Laser machining system and method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- BOE TECH GRP CO LTD
- Publication Date
- 2019-06-21
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Abstract
Description
technical field
[0001] The invention relates to the field of communication technology, in particular to a laser processing system and method. Background technique
[0002] Due to its excellent characteristics such as precision, process flexibility, non-contact processing type, and thermal influence on materials, laser cutting is rapidly expanding in the application field of the entire industry. The energy density of the laser beam has a maximum value at the very center of the focus point of the laser beam, and the energy density gradually decreases from the center to the outside.
[0003] Therefore, when the thickness of the workpiece to be processed is greater than the thickness of the area where the energy of the laser beam is focused, multiple times of laser processing are required to cut the workpiece to be processed. However, in the process of multiple times of laser cutting the workpiece to be processed, there is a problem that the large offset of the laser cutting li...