Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

109results about How to "Simple cutting process" patented technology

Novel mining method of gently-inclined thin and medium thickness ore bodies

The invention discloses a novel mining method of gently-inclined thin and medium thickness ore bodies. According to the method, ore bodies in one stope are stoped by dividing the stope into two stope areas through steps: firstly, stoping is performed at the stope area (1) by using a pillarless sublevel caving method: the ore bodies are directly caved in single sublevel by using medium-length blastholes; a certain empty area formed after ore removal is used as a free surface for stoping of the stope area (2); then, the stoping is performed at the stope area (2) by using a blasting force carrying mining method; fan-shaped medium-length blastholes are arranged in a manner perpendicular to the ore body tendency, and are filled with powder according to sections, the decking parts are the parts from the lower disc boundaries of the ore bodies to the hole bottoms; the empty area formed during the stoping of the stope area (1) is used as a free surface for blasting row by row; ores in the stope area (2) are thrown in the empty area by using the blasting force. The method integrates the pillarless sublevel caving method and the blast force carrying mining method, so that the supporting difficulty and the workload are reduced, the operation is safer, the mining cost is low, and the labor productivity is high.
Owner:UNIV OF SCI & TECH BEIJING

Cutting equipment and cutting method of flexible thin film solar cell

The invention discloses cutting equipment of a flexible thin film solar cell. The cutting equipment comprises an uncoiling mechanism, a conveying mechanism, a scoring mechanism, a cutting mechanism, a finished product coiling mechanism, a leftover coiling mechanism and a control system, wherein the control system is used for controlling the respective work of the uncoiling mechanism, the conveying mechanism, the scoring mechanism, the cutting mechanism, the finished product coiling mechanism and the leftover coiling mechanism. The invention also discloses a method for cutting the flexible thin film solar cell by the cutting equipment. The method comprises the following steps of uncoiling a cell to be cut, receiving and conveying the cell to be cut by the conveying mechanism, sequentially scoring and cutting the cell to be cut, coiling the obtained finished product by the finished product coiling mechanism, and coiling the cut leftovers by the leftover coiling mechanism. The cutting equipment and the cutting method have the advantages that the short-circuiting of the thin film solar cell caused by cutting can be thoroughly avoided by the cutting method; the automation degree is high, and the qualified rate of the flexible thin film solar cell and the production efficiency are improved; the material consumption amount is little, and the production cost is low; and the splitting process is simple, the equipment is simple, and the operation is convenient.
Owner:普尼太阳能(杭州)有限公司

Micro-cuttage and rapid-propagation technology of sweet-scented osmanthus

ActiveCN103650816AShorten the lengthReduce the number of sectionsHorticultureGrowth hormoneCell budding
The invention belongs to the agricultural technology field, and particularly relates to a micro-cuttage and rapid-propagation technology of sweet-scented osmanthus. The micro-cuttage and rapid-propagation technology includes: selecting a plug tray of 40*40*45mm as a matrix vessel and constructing a support of covering films on the plug tray; mixing 30% of field and garden soil, 20% of plant ash, 20% of perlite and 30% of rice hull, using the mixture as a matrix, and disinfecting the matrix; selecting annual and lignified sweet-scented osmanthus branches as cuttings to be performed cuttage, and shearing the cuttings into small sections according to knot intervals, wherein each section is provided with only one bud knot and two leaves; cleaning and disinfecting the cuttings, and inserting the cuttings into the plug tray after performing glue enveloping on a section wound on each cutting; dropping growth hormone into each transplanting hole; sealing and moisturizing the plug tray. The micro-cuttage and rapid-propagation technology of the sweet-scented osmanthus greatly increases an expanding propagation multiple of cuttage propagation of the sweet-scented osmanthus by shortening the cuttings, enables survival rate of the cuttings to reach above 95% by improving the matrix of the plug tray and performing pretreatment before cuttage, and enables the rooting percentage of the cuttings to reach above 80% during one month by controlling temperature and humidity and processing the cuttings with the growth hormone.
Owner:SHENZHEN WENKE GARDENING IND

