Wafer stage package cutting method protecting connection pad

Abstract

The invention discloses a cutting method for protecting the wafer-level packaging of a connecting pad, which comprises forming a plurality of cavities and pre-cutting channels on the front of an upper cover wafer, wherein the depth of each pre-cutting channel is smaller than the depth of each cavity, then bonding the upper wafer and an element wafer whose surface is provided with a plurality of elements and a plurality of connecting pads, then conducting the upper wafer cutting technology, cutting through the upper cover wafer along the pre-cutting channels, removing partial upper cover wafer which is not bonded with the element wafer to expose the connecting pads, finally conducting the element wafer cutting technology to form a plurality of package tube cores.

Description

technical field

[0001] The invention relates to a cutting method for wafer-level packaging capable of protecting connection pads, in particular to a cutting method for wafer-level packaging that forms a pre-cut line on an upper cover wafer to simplify the cutting process, improve yield and protect connection pads. Background technique

[0002] The packaging of semiconductor components is an important step in its process. The so-called packaging refers to the combination of the core structures in the device. The function of packaging is to protect fragile semiconductor components (such as optical components, micro-electromechanical components, etc.) In the case of environmental damage (such as mechanical damage or particle pollution, etc.), it also takes on the functions of mechanical support and signal output or input.

[0003] The known packaging process is as follows: first, the wafer that has completed the processing process is cut and separated into individual dies, and ...

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