Circuit board with thick copper circuit, and manufacturing method for circuit board

Abstract

The invention provides a manufacturing method for a circuit board, and the method comprises the steps: providing a copper-coated substrate which comprises a supporting layer and a base copper layer; carrying out the electroplating on one surface of the base copper layer to form a first conductive circuit diagram; forming a first protection layer on the surface of the first conductive circuit diagram, wherein the first protection layer is disposed in a gap between the first conductive circuit diagram and the base copper layer; peeling off the support layer; carrying out the electroplating on the other surface of the base copper layer to form a second conductive circuit diagram; removing the parts, which are exposed by the first and second conductive circuit diagram, of the base copper layerthrough etching, so as to enable the base copper layer to form a base copper conductive circuit diagram, wherein the base copper conductive circuit diagram and the first and second conductive circuitdiagrams jointly form a conductive circuit diagram; forming a second protection layer on the surface of the second conductive circuit diagram, wherein the second protection layer is disposed in a gapbetween the second conductive circuit diagram and the first protection layer.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with thick copper lines and a production method thereof. Background technique [0002] With the rapid development of electronic products, the printed circuit board as the support of components and the carrier of electrical signals should also gradually become miniaturized, lightweight, high-density and multi-functional, and then the production of fine lines of printed circuit boards put forward higher requirements. The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the line, so the use of thick copper to make thin lines has its own limitations; and the conductive lines of conventional printed circuit boards are usually reduced. However, limited by the thickness of copper, only thin copper can be used to make thin lines, and the etching factor...

AI Technical Summary

Problems solved by technology

The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the lines, so there are limitations in using thick copper to make thin lines; and the conductive lines of conventional printed circuit boards are usually reduced. It is a well-established method, but limited by the thickness of copper, it can only be used with thin copper for making thin lines, and the etching factor is poor after production, and the etching is not clean to form burrs

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