The invention discloses equipment, a method and a
control system for
cutting a
silicon wafer by using
a diamond wire. The
cutting equipment comprises a shaft roller,
a diamond wire, a
silicon material feeding device, a
cutting liquid main tank and the like, and the specific specification of the
diamond wire is as follows: a base material
tungsten filament
bus is 26-33 microns, the thickness of a
coating is 2-3 microns, and the number of
diamond particles is 50-200. The cutting method comprises the steps of installing the
silicon material, starting the shaft roller and the
ultrasonic device, conveying the cutting liquid and the like, and cutting is completed through circulation of the cutting liquid. The
control system comprises a user interaction module, a
data acquisition module and the like, and the functions of parameter setting, equipment driving, data storage and analysis,
remote communication and the like are achieved through cooperation of the modules. The problems that
diamond wire
thinning cutting liquid is difficult to bring in and the like are solved, the wire using amount is reduced, the cutting time is shortened, the silicon
wafer cutting efficiency and quality are improved, cost reduction and efficiency improvement are achieved, great significance is achieved for the photovoltaic
slicing link, and meanwhile the
control system ensures that the cutting process is stable and efficient.