Radiating packaging structure and manufacturing method thereof

A technology of packaging structure and heat dissipation type, which is used in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of affecting the appearance of the package, large loss of cutting tools, and increased cost, so as to avoid the problem of burrs and cutting tools. Wear problems, the effect of reducing cutting costs
CN101110370AInactive Publication Date: 2008-01-23SILICONWARE PRECISION IND CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SILICONWARE PRECISION IND CO LTD
Publication Date
2008-01-23
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A heat dispersion encapsulation structure and its method are provided, which is characterized in that: place and connect a semiconductor wafer to a wafer bearing component; position a heat dispersion component with a interference face layer on its surface on the semiconductor wafer, so as to form a complete encapsulation glue body that wraps the semiconductor wafer and the heat dispersion component; then, cut the wafer bearing component and the encapsulation glue body according to the preset dimension of the encapsulation structure and form a bevel at the top brim of the encapsulation glue body, so as to partially expose the brim of the heat dispersion component; then, remove the encapsulation glue body on the interference face layer and form the encapsulation glue body that covers the interference face layer by keeping a spacing elevation between the encapsulation glue body and the top face of the interference face layer. Meanwhile, because the cutting path of the cutting operation does not pass the heat dispersion component, the invention is able to prevent the problem of flash and wearing of cutter due to the direct cutting of the heat dispersion component by the cutter, thus reducing the cutting cost.
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Description

technical field

[0001] The invention relates to a heat dissipation packaging structure and a manufacturing method thereof, in particular to a semiconductor packaging structure with heat dissipation parts and a manufacturing method thereof. Background technique

[0002] With the demand for thinner, thinner and smaller electronic products, semiconductor packages integrating semiconductor chips with high-density electronic components and electronic circuits have gradually become the mainstream of packaging products. However, since the semiconductor package generates high heat during operation, if the heat of the semiconductor chip is not released immediately, the accumulated heat will seriously affect the electrical function and product stability of the semiconductor chip. On the other hand, in order to prevent the internal circuit of the package from being polluted by external water and dust, the surface of the semiconductor chip must be covered with an encapsulant to insulate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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