLDG (SHENZHEN) CO LTD