Hibiscus cuttage rapid propagation technology

ActiveCN103283459AShorten the lengthReduce the number of sectionsHorticultureHibiscusSeedling
The invention relates to a hibiscus cuttage rapid propagation technology. According to the technical scheme, the technology includes the steps that firstly, a cuttage bed is built by using perlite as matrix; secondly, a humidity control system and an automatic spray system are constructed, a spray device is controlled according to change conditions of surface humidity of the matrix, and the rooting and growing environment of cutting slips is provide and adjusted; thirdly, strong and semi-ligneous or ligneous branches which are not damaged by pests or diseases and grown in the current year or yearly are selected as cuttings, and pruning and cuttage are carried out in time; fourthly, the branches are treated by using a rooting agent to hasten rooting before cuttage is carried out; fifthly, spray equipment is started and humidity parameters are set after cuttage is carried out, automatic spray is changed into manual control after 10 days, seedlings can be lifted 25 days after cottage, the seedlings are filled into a pot and subject to hardening-off, and the seedlings are transplanted 15 days later. The hibiscus cuttage rapid propagation technology is short in propagation period of nursery stocks, low in cost input and capable of being widely applied to large-scale and industrialized landscape nursery stock development for individuals and enterprises.
Owner:SHENZHEN WENKE GARDENING IND

Direct-pushing-type numerically-controlled-lathe feeding-discharging assisting system

The invention relates to a machining device, in particular to an automatic feeding-discharging system of a numerically-controlled lathe. The direct-pushing-type numerically-controlled-lathe feeding-discharging assisting system comprises a vibrating disc, a feeding mechanism, a discharging mechanism, a linear guide rail, a lifting air cylinder and a support. The support is fixedly connected to the numerically-controlled lathe. The linear guide rail is movably connected to the support, a lifting plate is fixedly connected with the tail end of the linear guide rail, the lifting air cylinder is fixedly connected to the support, and a piston rod of the lifting air cylinder is fixedly connected with the lifting plate. The feeding mechanism is fixedly connected to the lifting plate. A technology for achieving automatic feeding and automatic discharging of the numerically-controlled lathe is disclosed. By means of the direct-pushing-type numerically-controlled-lathe feeding-discharging assisting system, clamping jaws widely used in the industry are omitted, a simpler and more durable direct-pushing type mechanism is developed, and the feeding process and the discharging process of workpieces on a chuck of the numerically-controlled lathe are achieved. Motions are accurate in the feeding process, and the speed is high in the discharging process.
Owner:湖北信友汽车零部件有限公司

Laser engraved linear array light guide plate and preparation method thereof

The invention discloses a laser engraved linear array light guide plate. The light guide plate made of an acryl flat plate comprises a reflecting layer, a light guide layer and a diffusing layer, wherein the reflecting layer is made of light reflecting materials with high reflectivity; the light guide layer is made of materials with high light transmittance; and the diffusing layer is made of light homogenizing materials. The laser engraved linear array light guide plate is characterized in that a plurality of linear arrays comprising light reflection diffusing lines engraved by a laser pulse are respectively distributed in the horizontal direction and the longitudinal direction on the light guide layer of the light guide plate, wherein the diffusing lines among the linear arrays of vertical light rays are parallel with each other and form arithmetic progression arrangement, and the linear arrays at a position of the light guide plate nearer a light source are sparser, and vice versa according to the practical requirements; and the diffusing lines among the linear arrays of parallel light rays are parallel with each other and form an equal distance. In addition, the invention also discloses a preparation method of the light guide plate. The light guide plate adopting the technical method has more even light emission and better effect.
Owner:SHANGHAI EDGE LIGHT IND

Double-emission-center cutting deep hole blasting technology

The invention discloses a double-emission-center cutting deep hole blasting technology. The double-emission-center cutting deep hole blasting technology comprises the following steps of arranging a cutting mine at an appropriate position of a cutting tunnel; confirming the long axis direction of the cutting mine and cutting a mine according to designed construction; designing and constructing middle deep holes which are formed in bilateral sides of the cutting mine with the utilization of double emission centers; confirming detonating ways of the cutting mine and performing on-line detonating. The double emission centers which are symmetrically arranged on bilateral sides of the center of the tunnel are 0.6 m far away from the tunnel center, the middle deep holes are formed with a left side emission center and a right side emission center serving as benchmarks, and 8 to 9 middle deep holes are uniformly formed according to the bottom distance of the holes. The hole diameter of the middle deep holes is 76 mm, the depth is from 6 to 17 m, the bottom distance is from 1.8 to 2.0 m, two rows of deep holes are formed inside the cutting mine, and the row interval is 1.5m. Successful application of the double-emission-center deep hole blasting technology has the advantages of cancelling cutting level tunnels, reducing cutting costs by a large margin, simplifying cutting technologies, providing technical guarantee for achieving a cutting mine and deep hole combined kerve and having strong popularization and application values.
Owner:GANSU JIU STEEL GRP HONGXING IRON & STEEL CO LTD

transforaminal puncture system

The invention relates to medical instruments, and discloses an intervertebral foramen mirror puncturing system. The intervertebral foramen mirror puncturing system comprises a one-level cannula, a two-level cannula, an opening awl, an anchor needle and a ring saw. The awl head of the opening awl is provided with a protection shoulder, the head end of the anchor needle is provided with a self-tapping thread and is blunt, the blunt head of the anchor needle is designed not to cause hurt easily when penetrating through the zygopophysis to be close to the nerve, and the bone way can be adjusted more easily and conveniently through the self-tapping thread of the head end of the anchor needle. The ring saw is used for cutting the zygopophysis from the side face by the angle by which the anchor needle enters the canalis vertebralis to expand the bone way until the diameter of the bone way is enough for an endoscope to be placed. By means of the intervertebral foramen mirror puncturing system, the puncturing process of the lumbar vertebra intervertebral foramen mirror operation is obviously simplified, operation is reliable and practical, the operation safety and the operation successful rate are improved, and the parts, exposed to the radiation, of an operator and a patient are greatly reduced.
Owner:SHANGHAI EAST HOSPITAL

A Novel Mining Method for Gently Dipping Thin-Medium Thick Orebodies

The invention discloses a novel mining method of gently-inclined thin and medium thickness ore bodies. According to the method, ore bodies in one stope are stoped by dividing the stope into two stope areas through steps: firstly, stoping is performed at the stope area (1) by using a pillarless sublevel caving method: the ore bodies are directly caved in single sublevel by using medium-length blastholes; a certain empty area formed after ore removal is used as a free surface for stoping of the stope area (2); then, the stoping is performed at the stope area (2) by using a blasting force carrying mining method; fan-shaped medium-length blastholes are arranged in a manner perpendicular to the ore body tendency, and are filled with powder according to sections, the decking parts are the parts from the lower disc boundaries of the ore bodies to the hole bottoms; the empty area formed during the stoping of the stope area (1) is used as a free surface for blasting row by row; ores in the stope area (2) are thrown in the empty area by using the blasting force. The method integrates the pillarless sublevel caving method and the blast force carrying mining method, so that the supporting difficulty and the workload are reduced, the operation is safer, the mining cost is low, and the labor productivity is high.
Owner:UNIV OF SCI & TECH BEIJING

Preparation method of metal soft magnetic powder core with low forming pressure and high production efficiency

The invention relates to a preparation method of a metal soft magnetic powder core with low forming pressure and high production efficiency, and belongs to the technical field of preparation of metal soft magnetic powder cores. The preparation method comprises the following operation steps: (1) screening iron-based powder into three levels, and taking three kinds of iron-based powder according to the mass percent to obtain powder; (2) mixing the three kinds of powder to obtain mixed powder; (3) adding epoxy resin and zinc stearate into the mixed powder, and uniformly stirring to obtain blank powder; (4) performing extrusion processing on the blank powder in a screw extruder to obtain a hollow pipe, and cutting the hollow pipe into a magnet ring green body; and (5) baking the magnet ring green body in a box-type furnace to obtain a metal soft magnetic powder core; wherein the density of the metal soft magnetic powder core ranges from 5.78 g/cm<3> to 7.20 g/cm<3>, and the magnetic conductivity ranges from 48.0 to 49.5. The forming pressure of the metal soft magnetic powder core is remarkably reduced through the particle size ratio, so that the metal soft magnetic powder core can be formed in an extrusion and cutting mode, the cost is reduced, and the production efficiency is greatly improved.
Owner:江苏瑞德磁性材料有限公司

Half-slice-laminated solar assembly and preparation method thereof

The invention provides a half-slice-laminated solar assembly and a preparation method thereof. The method comprises the following steps: S1) slicing a battery piece to obtained a sliced battery, and carrying out insulation treatment on the cutting edge by utilizing laser; S2) placing a solder strip on the sliced battery and welding the sliced battery and the solder strip together; S3) repeating the process of the S2) to obtain a plurality of sliced batteries having solder strips, and arranging and welding the plurality of sliced batteries in an overlapping manner in sequence through the solderstrips to obtain a battery string; S4) repeating the step S3) to obtain a plurality of battery strings, and arranging the plurality of battery strings according to the assembly layout to obtain a battery string assembly; S5) laying a first adhesive film layer on tempered glass, and placing the battery string assembly on the upper surface of the first adhesive film layer; S6) laying a second adhesive film layer on the upper surface of the battery string assembly, and then, placing a backboard material layer on the second adhesive film layer to obtain a laminated assembly; and S7) carrying outlamination processing on the laminated assembly, and then, carrying out package processing. The method has the advantages of simple process and firm and stable welding and the like.
Owner:河北绍博光伏科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products